Method for making semiconductor device including a superlattice and enriched silicon 28 epitaxial layer
A method for making a semiconductor device may include forming a first single crystal silicon layer having a first percentage of silicon 28, and forming a superlattice above the first single crystal silicon layer. The superlattice may include a plurality of stacked groups of layers, with each group of layers comprising a plurality of stacked base silicon monolayers defining a base silicon portion, and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base silicon portions. The method may further include forming a second single crystal silicon layer above the superlattice having a second percentage of silicon 28 higher than the first percentage of silicon 28.
1. A method for making a semiconductor device comprising:
forming a superlattice adjacent a first single crystal silicon layer having a first percentage of silicon 28, the superlattice comprising a plurality of stacked groups of layers, each group of layers comprising a plurality of stacked base silicon monolayers defining a base silicon portion, and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base silicon portions; and
forming a second single crystal silicon layer adjacent the superlattice on a side thereof opposite the first single crystal silicon layer, the second single crystal silicon layer having a second percentage of silicon 28 higher than the first percentage of silicon 28.
2. The method of claim 1 wherein the first percentage of silicon 28 is less than 93 percent.
3. The method of claim 1 wherein the second percentage of silicon 28 is greater than 95 percent.
4. The method of claim 1 wherein the second percentage of silicon 28 is greater than 99 percent.
5. The method of claim 1 further comprising forming a third single crystal silicon layer between the first single crystal silicon layer and the superlattice and having a third percentage of silicon 28 higher than the first percentage of silicon 28.
6. The method of claim 1 further comprising forming a third single crystal silicon layer between the superlattice and the second single crystal silicon layer.
7. The method of claim 1 wherein the superlattice comprises a first superlattice adjacent the first single crystal silicon layer; and further comprising:
forming a third single crystal silicon layer adjacent the first superlattice on a side thereof opposite the first single crystal silicon layer; and
forming a second superlattice adjacent the third single crystal silicon layer on a side thereof opposite the first superlattice.
8. The method of claim 1 wherein the superlattice contacts the first single crystal silicon layer, and the second single crystal silicon layer contacts the superlattice.
9. The method of claim 1 wherein the first single crystal silicon layer has a first thickness and the second single crystal silicon layer has a second thickness less than the first thickness.
10. The method of claim 1 further comprising forming at least one circuit device associated with the second single crystal silicon layer.
11. The method of claim 10 wherein the at least one circuit device comprises a plurality of quantum bit devices.
12. The method of claim 10 wherein forming the at least one circuit device comprises:
forming spaced apart source and drain regions associated with the second single crystal silicon layer defining a channel therebetween; and
forming a gate comprising a gate dielectric layer overlying the channel and a gate electrode overlying the gate dielectric layer.
13. The method of claim 1 wherein the at least one non-semiconductor monolayer comprises oxygen.
14. A method for making a semiconductor device comprising:
forming a superlattice adjacent a first single crystal silicon layer having a first percentage of silicon 28 less than 93 percent, the superlattice comprising a plurality of stacked groups of layers, each group of layers comprising a plurality of stacked base silicon monolayers defining a base silicon portion, and at least one oxygen monolayer constrained within a crystal lattice of adjacent base silicon portions; and
forming a second single crystal silicon layer adjacent the superlattice on a side thereof opposite the first single crystal silicon layer, the second single crystal silicon layer having a second percentage of silicon 28 higher than 95 percent.
15. The method of claim 14 wherein the second percentage of silicon 28 is greater than 99 percent.
16. The method of claim 14 further comprising forming a third single crystal silicon layer between the first single crystal silicon layer and the superlattice and having a third percentage of silicon 28 higher than the first percentage of silicon 28.
17. The method of claim 14 further comprising forming a third single crystal silicon layer between the superlattice and the second single crystal silicon layer.
18. The method of claim 14 wherein the superlattice comprises a first superlattice above the first single crystal silicon layer; and further comprising:
forming a third single crystal silicon layer adjacent the first superlattice on a side thereof opposite the first single crystal silicon layer; and
forming a second superlattice adjacent the third single crystal silicon layer on a side thereof opposite the first superlattice.
19. The method of claim 14 wherein the superlattice contacts the first single crystal silicon layer, and the second single crystal silicon layer contacts the superlattice.
20. A method for making a semiconductor device comprising:
forming a superlattice adjacent a first single crystal silicon layer having a first percentage of silicon 28, the superlattice comprising a plurality of stacked groups of layers, each group of layers comprising a plurality of stacked base silicon monolayers defining a base silicon portion, and at least one oxygen monolayer constrained within a crystal lattice of adjacent base silicon portions;
forming a second single crystal silicon layer adjacent the superlattice on a side thereof opposite the first single crystal silicon layer, the second single crystal silicon layer having a second percentage of silicon 28 higher than the first percentage of silicon 28; and
forming at least one circuit device associated with the second single crystal silicon layer.
21. The method of claim 20 wherein the first percentage of silicon 28 is less than 93 percent, and the second percentage of silicon 28 is greater than 95 percent.
22. The method of claim 20 further comprising forming a third single crystal silicon layer between the first single crystal silicon layer and the superlattice and having a third percentage of silicon 28 higher than the first percentage of silicon 28.
23. The method of claim 20 further comprising forming a third single crystal silicon layer between the superlattice and the second single crystal silicon layer.
24. The method of claim 20 wherein the superlattice comprises a first superlattice above the first single crystal silicon layer; and further comprising:
forming a third single crystal silicon layer adjacent the first superlattice on a side thereof opposite the first single crystal silicon layer; and
forming a second superlattice adjacent the third single crystal silicon layer on a side thereof opposite the first superlattice.
25. The method of claim 20 wherein the superlattice contacts the first single crystal silicon layer, and the second single crystal silicon layer contacts the superlattice.
26. The method of claim 20 wherein the at least one circuit device comprises a plurality of quantum bit devices.
27. The method of claim 20 wherein forming the at least one circuit device comprises:
forming spaced apart source and drain regions associated with the second single crystal silicon layer defining a channel therebetween; and
forming a gate comprising a gate dielectric layer overlying the channel and a gate electrode overlying the gate dielectric layer.