Integrated semiconductor die vessel processing workstations

1. A workstation, comprising:

a disassembly station configured to receive a die vessel, determine whether the die vessel comprises a first type of die vessel or a second type of die vessel, and disassemble multiple parts of the die vessel when the die vessel comprises the first type of die vessel; and

a weight sensor configured to measure a weight of the die vessel, and wherein the disassembly station determines whether the die vessel comprises the first or second type of die vessel based on an output of the weight sensor.

2. The workstation of claim 1 , further comprising a conveyor configured to move the die vessel to a pass output port or a fail output port based on whether the die vessel is identified as passing an inspection when the die vessel comprises either the first type of die vessel or the second type of die vessel.

3. The workstation of claim 2 , wherein the pass output port is capable of interfacing with an automated material handling system.

4. The workstation of claim 2 , further comprising an inspection station configured to inspect one or more parts of the die vessel to determine whether the die vessel is identified as passing inspection.

5. The workstation of claim 4 , further comprising an assembly station configured to assemble the multiple parts after inspection of the die vessel when the die vessel is determined to comprise the first type of die vessel.

6. The workstation of claim 5 , further comprising:

a drying station configured to dry the multiple parts.

7. The workstation of claim 6 , wherein

the conveyor is configured to move the one or more parts of the die vessel from the disassembly station, to a cleaning station, to the drying station, to the inspection station and to the assembly station.

8. A system, comprising:

a die vessel configured to secure a semiconductor die;

a disassembly station configured to receive the die vessel, determine whether the die vessel comprises a first type of die vessel or a second type of die vessel, and disassemble multiple parts of the die vessel when the die vessel comprises the first type of die vessel;

a conveyor configured to move the one or more parts of the die vessel between the disassembly station and at least one other station, wherein the conveyor is configured to move the one or more parts of the die vessel to a pass output port or a fail output port based on whether the one or more parts of the die vessel is identified as passing an inspection when the die vessel comprises either the first type of die vessel or the second type of die vessel; and

a weight sensor configured to measure a weight of the die vessel, and wherein the disassembly station determines whether the die vessel comprises the first or second type of die vessel based on an output of the sensor.

9. The system of claim 8 , further comprising an inspection station configured to inspect the die vessel to determine a distance between two pins on the die vessel.

10. The system of claim 9 , wherein the conveyor is configured to move the die vessel to the fail output port in response to the distance between the two pins not being a predetermined distance apart.

11. The system of claim 9 , wherein the inspection station is configured to inspect the die vessel for warpage.

12. The system of claim 11 , wherein the conveyor is configured to move the die vessel to the fail output port in response to the warpage being at or more than a predetermined threshold across the die vessel.

13. The system of claim 9 , further comprising a cleaning station configured to clean the one or more parts of the die vessel before inspection by the inspection station.

14. The system of claim 8 , wherein the conveyor is a conveyor belt.

15. The system of claim 14 , wherein the conveyor belt comprises a cleaning station portion and an inspection station portion that are physically separated from each other.

16. A workstation, comprising:

a disassembly station configured to receive a die vessel, determine whether the die vessel comprises a first type of die vessel or a second type of die vessel, and disassemble multiple parts of the die vessel when the die vessel comprises the first type of die vessel;

a weight sensor configured to measure a weight of the die vessel, and wherein the disassembly station determines whether the die vessel comprises the first or second type of die vessel based on an output of the sensor;

a cleaning station configured to clean one or more parts of the die vessel;

an inspection station configured to inspect the one or more parts of the die vessel after cleaning to determine whether the die vessel is identified as passing inspection; and

a conveyor configured to move the one or more parts of the die vessel between the disassembly station, the cleaning station and the inspection station.

17. The workstation of claim 16 , wherein the conveyor is configured to move the one or more parts of the die vessel to a pass output port or a fail output port based on whether the one or more parts of the die vessel is identified as passing inspection.

18. The workstation of claim 16 , further comprising:

an assembly station configured to assemble the multiple parts after inspection of the die vessel when the die vessel is determined to comprise the first type of die vessel; and

a drying station configured to dry the one or more parts of the die vessel,

wherein the conveyor is configured to move the one or more parts of the die vessel from the disassembly station, to the cleaning station, to the drying station, to the inspection station and to the assembly station.

19. The workstation of claim 16 , further comprising an image sensor configured to capture an image of the die vessel.

20. The workstation of claim 16 , wherein the conveyor comprises a conveyor belt.