Substrates and associated materials for additive manufacturing
Substrates and associated materials for additive manufacturing are provided. In some embodiments, a device for manufacturing an object from a curable material includes a substrate configured to support the curable material during an additive manufacturing process. The substrate can be at least partially transparent to a wavelength of energy that cures the curable material. The substrate can include a first layer with a first material configured to inhibit adhesion to the curable material. The substrate can also include a second layer with a second material having one or more of increased mechanical strength or increased heat resistance relative to the first material.
1 . A device for manufacturing an object from a curable material, the device comprising:
a substrate configured to support the curable material during an additive manufacturing process, wherein the substrate comprises a surface configured to contact the curable material, wherein the substrate is at least partially transparent to a wavelength of energy that cures the curable material, and wherein the substrate comprises:
a first layer forming at least part of the surface of the substrate, the first layer comprising a first material configured to inhibit adhesion to the curable material, and
a second layer coupled to the first layer, wherein the second layer comprises a second material having a higher elastic modulus than the first material.
2 . The device of claim 1 , wherein the first material comprises a fluorinated polymer.
3 . The device of claim 2 , wherein the fluorinated polymer comprises fluorinated ethylene propylene, ethylene tetrafluoroethylene, polytetrafluoroethylene, perfluoroalkoxy alkane, polyvinylidene fluoride, polychlorotrifluoroethylene, ethylenechlorotrifluoroethylene, perfluorocycloalkene, perfluoromethylvinyl ether, perfluorosulfonic acid polymer, perfluoropolyether, or a combination thereof.
4 . The device of claim 1 , wherein the first material comprises a siloxane, a polysiloxane, a silane, or a polysilane.
5 . The device of claim 1 , wherein the second material comprises polydimethylsiloxane, polyethylene terephthalate, polyethylene terephthalate glycol, polycarbonate, polymethyl methacrylate, polyvinyl chloride, cyclic olefin copolymer, polyethylene, polypropylene, styrene methyl methacrylate, styrene acrylonitrile, acrylonitrile butadiene styrene, or a combination thereof.
6 . The device of claim 1 , wherein the second material has a higher glass transition temperature than the first material.
7 . The device of claim 1 , wherein the second material has a glass transition temperature of at least 80° C.
8 . The device of claim 1 , wherein the first layer is a coating on the second layer.
9 . The device of claim 1 , wherein the substrate is a carrier film configured to convey the curable material through a printer assembly.
10 . The device of claim 9 , wherein the carrier film comprises a first end, a second end, and a length extending between the first and second ends, and the first and second ends are coupled to each other at a connection region.
11 . The device of claim 10 , further comprising a bridge segment coupling the first end to the second end at the connection region.
12 . The device of claim 11 , wherein the bridge segment comprises one or more of the first material or the second material.
13 . The device of claim 10 , wherein the first end is coupled to the second end without a bridge segment.
14 . The device of claim 1 , wherein the first layer is in direct contact with the second layer.
15 . The device of claim 1 , wherein the substrate comprises at least one additional layer between the first layer and the second layer.
16 . The device of claim 15 , wherein the at least one additional layer comprises one or more of an adhesive layer, a barrier layer, or a compatibility layer.
17 . The device of claim 1 , wherein the surface is a first surface, and wherein the substrate comprises a second surface configured to be oriented away from the curable material.
18 . The device of claim 17 , wherein the second layer forms at least part of the second surface.
19 . The device of claim 17 , wherein the substrate comprises at least one additional layer between the second layer and the second surface, and wherein the at least one additional layer comprises one or more of an anti-slip layer or an anti-reflection layer.
20 . The device of claim 1 , wherein the second material has increased heat resistance relative to the first material.