IP Library › Granted Patent US 12,347,931
Granted Patent B2
US 12,347,931 · App. 18/177,394 · Granted Jul 1, 2025

Electronic device including antennas

Inventors: Seongjin Park (Suwon-si, KR); Yongsang Yun (Suwon-si, KR); Gunbae Lim (Suwon-si, KR); Jaebong Chun (Suwon-si, KR)
Assignee: Samsung Electronics Co., Ltd.
H01Q21/065H01Q3/2682H01Q21/24
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Quick Facts
Patent No.
US 12,347,931
App. No.
18/177,394
Granted
Jul 1, 2025
Kind
B2
Abstract

An electronic device is provided. The electronic device includes a first housing, a second housing including a first surface, a second surface, and a third surface, an antenna module including a printed circuit board (PCB) and conductive patches disposed on one surface of the PCB facing the third surface of the second housing, a conductive plate disposed between the antenna module and the third surface of the second housing, and a wireless communication circuit electrically connected to the antenna module, wherein the conductive patches may be positioned at a first height from the second surface of the second housing, wherein the conductive plate may be parallel to the second surface of the second housing and positioned at a second height lower than the first height of the conductive patches, and wherein the wireless communication circuit may be configured to supply power to the conductive patches to transmit and/or receive a signal in a frequency band of 20 gigahertz (GHz) or more.

Claims (80)

1. An electronic device comprising:

a housing including:

a first housing, and;

a second housing rotatably connected to the first housing and including:

a first face facing the first housing when the housing is folded,

a second face opposite the first face, and

a side face between the first face and the second face, wherein at least portion of the first face and the second face includes a first dielectric;

an antenna module disposed adjacent to the side face of the second housing, wherein the antenna module comprises:

a printed circuit board (PCB), and

conductive patches disposed at the PCB and positioned at a first height from the second face of the second housing;

a conductive plate disposed between the antenna module and the side face of the second housing, and positioned at a second height lower than the first height of the conductive patches;

a second dielectric disposed between the antenna module and the side face, and disposed on the conductive plate; and

a wireless communication circuit configured to supply power to the conductive patches to transmit and/or receive a signal in a frequency band of 20 gigahertz (GHz) or more via the first dielectric and the second dielectric.

2. The electronic device of claim 1 ,

wherein the signal comprises a first signal having a first polarization in a direction perpendicular to a face of the conductive plate, and

wherein the first signal is reflected by the conductive plate.

3. The electronic device of claim 2 , wherein the signal further comprises:

a second signal having a second polarization.

4. The electronic device of claim 3 ,

wherein the first polarization is perpendicular to the second polarization.

5. The electronic device of claim 1 ,

wherein the PCB has a first width in a direction parallel to an edge formed by the first face and the side face of the second housing, and

wherein the conductive plate has a second width, which is greater than the first width.

6. The electronic device of claim 1 ,

wherein the conductive plate comprises:

a first edge parallel to an edge formed by the first face and the side face of the second housing, and

a second edge perpendicular to the first edge, and

wherein a length of the second edge is greater than or equal to a specific value.

7. The electronic device of claim 1 , wherein the conductive plate is positioned within 0.5 mm from the antenna module.

8. The electronic device of claim 1 , further comprising:

a conductive structure disposed between the conductive plate and the second face of the second housing.

9. The electronic device of claim 1 , wherein the conductive plate has a rectangular shape.

10. The electronic device of claim 1 , further comprising:

a hinge structure configured to connect the first housing and the second housing such that the first housing and the second housing are rotatable about a first axis.

11. The electronic device of claim 1 , further comprising:

a support member configured to support the antenna module,

wherein the conductive plate is in contact with the support member.

12. The electronic device of claim 1 ,

wherein the conductive patches comprise a first conductive patch, a second conductive patch, a third conductive patch, and a fourth conductive patch, and

wherein the conductive patches form a 1×4 antenna array.

13. The electronic device of claim 1 , further comprising:

a keyboard disposed on the first face of the second housing.

14. The electronic device of claim 1 , further comprising:

a display coupled to the first housing,

wherein the display faces the first face of the second housing when the housing is folded.

15. An electronic device comprising:

a housing including:

a first housing, and

a second housing rotatably connected to the first housing and including

a first face facing the first housing when the housing is folded,

a second face opposite the surface face, and

a side face between the first face and the second-surface face, wherein the first face and the side face form an edge and wherein at least portion of the first face and the second face includes a first dielectric;

an antenna module disposed adjacent to the side face of the second housing,

wherein the antenna module comprises:

a printed circuit board (PCB), and

conductive patches disposed at the PCB and positioned at a first height from the second face of the second housing;

a conductive plate, wherein at least portion of the conductive plate is disposed between the antenna module and the side face of the second housing, and wherein the conductive plate is positioned at a second height lower than the first height of the conductive patches;

a second dielectric disposed between the antenna module and the side face, and disposed on the conductive plate; and

a wireless communication circuit configured to supply power to the conductive patches to transmit and/or receive a signal in a frequency band of 20 gigahertz (GHz) or more via the first dielectric and the second dielectric.

16. The electronic device of claim 15 ,

wherein the signal comprises a first signal having a first polarization in a direction perpendicular to a face of the conductive plate, and

wherein the first signal is reflected by the conductive plate.

17. The electronic device of claim 15 ,

wherein the PCB has a first width in a direction parallel to the edge, and

wherein the conductive plate has a second width, which is greater than the first width.

18. The electronic device of claim 15 ,

wherein the conductive plate comprises:

a first edge parallel to the edge, and

a second edge perpendicular to the first edge, and

wherein a length of the second edge is greater than or equal to a specific value.

19. A mobile communication device comprising:

a display disposed on a front face of the mobile communication device;

a frame structure forming a side face of the mobile communication device;

a rear cover forming at least portion of a rear face of the mobile communication device, wherein at least portion of the frame structure and the rear cover includes a first dielectric;

an antenna module disposed adjacent to the side face of the mobile communication device, wherein the antenna module comprises:

a printed circuit board (PCB), and

conductive patches disposed of at the PCB to face the side face, the conductive patches being positioned at a first height from the rear cover;

a conductive plate disposed between the antenna module and the side face of the mobile communication device, and positioned at a second height higher than the first height of the conductive patches;

a second dielectric disposed between the antenna module and the side face, and disposed on the conductive plate; and

a wireless communication circuit configured to supply power to the conductive patches transmit and/or receive a signal in a frequency band of 20 gigahertz (GHz) or more via the first dielectric and the second dielectric.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 2, 2023
From: PARK, SEONGJIN; YUN, YONGSANG; LIM, GUNBAE; CHUN, JAEBONG
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 062858/0616 →
Priority Claims (1)
KR 10-2021-0135076 · Oct 12, 2021 · national
Continuity (2)
Continuation PCTKR2022012948 · Aug 30, 2022
Related Publication 20230208047A1 · Jun 29, 2023
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