IP Library › Granted Patent US 12,721,222
Granted Patent B2
US 12,721,222 · App. 18/220,768 · Granted Aug 25, 2026

Semiconductor package structure, fabrication method and memory system

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Quick Facts
Patent No.
US 12,721,222
App. No.
18/220,768
Filed
Jul 11, 2023
Granted
Aug 25, 2026
Kind
B2
Art Unit
2817
USPC
257/777
Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 11, 2023
From: ZENG, XINRU; CHEN, PENG
To: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
Reel/Frame 064218/0211 →
Priority Claims (1)
CN 202310347954.9 · Apr 3, 2023 · national
Continuity (1)
Related Publication 20240332269A1 · Oct 3, 2024
References Cited (1)
US 20210210397A1 · Kang · 2021 [cited by examiner]