Audio systems, devices, mems microphones, and methods thereof
View Patent ↗In one embodiment, a MEMS microphone can be coupled to an acoustic horn to provide various benefits and improvements including, but not limited to, at-a-distance acoustic signal reception with improvements in signal-to-noise ratio and directional preference.
1. An audio system, comprising:
a MEMS microphone package, wherein the MEMS microphone package comprises a substrate having a first surface and a second surface opposite the first surface, and wherein the substrate also comprises a port hole extending through the substrate from the first surface to the second surface;
a pressure-sensitive diaphragm within the MEMS microphone package;
an acoustic horn coupled to the second surface of the substrate, wherein the acoustic horn comprises a throat opening, a mouth opening, an interior surface forming an acoustic channel extending between the mouth opening and the throat opening, and wherein the second surface of the substrate, and the port hole, overlay at least a portion of the acoustic channel from the throat opening to the mouth opening, wherein the interior surface of the acoustic horn forms a parabolic surface, wherein the cross-sectional area defined by the acoustic horn increases along the length of the acoustic horn from the throat opening to the mouth opening, and wherein the acoustic horn comprises a silicone material.
2. The audio system of claim 1 , wherein a portion of the acoustic channel extending from the throat opening of the acoustic horn to the mouth opening of the acoustic horn, extends substantially perpendicular to the second surface of the substrate.
3. The audio system of claim 2 , wherein a portion of the acoustic channel includes at least one bend.
4. The audio system of claim 1 , wherein the cross-sectional area defined by the acoustic horn increases in a stepped manner along at least a portion of the length of the acoustic horn from the throat opening to the mouth opening.
5. The audio system of claim 1 , wherein the acoustic horn is integral with the substrate.
6. The audio system of claim 1 , wherein the acoustic horn is configured to substantially amplify sound frequencies above the audible frequencies.
7. The audio system of claim 1 , wherein the acoustic horn is configured to substantially amplify sound frequencies within the audible frequencies.
8. An audio system, comprising:
a MEMS microphone package, wherein the MEMS microphone package comprises a substrate having a first surface and a second surface opposite the first surface, and wherein the substrate also comprises a port hole extending through the substrate from the first surface to the second surface;
a pressure-sensitive diaphragm within the MEMS microphone package;
an acoustic horn coupled to the second surface of the substrate, wherein the acoustic horn comprises a throat opening, a mouth opening, an interior surface forming an acoustic channel extending between the mouth opening and the throat opening, and wherein the second surface of the substrate, and the port hole, overlay at least a portion of the acoustic channel from the throat opening to the mouth opening, wherein the interior surface of the acoustic horn forms a parabolic surface, wherein the acoustic horn comprises a silicone material, and wherein the acoustic horn is configured to substantially amplify sound frequencies above the audible frequencies.
9. The audio system of claim 8 , wherein a portion of the acoustic channel extending from the throat opening of the acoustic horn to the mouth opening of the acoustic horn, extends substantially perpendicular to the second surface of the substrate.
10. The audio system of claim 9 , wherein a portion of the acoustic channel includes at least one bend.
11. The audio system of claim 8 , wherein the cross-sectional area defined by the acoustic horn increases in a stepped manner along at least a portion of the length of the acoustic horn from the throat opening to the mouth opening.
12. The audio system of claim 8 , wherein the acoustic horn is integral with the substrate.