ONE COMPONENT THERMALLY CONDUCTIVE AMBIENT TEMPERATURE CURABLE MATERIALS
A moisture-curable thermally conductive material is provided in a one-component dispensable form and curable in situ. The material is formed from a non-silicone resin and exhibits a thermal conductivity of at least 1.0 W/m*K to effectively dissipate thermal energy from an electronic component heat source. The material is dispensable from a single-component dispensing system and is stable in storage.
1 . A moisture-curable thermally conductive material, comprising:
a non-silicone resin including a reactive silyl group;
thermally conductive particulate filler; and
a diluent having a viscosity of less than 1000 cP at 25° C.,
wherein the thermally conductive material exhibits a thermal conductivity of at least 1.0 W/m*K and a pre-cured viscosity of more than 300 Pa*s at 1 s −1 and 25° C. and less than 300 Pa*s at 1500 s −1 and 25° C., and is curable in less than 72 hours at 25° C. in the presence of water to a hardness of less than 80 Shore OO at 25° C.
2 . The moisture-curable thermally conductive material of claim 1 being dispensable as a coherent mass through an orifice.
3 . The moisture-curable thermally conductive material of claim 1 , including a catalyst selected for facilitating condensation-type cross-linking of the non-silicone resin.
4 . The moisture-curable thermally conductive material of claim 3 , wherein the catalyst includes an organotin or an organobismuth compound.
5 . The moisture-curable thermally conductive material of claim 3 , including a thickening agent.
6 . The moisture-curable thermally conductive material of claim 3 , including a water scavenger.
7 . The moisture-curable thermally conductive material of claim 5 , including:
less than 20 wt % of the non-silicone resin including the reactive silyl group;
from 60-95 wt % of the thermally conductive particulate filler;
less than 20 wt % of the diluent;
less than 1 wt % of the thickening agent; and
less than 0.5 wt % of the catalyst.
8 . The moisture-curable thermally conductive material of claim 7 wherein the presence of water includes about 0.1 wt % water.
9 . The moisture-curable thermally conductive material of claim 8 wherein the reactive silyl group includes one or more of dimethoxysilane, trimethoxysilane, and triethoxysilane.
10 . The moisture-curable thermally conductive material of claim 8 wherein the non-silicone resin includes a flexible backbone, including polyether or polyacrylate.
11 . The moisture-curable thermally conductive material of claim 9 being curable in less than 24 hours at 25° C. in the presence of water.
12 . The moisture-curable thermally conductive material of claim 10 wherein the diluent has a viscosity of less than 200 cP at 25° C.
13 . An electronic apparatus, comprising:
an electronic component; and
the moisture-curable thermally conductive material of claim 1 thermally coupled to the electronic component.
14 . The electronic apparatus of claim 12 , wherein the moisture-curable thermally conductive material is coated on the electronic component.
15 . A method for forming a thermal interface on a surface, the method comprising:
(a) providing in a single container as a one-part dispensable mass:
(i) a non-silicone resin including a reactive silyl group;
(ii) thermally conductive particulate filler; and
(iii) a diluent,
wherein the dispensable mass exhibits a viscosity of more than 300 Pa*s at 1 s −1 and 25° C., and less than 300 Pa*s at 1500 s −1 and 25° C.;
(b) dispensing at least part of the dispensable mass through an orifice onto the surface; and
(c) curing the resin in the presence of water to form the thermal interface with a thermal conductivity of at least 1.0 W/m*K and a hardness of less than 80 Shore OO.
16 . The method for forming a thermal interface as in claim 15 wherein the thermal interface exhibits a hardness of at least 50 Shore OO.
17 . The method for forming a thermal interface as in claim 15 wherein the silyl group includes at least one hydrolyzable group on the silicon atom.