Combination RFID/EAS tags and methods of manufacture
Disclosed are combination radio frequency identification (RFID) and electronic article surveillance (EAS) tags and methods of producing such tags. The claimed method is characterized by feeding a first plurality of first type inlays and a second plurality of second type inlays into a laminating machine, wherein each of the first and second type inlays are formed on first and second substrates, respectively; laminating the first type inlays to the second type inlays, thereby forming a plurality of pairs of the first and second type inlays, each of the pairs comprising an RFID inlay and an EAS inlay, wherein the RFID inlay and the EAS inlay of each pair are functionally independent.
1. A method of producing combination radio frequency identification (RFID) and electronic article surveillance (EAS) tags, comprising the steps of:
feeding a first plurality of first type inlays and a second plurality of second type inlays into a laminating machine, wherein each of said first and second type inlays are formed on first and second substrates, respectively;
laminating said first type inlays to said second type inlays, thereby forming a plurality of pairs of said first and second type inlays physically isolated by at least one of said first and second substrates, each of said pairs comprising an RFID inlay and an EAS inlay, wherein said RFID inlay and said EAS inlay of each of said pairs are functionally independent.
2. The method recited in claim 1 , wherein said first plurality of first type inlays comprise a first common substrate and said second plurality of second type inlays comprise a second common substrate, said first and second type inlays distributed at common physical locations on said first and said second substates, respectively.
3. The method recited in claim 2 , wherein one of said first and second common substrates comprises an adhesive layer and a removable waste liner, and wherein the step of laminating said first type inlays to said second type inlays comprises removing said waste liner to expose said adhesive layer, said adhesive layer operative to bond said first common substrate and said second common substrate.
4. The method recited in claim 2 , further comprising the step of cutting said laminated first and second common substrates carrying paired ones of said RFID and EAS inlays at locations between each of said pairs, thereby forming individual combination RFID/EAS tags.
5. The method recited in claim 1 , wherein said first plurality of first type inlays is formed on a like plurality of individualized first substrates distributed on a first carrier sheet and said second plurality of second type inlays are formed on a like plurality of individualized second substrates distributed on a second carrier sheet.
6. The method recited in claim 5 , wherein the step of laminating said first type inlays to said second type inlays comprises transferring individual ones of said first type inlays from said first carrier sheet to individual ones of said second type inlays on said second carrier sheet.
7. The method recited in claim 1 , wherein each of said first type inlays is said EAS inlay comprising a coil antenna and each of said second type inlays is said RFID inlay comprising a dipole antenna having first and second legs, wherein said coil antenna of said EAS inlay is substantially positioned between said first and second legs of said dipole antenna of said RFID inlay of each of said combination RFID/EAS tags.
8. The method recited in claim 1 , further comprising the step of:
testing each of said first and second type inlays prior to the step of laminating said first type inlays to said second type inlays.
9. The method recited in claim 8 , further comprising the step of indicating defective ones of said first and second type inlays by applying a visible mark proximate to a defective inlay.
10. The method recited in claim 9 , further comprising the step of discarding ones of said combination RFID/EAS tags having said visible mark.
11. A combination radio frequency identification (RFID) and electronic article surveillance (EAS) tag, comprising:
a first substrate carrying an RFID inlay, said RFID inlay comprising an RFID antenna element and an integrated circuit coupled thereto; and,
a second substrate carrying an EAS inlay, said EAS inlay comprising an EAS antenna element;
wherein said first and second substrates are laminated together such that at least one of said first and second substrates physically isolates said RFID inlay from said EAS inlay, and wherein said RFID inlay is functionally independent from said EAS inlay.
12. The combination RFID and EAS tag recited in claim 11 , wherein said RFID antenna element comprises a dipole antenna having first and second legs and said EAS inlay comprises a coil antenna, wherein the coil antenna of said EAS inlay is substantially positioned between said first and second legs of the dipole antenna of said RFID inlay from a perspective perpendicular to said first and second substrates.
13. The combination RFID and EAS tag recited in claim 11 , wherein each of said first and second legs of said dipole antenna comprise folded-back portions for tuning said dipole antenna to a desired operational frequency.
14. The combination RFID and EAS tag recited in claim 11 , wherein a center portion of said dipole antenna and said first and second legs form a “U” shape.
15. The combination RFID and EAS tag recited in claim 11 , wherein said RFID antenna element is operational at ultra-high frequencies (UHF).
16. The combination RFID and EAS tag recited in claim 11 , wherein said first and second substrates have identical lengths and widths.
17. The combination RFID and EAS tag recited in claim 11 , wherein there is no overlap of said RFID antenna element of said RFID inlay and said EAS antenna element of said EAS inlay.