IP Library › Granted Patent US 12,249,755
Granted Patent B2
US 12,249,755 · App. 18/178,898 · Granted Mar 11, 2025

Antennaless wireless device capable of operation in multiple frequency regions

Inventors: Jaume Anguera Pros (Vinaros, ES); Aurora Andujar Linares (Barcelona, ES); Carles Puente Baliarda (Barcelona, ES); Josep Mumbru (Asnières-sur-seine, FR)
Assignee: IGNION, S.L.
H01Q1/243H01Q1/48H01Q1/50H01Q5/00H01Q5/335H01Q5/35H01Q5/50H01Q9/0407
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Quick Facts
Patent No.
US 12,249,755
App. No.
18/178,898
Granted
Mar 11, 2025
Kind
B2
Abstract

A radiating system comprises a radiating structure, first and second external ports, and a radiofrequency system. The radiating structure comprises a ground plane layer including a connection point, a single radiation booster including a connection point, and a first internal port defined between the connection points of the single radiation booster and the ground plane layer. The first and second external ports each provide operation in at least one frequency band. The radiofrequency system includes a first port connected to the first internal port of the radiating structure, and second and third ports respectively connected to the first and second external ports.

Claims (39)

1. A radiation booster for a wireless device comprising:

a geometry defined by a three-dimensional structure,

wherein the radiation booster is configured to form part of a radiating system comprising a radiofrequency system connected to the radiation booster through an internal port at a first end of the radiofrequency system, the radiofrequency system providing impedance matching for the radiating system to an external integrated circuit chip performing radiofrequency functionality in one or more operating frequency bands, the radiofrequency system being connected to the external integrated circuit chip through an external port at a second end of the radiofrequency system,

wherein the radiation booster is configured to couple electromagnetic energy from/to a ground plane layer in the one or more operating frequency bands, the ground plane layer being capable of supporting at least one radiation mode,

wherein a maximum size of the three-dimensional structure is smaller than a quarter of a longest operating wavelength within the one or more operating frequency bands, and

wherein a first lowest resonance frequency at the internal port of the radiofrequency system when the radiofrequency system is disconnected is above at least a first frequency band of operation of the radiating system.

2. The radiation booster of claim 1 , wherein the three-dimensional structure is smaller than 1/20th of the longest operating wavelength within the one or more operating frequency bands.

3. The radiation booster of claim 2 , wherein the radiation booster is configured to be mounted on a printed circuit board including the ground plane layer, and wherein no overlap exists between the ground plane layer and an orthogonal projection of the radiation booster onto a plane containing the ground plane layer.

4. The radiation booster of claim 2 , wherein the radiation booster is configured to be mounted on a printed circuit board including the ground plane layer, and wherein an overlap exists between the ground plane layer and an orthogonal projection of the radiation booster onto a plane containing the ground plane layer.

5. The radiation booster of claim 4 , wherein the overlap is less than 10% of an area of the orthogonal projection of the radiation booster onto the ground plane layer.

6. The radiation booster of claim 4 , wherein the overlap is less than 30% of an area of the orthogonal projection of the radiation booster onto the ground plane layer.

7. The radiation booster of claim 2 , wherein the first lowest resonance frequency at the internal port of the radiofrequency system when the radiofrequency system is disconnected is 1.05 times larger than a highest operating frequency of a lowest operating frequency band.

8. The radiation booster of claim 1 , wherein the three-dimensional structure is smaller than 1/30th of the longest operating wavelength within the one or more operating frequency bands.

9. The radiation booster of claim 1 , wherein the three-dimensional structure is smaller than 1/50th of the longest operating wavelength within the one or more operating frequency bands.

10. A radiating system for a wireless device, comprising:

a radiation booster;

a radiofrequency system connected to the radiation booster through an internal port at a first end of the radiofrequency system, the radiofrequency system providing impedance matching for the radiating system to an external integrated circuit chip performing radiofrequency functionality in one or more operating frequency bands, the radiofrequency system being connected to the external integrated circuit chip through an external port at a second end of the radiofrequency system,

wherein the radiation booster is configured to couple electromagnetic energy from/to a ground plane layer in the one or more operating frequency bands, the ground plane layer being capable of supporting at least one radiation mode,

wherein a maximum size of the radiation booster is smaller than a quarter of a longest operating wavelength within the one or more operating frequency bands, and

wherein a first lowest resonance frequency at the internal port of the radiofrequency system when the radiofrequency system is disconnected is above at least a first frequency band of operation of the radiating system.

11. The radiating system of claim 10 , wherein the radiation booster is smaller than 1/20th of the longest operating wavelength within the one or more operating frequency bands.

12. The radiating system of claim 11 , wherein the radiation booster is mounted on a printed circuit board including the ground plane layer, and wherein no overlap exists between the ground plane layer and an orthogonal projection of the radiation booster onto a plane containing the ground plane layer.

13. The radiating system of claim 11 , wherein the radiation booster is mounted on a printed circuit board including the ground plane layer, and wherein an overlap exists between the ground plane layer and an orthogonal projection of the radiation booster onto a plane containing the ground plane layer.

14. The radiating system of claim 10 , wherein the radiation booster is smaller than 1/30th of the longest operating wavelength within the one or more operating frequency bands.

15. A wireless device comprising:

a processing module;

a memory module;

a communication module;

a radiating system including:

a radiation booster;

a radiofrequency system connected to the radiation booster through an internal port at a first end of the radiofrequency system, the radiofrequency system providing impedance matching for the radiating system to an external integrated circuit chip performing radiofrequency functionality in one or more operating frequency bands, the radiofrequency system being connected to the external integrated circuit chip through an external port at a second end of the radiofrequency system; and

a ground plane layer capable of supporting at least one radiation mode, wherein the radiation booster couples electromagnetic energy from/to the ground plane layer in the one or more operating frequency bands,

wherein a maximum size of the radiation booster is smaller than a quarter of a longest operating wavelength within the one or more operating frequency bands, and

wherein a first lowest resonance frequency at the internal port of the radiofrequency system when the radiofrequency system is disconnected is above at least a first frequency band of operation of the radiating system.

16. The wireless device of claim 15 , wherein the radiation booster is smaller than 1/20th of the longest operating wavelength within the one or more operating frequency bands.

17. The wireless device of claim 16 , wherein the radiation booster is mounted on a printed circuit board including the ground plane layer, and wherein no overlap exists between the ground plane layer and an orthogonal projection of the radiation booster onto a plane containing the ground plane layer.

18. The wireless device of claim 16 , wherein the radiation booster is mounted on a printed circuit board including the ground plane layer, and wherein an overlap exists between the ground plane layer and an orthogonal projection of the radiation booster onto a plane containing the ground plane layer.

19. The wireless device of claim 15 , wherein the radiation booster is smaller than 1/30th of the longest operating wavelength within the one or more operating frequency bands.

20. The wireless device of claim 15 , wherein the one or more operating frequency bands include a Bluetooth band, a WiFi band, a GPS band, or a cellular frequency band.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 17, 2025
From: ANGUERA PROS, JAUME; ANDUJAR LINARES, AURORA; PUENTE BALIARDA, CARLES; MUMBRU, JOSEP
To: FRACTUS, S.A.
Reel/Frame 070867/0555 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 17, 2025
From: FRACTUS, S.A.
To: FRACTUS ANTENNAS, S.L.
Reel/Frame 070867/0701 →
Priority Claims (4)
EP 08161722 · Aug 4, 2008 · regional
EP 08172925 · Dec 24, 2008 · regional
ES ES200930444 · Jul 13, 2009 · national
ES ES200930499 · Jul 24, 2009 · national
Continuity (11)
Continuation 17507494 · Oct 21, 2021
Continuation 16941075 · Jul 28, 2020
Continuation 16275792 · Feb 14, 2019
Continuation 15927497 · Mar 21, 2018
Continuation 15131920 · Apr 18, 2016
Continuation 14257511 · Apr 21, 2014
Continuation 13530704 · Jun 22, 2012
Continuation 12669928
Provisional Application 61142523 · Jan 5, 2009
Provisional Application 61086838 · Aug 7, 2008
Related Publication 20230282963A1 · Sep 7, 2023
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