Method of manufacturing tsemiconductor device having bonding structure
A semiconductor device and method for manufacturing the same are provided. The semiconductor device includes a substrate, a bonding structure, a bit line, and a word line. The bonding structure is disposed on the substrate. The bit line is disposed on the bonding structure. The channel layer is disposed on the bit line. The word line surrounds the channel layer. The bonding structure includes a dielectric material.
1. A method of manufacturing a semiconductor device, comprising:
providing a first substrate;
forming a first dielectric layer on the first substrate; providing a second substrate, the second substrate comprising a metallization layer over the second substrate; forming a second dielectric layer over the metallization layer;
bonding the first dielectric layer and the second dielectric layer to form a bonding structure between the first substrate and the second substrate;
patterning the second substrate to form a stackstructure over the bonding structure; patterning the metallization layer to form a bit line over the bonding structure; and
forming a word line on a lateral surface of the stack structure; wherein a conductive feature is formed on the first substrate, and the first dielectric layer is formed on the conductive feature, and wherein the conductive feature is spaced apart from the bit line by the bonding structure.
2. The method of claim 1 , wherein the second substrate comprises a support part and a transfer part, and the method further comprises removing the support part from the transfer part after the bonding structure is formed.
3. The method of claim 2 , wherein the transfer part of the second substrate comprises a first doped region with a first conductive type and a second doped region with a second conductive type different from the first conductive type.
4. The method of claim 3 , wherein a portion of the first doped region is exposed by the word line, and the second doped region is completely covered by the word line.
5. The method of claim 1 , wherein the first dielectric layer is formed by a deposition technique.
6. The method of claim 1 , wherein the second dielectric layer is formed by a deposition technique.
7. The method of claim 1 , wherein an alignment feature is formed over the first substrate, and the alignment feature is configured to align the first substrate and the second substrate when bonding the first dielectric layer and the second dielectric layer.
8. The method of claim 7 , further comprising:
dicing the first substrate to remove the alignment feature.
9. A method of manufacturing a semiconductor device, comprising:
providing a first substrate;
forming a conductive feature over the first substrate;
forming a first dielectric layer on the conductive feature;
providing a second substrate, the second substrate comprising a support part and a transfer part;
forming a metallization layer on the transfer part of the second substrate;
forming a second dielectric layer on the metallization layer;
bonding the first dielectric layer and the second dielectric layer;
removing the support part of the second substrate;
patterning the transfer part of the second substrate to form a channel layer;
patterning the metallization layer to form a bit line; and
forming a word line surrounding the channel layer;
wherein the second substrate further comprises a detach part between the support part and the transfer part, and the method further comprises removing the detach part of the second substrate.
10. The method of claim 9 , wherein an alignment feature is formed over the first substrate, and the alignment feature is configured to align the first substrate and the second substrate when bonding the first dielectric layer and the second dielectric layer.
11. The method of claim 10 , wherein patterning the transfer part of the second substrate comprises removing the transfer part over the alignment feature.
12. The method of claim 9 , further comprising forming a capacitor over the channel layer.
13. The method of claim 9 , further comprising forming a conductive plug penetrating the first dielectric layer and the second dielectric layer.