IP Library › Granted Patent US 11,983,931
Granted Patent B2
US 11,983,931 · App. 18/190,485 · Granted May 14, 2024

Image capturing device and vehicle control system

Inventor: Ryoji Eki (Kanagawa, JP)
Assignee: Sony Semiconductor Solutions Corporation
G06V20/56G06F18/213G06N3/08G06V10/10G06V10/12G06V10/20G06V10/22G06V10/25G06V10/82G06V10/955G06V20/693G06V40/166H04N23/51H04N23/61H04N23/661H04N23/71H04N25/40H04N25/79G06V20/58G06V40/103G06V40/161H04N23/555H04N25/00
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Quick Facts
Patent No.
US 11,983,931
App. No.
18/190,485
Granted
May 14, 2024
Kind
B2
Abstract

Fabrication processing is executed in a chip of an image sensor. An image capturing device includes an image capturing unit ( 11 ) mounted on a vehicle and configured to generate image data by performing image capturing of a peripheral region of the vehicle, a scene recognition unit ( 214 ) configured to recognize a scene of the peripheral region based on the image data, and a drive control unit ( 12 ) configured to control drive of the image capturing unit based on the scene recognized by the scene recognition unit.

Claims (19)

1. An imaging device mounted on a vehicle, the imaging device comprising:

a pixel array; and

circuitry configured to:

generate first image data by performing image capturing of a peripheral region of the vehicle;

calculate illuminance in the peripheral region based on the first image data;

generate a control signal;

recognize a scene of the peripheral region based on the first image data and the control signal;

generate image data having a first resolution when the calculated illuminance exceeds a predetermined threshold; and

generate image data having a second resolution when the calculated illuminance does not exceed the predetermined threshold, wherein the second resolution is lower than the first resolution.

2. The imaging device according to claim 1 , wherein the circuitry is configured to:

execute signal processing on the first image data; and

calculate the illuminance in the peripheral region based on the first image data on which the signal processing is executed.

3. The imaging device according to claim 2 , wherein the circuitry is configured to:

output the first image data on which the signal processing is executed.

4. The imaging device according to claim 1 , wherein:

the pixel array is disposed in a first substrate, and

the circuitry is disposed in a second substrate laminated on the first substrate.

5. The imaging device according to claim 1 , wherein:

the pixel array comprises a plurality of pixels arrayed in a matrix of rows and columns.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 29, 2023
From: EKI, RYOJI
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 064115/0214 →
Priority Claims (3)
JP 2018-144173 · Jul 31, 2018 · national
JP 2019-139196 · Jul 29, 2019 · national
JP 2019-140197 · Jul 30, 2019 · national
Continuity (2)
Continuation 17263116
Related Publication 20230234503A1 · Jul 27, 2023