IP Library Granted Patent US 12,319,006
Granted Patent B2
US 12,319,006 · App. 18/173,585 · Granted Jun 3, 2025

Control systems for additive manufacturing and associated methods

Inventors: Paramjot Singh (San Jose, CA); Joanne L. Lee (San Jose, CA); Viswanath Meenakshisundaram (Santa Clara, CA)
Assignee: Align Technology, Inc.
B29C64/393B29C64/124B29C64/268B29C64/35B33Y10/00B33Y40/20B33Y50/02B29L2031/753
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Quick Facts
Patent No.
US 12,319,006
App. No.
18/173,585
Granted
Jun 3, 2025
Kind
B2
Abstract

Systems and methods for manufacturing objects are provided herein. In some embodiments, a method for producing an additively manufactured object includes applying energy to a curable material according to a set of print parameters to form a cured material layer on a build platform or on an object on the build platform. The method can also include conveying remaining material away from the build platform. The method can further include detecting, via one or more sensors, that the remaining material includes a portion of the cured material layer that has separated from the build platform or from the object. The method can subsequently include determining an adjusted set of print parameters configured to improve adhesion of cured material to the build platform or to the object.

Claims (32)

1. A method for fabricating a dental appliance, the method comprising:

applying energy to a curable material to form a cured material layer on a build platform or on an object on the build platform, wherein the object is a portion of a dental appliance;

conveying remaining curable material away from the build platform;

detecting, via one or more sensors, that the remaining curable material includes a portion of the cured material layer that has separated from the build platform or from the object; and

determining an adjustment to the energy to improve adhesion of cured material to the build platform or to the object.

2. The method of claim 1 , wherein the adjustment to the energy is configured to increase a cure depth of the cured material.

3. The method of claim 1 , wherein the adjustment comprises one or more of the following: an increased exposure time, an increased power density, or an increased energy density.

4. The method of claim 1 , further comprising applying the energy with the adjustment to the curable material to form a subsequent cured material layer on the build platform or on the object.

5. The method of claim 1 , wherein the curable material comprises a polymeric resin.

6. The method of claim 1 , wherein the remaining curable material is conveyed away from the build platform by a carrier film.

7. The method of claim 1 , wherein the one or more sensors comprise a force sensor.

8. The method of claim 7 , further comprising measuring, via the force sensor, an amount of force applied on a blade by the remaining curable material conveyed away from the build platform.

9. The method of claim 1 , wherein the one or more sensors comprise an imaging device.

10. The method of claim 9 , further comprising:

generating, via the imaging device, image data of the remaining curable material conveyed away from the build platform, and

analyzing the image data to detect the portion of the cured material layer that has separated from the build platform or from the object.

11. The method of claim 1 , wherein the dental appliance is an aligner comprising a plurality of teeth-receiving cavities.

12. The method of claim 11 , wherein the aligner is part of a series of aligners configured to reposition a patient's teeth according to an orthodontic treatment plan.

13. A method for fabricating an object comprising:

applying energy to a curable material according to a set of print parameters to form a cured material layer on a build platform or on an object on the build platform;

conveying remaining curable material away from the build platform;

detecting that a portion of the cured material layer has been conveyed away from the build platform along with the remaining curable material; and

adjusting the set of print parameters to improve adhesion of cured material to the build platform or to the object.

14. The method of claim 13 , wherein the energy comprises one or more of light energy or heat energy.

15. The method of claim 13 , wherein the detection is performed using a force sensor.

16. The method of claim 15 , further comprising measuring, via the force sensor, an amount of force applied on a blade by the remaining curable material conveyed away from the build platform.

17. The method of claim 13 , wherein the detection is performed using an imaging device.

18. The method of claim 17 , further comprising:

generating, via the imaging device, image data of the remaining curable material conveyed away from the build platform, and

analyzing the image data to detect the portion of the cured material layer that has been conveyed away from the build platform.

19. The method of claim 13 wherein adjusting the set of print parameters comprises adjusting one or more of the following: an exposure time, a power density, an energy density, or a material temperature.

20. The method of claim 13 , wherein the adjustment is configured to increase a cure depth of the cured material.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2023
From: SINGH, PARAMJOT; LEE, JOANNE L.; MEENAKSHISUNDARAM, VISWANATH
To: ALIGN TECHNOLOGY, INC.
Reel/Frame 063161/0967 →
Continuity (2)
Provisional Application 63268425 · Feb 23, 2022
Related Publication 20230264427A1 · Aug 24, 2023
References Cited (77)
US 6210162B1 · Chishti et al. · 2001 [cited by applicant]
US 6236020B1 · Friedman · 2001 [cited by applicant]
US 6497574B1 · Miller · 2002 [cited by applicant]
US 6957118B2 · Kopelman et al. · 2005 [cited by applicant]
US 6976627B1 · Culp et al. · 2005 [cited by applicant]
US 7092784B1 · Simkins · 2006 [cited by applicant]
US 7220124B2 · Taub et al. · 2007 [cited by applicant]
US 7236842B2 · Kopelman et al. · 2007 [cited by applicant]
US 7245977B1 · Simkins · 2007 [cited by applicant]
US 7261533B2 · Wrosz et al. · 2007 [cited by applicant]
US 7335024B2 · Wen · 2008 [cited by applicant]
US 7384266B2 · Wen · 2008 [cited by applicant]
US 7435084B2 · Liu et al. · 2008 [cited by applicant]
US 7472789B2 · Wu et al. · 2009 [cited by applicant]
US 7476100B2 · Kuo · 2009 [cited by applicant]
US 7481647B2 · Sambu et al. · 2009 [cited by applicant]
US 7604181B2 · Culp et al. · 2009 [cited by applicant]
US 7641828B2 · DeSimone et al. · 2010 [cited by applicant]
US 7648360B2 · Kuo · 2010 [cited by applicant]
US 7674422B2 · Kuo · 2010 [cited by applicant]
US 7711447B2 · Lu et al. · 2010 [cited by applicant]
US 7748199B2 · Sankaran et al. · 2010 [cited by applicant]
US 7802987B1 · Phan · 2010 [cited by applicant]
US 7819659B2 · Wen · 2010 [cited by applicant]
US 7831322B2 · Liu et al. · 2010 [cited by applicant]
US 7840373B2 · Culp et al. · 2010 [cited by applicant]
US 7922490B2 · Wen · 2011 [cited by applicant]
US 7957824B2 · Boronvinskih et al. · 2011 [cited by applicant]
US 8019465B2 · Spiridonov et al. · 2011 [cited by applicant]
US 8030588B2 · Culp et al. · 2011 [cited by applicant]
US 8087932B2 · Liu · 2012 [cited by applicant]
US 8636513B2 · Wen · 2014 [cited by applicant]
US 8765031B2 · Li et al. · 2014 [cited by applicant]
US 8776391B1 · Kaza et al. · 2014 [cited by applicant]
US 9108338B2 · Sirovskiy et al. · 2015 [cited by applicant]
US 9403238B2 · Culp · 2016 [cited by applicant]
US 9943386B2 · Webber et al. · 2018 [cited by applicant]
US 9943991B2 · Tanugula et al. · 2018 [cited by applicant]
US 10336102B2 · Cole · 2019 [cited by applicant]
US 10495973B2 · Cole · 2019 [cited by applicant]
US 10783629B2 · Parpara et al. · 2020 [cited by applicant]
US 10888395B2 · Kopelman · 2021 [cited by applicant]
US 11189021B2 · Shah et al. · 2021 [cited by applicant]
US 11295444B2 · Cherkas et al. · 2022 [cited by applicant]
US 11420362B2 · Mojdeh et al. · 2022 [cited by applicant]
US 11440243B1 · Joyce · 2022 [cited by applicant]
US 11511485B2 · Mojdeh et al. · 2022 [cited by applicant]
US 11534277B2 · Chavez et al. · 2022 [cited by applicant]
US 20040243361A1 · Steuben et al. · 2004 [cited by applicant]
US 20060093982A1 · Wen · 2006 [cited by applicant]
US 20060093987A1 · Wen · 2006 [cited by applicant]
US 20060093993A1 · Wen · 2006 [cited by applicant]
US 20060127850A1 · Wen · 2006 [cited by applicant]
US 20060127857A1 · Liu et al. · 2006 [cited by applicant]
US 20060127858A1 · Wen · 2006 [cited by applicant]
US 20060127859A1 · Wen · 2006 [cited by applicant]
US 20060127860A1 · Wen · 2006 [cited by applicant]
US 20060172250A1 · Wen · 2006 [cited by applicant]
US 20060199145A1 · Liu et al. · 2006 [cited by applicant]
US 20070092853A1 · Liu et al. · 2007 [cited by applicant]
US 20070168152A1 · Matov et al. · 2007 [cited by applicant]
US 20070243502A1 · Wen · 2007 [cited by applicant]
US 20080083348A1 · Kuo et al. · 2008 [cited by applicant]
US 20090148814A1 · Li et al. · 2009 [cited by applicant]
US 20180297290A1 · Eyal et al. · 2018 [cited by applicant]
US 20200078137A1 · Chen et al. · 2020 [cited by applicant]
US 20200214801A1 · Wang et al. · 2020 [cited by applicant]
US 20200290262A1 · Aguilar Mendez et al. · 2020 [cited by applicant]
US 20210030516A1 · O'Leary et al. · 2021 [cited by applicant]
US 20210170676A1 · Kitchen et al. · 2021 [cited by applicant]
US 20210276248A1 · Boehm et al. · 2021 [cited by applicant]
US 20220033552A1 · Oishi · 2022 [cited by applicant]
US 20220347932A1 · Gmeiner et al. · 2022 [cited by applicant]
WO WO2018217903 · 2018 [cited by examiner]
“3D Printing Enhanced by Vision Controlled Jetting,” https://inkbit3d.com (accessed Jan. 18, 2022). [cited by applicant]
Sekonic, “Lab-type Torsional Oscillation-type Viscometer VM-10A/100A Series”, https://www.sekonic.co.jp/english/product/viscometer/download/pdf/catalog/catalog_VM-10A.pdf, 2011, 2 pages. [cited by applicant]
Sekonic, “Vibration Type Viscometer for Lab VM-10A”, https://www.sekonic.co.jp/english/product/viscometer/vm/vm_series.html. 2020, 3 pages. [cited by applicant]
Cited By (1)
US 12,636,831