IP Library Granted Patent US 12,617,686
Granted Patent B2
US 12,617,686 · App. 18/214,324 · Granted May 5, 2026

Vapor deposition apparatus and techniques using high purity polymer derived silicon carbide

Inventor: Mark S. Land (Houston, TX)
Assignee: Pallidus, Inc.
C01B32/956C01B32/977C04B35/515C04B35/56C04B35/5603C04B35/571C04B35/80C08G77/20C08G77/50C08L83/04C23C14/0635C30B25/02C30B29/36C04B2235/3418C04B2235/3826C04B2235/3895C04B2235/44C04B2235/48C04B2235/483C04B2235/528C04B2235/5427C04B2235/5436C04B2235/6581C04B2235/72C04B2235/77C04B2235/94C04B2235/96C08G77/12C08G77/80
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Quick Facts
Patent No.
US 12,617,686
App. No.
18/214,324
Granted
May 5, 2026
Kind
B2
Abstract

Organosilicon chemistry, polymer derived ceramic materials, and methods. Such materials and methods for making polysilocarb (SiOC) and Silicon Carbide (SIC) materials having 3-nines, 4-nines, 6-nines and greater purity. Vapor deposition processes and articles formed by those processes utilizing such high purity SiOC and SiC.

Claims (24)

1 . A method of making a boule for the production of a silicon carbide wafer, having a diameter of from about 6 inches to about 10 inches, the wafer characterized with properties comprising: a dopant and a thickness of about 300 to 800 μm; the method comprising the steps of:

forming a vapor from a doped polymer derived ceramic SiC starting material;

wherein the doped polymer derived ceramic SiC starting material comprises a dopant held by a polymer derived ceramic SiC material;

wherein the doped polymer derived ceramic SiC starting material has a purity of at least about 5 nines;

depositing the vapor on a seed crystal to form a boule; and,

providing the boule to a wafer manufacturing process.

2 . The method of claim 1 , wherein the dopant comprises vanadium.

3 . The method of claim 1 , wherein the dopant consists essentially of vanadium.

4 . The method of claim 1 , wherein the dopant comprises aluminum.

5 . The method of claim 1 , wherein the dopant consists essentially of aluminum.

6 . The method of claim 1 , wherein the dopant comprises boron.

7 . The method of claim 1 , wherein the dopant consists essentially of boron.

8 . The method of claim 1 , wherein the dopant comprises phosphorus.

9 . The method of claim 1 , wherein the dopant consists essentially of phosphorus.

10 . The method of claim 1 , wherein the dopant comprises nitrogen.

11 . The method of claim 1 , wherein the dopant consists essentially of nitrogen.

12 . The method of claim 1 , wherein the wafer is a semi-insulating wafer.

13 . The method of claim 1 , wherein the wafer is an n-type wafer.

14 . The method of claim 1 , wherein the wafer is a p-type wafer.

15 . The method of claim 4 or 6 , wherein the wafer is a p-type wafer.

16 . The method of claim 1, 2 or 3 , wherein the wafer is further characterized with a property comprising an RT greater than or equal to 1E5 Ω·cm.

17 . The method of claim 1, 12, 13 or 14 , wherein the wafer is further characterized with a property comprising orientation: <0001>±0.5° or less.

18 . The method of claim 1, 12, 13 or 14 , wherein the wafer is further characterized with a property comprising a micropipe density of <10 cm-2.

19 . The method of claim 1, 12, 13 or 14 , wherein the wafer is further characterized with a property comprising a Bow/Warp/TTV <45 μm.

Assignments (1)
SECURITY INTEREST Recorded Jan 10, 2025
From: PALLIDUS, INC.
To: R&R PALLIDUS HOLDINGS II LLC, AS ADMINISTRATIVE AGENT
Reel/Frame 069818/0486 →
Continuity (7)
Continuation 17000552 · Aug 24, 2020
Continuation 15275055 · Sep 23, 2016
Continuation In Part 14864125 · Sep 24, 2015
Provisional Application 62232355 · Sep 24, 2015
Provisional Application 62055461 · Sep 25, 2014
Provisional Application 62055497 · Sep 25, 2014
Related Publication 20240190710A1 · Jun 13, 2024
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