Two-phase immersion cooling
An immersion cooling system includes a fluid-retaining container having space for accommodating an electronic device. A heat transfer fluid is in contact with the electronic device. A heat exchanger contacts and condenses vapor from vaporization of the heat transfer fluid. The heat transfer fluid has a thermal conductivity higher than 0.08 W m −1 K −1 , a dielectric constant (D k ) 20-40 GHz less than 3.0, and a heat of vaporization higher than 150 kJ kg −1 , with fire retarding features, compatibility with plastics, metals, rubbers and includes a partially fluorinated compound. The improved immersion cooling system includes fluids with increased thermal conductivity and heat of vaporization while reducing fluid density and maintaining the advantages of the fluid being non-flammable, having high electrical stability and a low dielectric constant.
1 . An immersion cooling system comprising:
a fluid-retaining container having space for accommodating an electronic device;
a heat transfer fluid positioned in the container such that the electronic device is in contact with the heat transfer fluid;
a heat exchanger communicating with the fluid-retaining container such that vapor from vaporization of the heat transfer fluid contacts the heat exchanger;
the heat transfer fluid having a thermal conductivity higher than 0.08 W m −1 K −1 , a dielectric constant (D k ) at 20-40 GHz less than 3.0, a heat of vaporization higher than 150 kJ kg −1 and including a compound of formula (I) with elemental wt. % of fluorine atoms of less than 65%:
wherein X 1 , X 2 and X 3 are independently selected from hydrogen, deuterium, halogen, —CH 3 , —CF 3 , —CHF 2 , —CH 2 F, —OCH 3 , —OCF 3 , —OCH 2 CH 3 , —OCH 2 CF 3 , —OCF 2 CF 3 , —CH 2 CF 3 , —CF 2 CF 3 , —CH 2 CF 2 CF 3 , —CF 2 CF 2 CF 3 , —OCH 2 CF 2 CF 3 , —CH 2 CH 2 CF 3 ;
R 1 is selected from hydrogen, deuterium, halogen, C1-C10 alkyl, C3-C8 cycloalkyl, C2-C6 alkenyl, C3-C6 cycloalkenyl, C5-C7 (hetero)alkyl, C2-C6 alkyl ether, each of which is unsubstituted or substituted by one or more fluorine atoms.
2 . The immersion cooling system of claim 1 , wherein at least one of X 1 , X 2 and X 3 is selected from hydrogen or deuterium and at least one of X 1 , X 2 and X 3 is selected from —CF 3 .
3 . The immersion cooling system of claim 1 , wherein R 1 is selected from a C1-C10 straight or branched chain alkyl group with or with substitution by one or more fluorine atoms.
4 . The immersion cooling system of claim 1 , wherein R 1 is selected from —CH 3 , —CF 3 , —CH 2 CH 3 or —CH 2 CF 3 .
5 . The immersion cooling system of claim 1 , wherein a total number of fluorinated carbons in formula (I) is less than or equal to 3.
6 . The immersion cooling system of claim 1 , wherein the boiling point of the heat transfer fluid ranges from 50° C. to 100° C.
7 . The immersion cooling system of claim 1 , wherein the heat transfer fluid is non-flammable and possess no flash point.
8 . The immersion cooling system of claim 1 , wherein the density of the heat transfer fluid is less than 1450 kg m −3 .
9 . The immersion cooling system of claim 1 , wherein the heat transfer fluid further comprises a density-reducing agent having a density less than 1200 kg m −3 in an amount less than or equal to 50 percent by weight.
10 . The immersion cooling system of claim 9 , wherein the density-reducing agent is selected from diethyl ether, petroleum ether, tetrahydrofuran, hexane, heptane, octane, cyclohexane, diglyme, 2-butanone, ethyl acetate, ethyl propionate, methyl propionate, hexane, heptane, octene, or dimethyl carbonate.
11 . The immersion cooling system of claim 1 , wherein the heat transfer fluid further comprises a flame retardant in an amount less than or equal to 50 percent by weight.
12 . The immersion cooling system of claim 11 , wherein coolant vapor extinguishes fire within 5 seconds.
13 . The immersion cooling system of claim 11 , wherein the flame retardant is selected from 1,1,1,2,3,3,3-heptafluoropropane, 1,1,1,2,2-pentafluoroethane, bromochlorodifluoromethane, bromotrifluoromethane, perfluoro (2-methyl-3-pentanone), perfluoro (2,4-dimethyl-3-pentanone), heptafluoro-1-methoxpropane, methyl nonafluoroisobutyl ether, ethyl nonafluoroisobutyl ether, 3-methoxyperfluoro (2-methylbutane), 1,1,1,2,2,3,4,5,5,5-decafluoro-3-methoxy-4-(trifluoromethyl) pentane, perfluoro (4-methylpent-2-ene), trimethyl phosphate, triethyl phosphate, tripropyl phosphate, tributyl phosphate, triphenyl phosphate, trixylyl phosphate, or tris(1-chloro-2-propyl)phosphate.
14 . The immersion cooling system of claim 1 , wherein the heat transfer fluid includes the compound of formula (I) in an amount from 25 to 80 wt. % based on the total weight of the heat transfer fluid.
15 . The immersion cooling system of claim 1 , wherein the heat transfer fluid includes the compound of formula (I) in an amount from 50 to 70 wt. %, based on the total weight of the heat transfer fluid.
16 . The immersion cooling system of claim 1 , wherein the compound of formula (I) is compatible with plastics, metals and rubbers of electronic components cooled by the immersion cooling system.
17 . The immersion cooling system of claim 16 , wherein the plastics are one or more of epoxy, ABS resin, PP, PE, PC, PTFE or FR-4.
18 . The immersion cooling system of claim 16 , wherein the metals are one or more of copper, navy copper, Cupronickel, 304 stainless steel, 316 stainless steel, 6061 aluminum alloys, H68 brass, H62 brass, H59 brass, L245 alloy, lead tin alloys, or tin copper alloys.
19 . The immersion cooling system of claim 16 , wherein the rubber is one or more of silicone-based rubbers, nitrile rubbers, fluoro-rubbers, neoprene, EPDM, hydrogenated nitrile rubbers or polyurethane-based rubbers.