Multi-layer NFT for HAMR with a thermal shunt connecting the metal layers

1. A magnetic recording head, comprising:

a main pole;

a waveguide disposed adjacent to the main pole;

a thermal shunt disposed between the main pole and the waveguide, the thermal shunt being recessed from a media facing surface (MFS); and

a near field transducer (NFT) coupled between the main pole and the waveguide at the MFS, the NFT comprising:

a first metal layer disposed adjacent to the waveguide;

a dielectric gap layer disposed on and in contact with the first metal layer; and

a second metal layer disposed on and in contact with the dielectric gap layer, wherein the first metal layer and the second metal layer are each disposed in contact with the thermal shunt.

2. The magnetic recording head of claim 1 , further comprising:

a first insulating layer disposed between and in contact with the first metal layer and the waveguide; and

a second insulating layer disposed between the main pole and the second metal layer, the second insulating layer being disposed in contact with the second metal layer.

3. The magnetic recording head of claim 1 , wherein the dielectric gap layer comprises one or more materials selected from the group consisting of: SiO 2 , Al 2 O 3 , silicon oxynitride (SiOxNy), where x and y are each a numeral greater than or equal to 1, aluminum silicon oxide (Al 2 O 3 —SiO 2 ), MgF 2 , MgO, Ta 2 O 5 , TiO 2 , SiN, and Ge doped SiO 2 .

4. The magnetic recording head of claim 1 , wherein the first metal layer comprises a different material than the second metal layer.

5. The magnetic recording head of claim 1 , wherein the first metal layer and the second metal layer comprise a same material.

6. The magnetic recording head of claim 1 , wherein the first metal layer and the second metal layer each individually comprises one or more materials selected from the group consisting of: Au, Ag, Cu, Al, Rh, Ir, Ru, Cr, Pt, Ti, Fe, Co, Ni, Pd, Be, Mo, W, ZrN, TiN, HfN, and NbN.

7. The magnetic recording head of claim 1 , wherein the dielectric layer has a width less than a width of the first metal layer and the second metal layer.

8. The magnetic recording head of claim 1 , wherein the first metal layer comprises a first sublayer and a second sublayer, the first and second sublayers comprising different materials.

9. The magnetic recording head of claim 8 , wherein the first sublayer of the first metal layer is disposed adjacent to the waveguide, and wherein the first sublayer of the first metal layer is recessed from the MFS.

10. The magnetic recording head of claim 9 , wherein the first sublayer of the first metal layer a leading edge taper having an angle of about 5 degrees to about 45 degrees.

11. The magnetic recording head of claim 9 , wherein the first sublayer of the first metal layer is tilted at an angle of about 5 degrees to about 45 degrees with respect to the MFS.

12. The magnetic recording head of claim 8 , wherein the second sublayer comprises a first sublayer and a second sublayer, the second sublayer being disposed adjacent to the main pole.

13. The magnetic recording head of claim 12 , wherein the second sublayer of the second metal layer is recessed from the MFS.

14. The magnetic recording head of claim 1 , wherein the dielectric gap layer and the first metal layer are tilted at an angle of about 5 degrees to about 30 degrees with respect to the MFS.

15. The magnetic recording head of claim 14 , wherein the second metal layer is tilted at an angle of about 5 degrees to about 30 degrees with respect to the MFS.

16. A magnetic recording device comprising the magnetic recording head of claim 1 .

17. A magnetic recording head, comprising:

a main pole;

a waveguide disposed adjacent to the main pole;

a thermal shunt disposed between the main pole and the waveguide, the thermal shunt being recessed from a media facing surface (MFS);

a first insulating layer disposed between the waveguide and the thermal shunt;

a second insulating layer disposed between the main pole and the thermal shunt at the MFS; and

a near field transducer (NFT) coupled between the first insulating layer and the second insulating layer at the MFS, the NFT comprising:

a first metal layer disposed in contact with the first insulating layer;

a dielectric gap layer disposed on the first metal layer; and

a second metal layer disposed on the dielectric gap layer and the second insulating layer, wherein the first metal layer, the dielectric gap layer, and the second metal layer are each disposed in contact with the thermal shunt.

18. The magnetic recording head of claim 17 , wherein the dielectric gap layer has a thickness of about 5 nm to about 30 nm.

19. The magnetic recording head of claim 17 , wherein the first metal layer has a thickness of about 50 nm to about 150 nm, and wherein the second metal layer has a thickness of about 20 nm to about 100 nm.

20. The magnetic recording head of claim 17 , wherein the first metal layer and the second metal layer each individually comprises one or more materials selected from the group consisting of: Au, Ag, Cu, Al, Rh, Ir, Ru, Cr, Pt, Ti, Fe, Co, Ni, Pd, Be, Mo, W, ZrN, TiN, HfN, and NbN.

21. The magnetic recording head of claim 17 , wherein the dielectric gap layer comprises one or more materials selected from the group consisting of: SiO 2 , Al 2 O 3 , silicon oxynitride (SiOxNy), where x and y are each a numeral greater than or equal to 1, aluminum silicon oxide (Al 2 O 3 —SiO 2 ), MgF 2 , MgO, Ta 2 O 5 , TiO 2 , SiN, and Ge doped SiO 2 , and wherein the first insulating layer and the second insulating layer each individually comprises SiO 2 or Al 2 O 3 .

22. The magnetic recording head of claim 17 , wherein the NFT is flared in shape, and wherein the thermal shunt has a different shape than the NFT.

23. The magnetic recording head of claim 17 , wherein a first adhesion layer is disposed between the first metal layer and the dielectric gap layer, and wherein a second adhesion layer is disposed between the second metal layer and the dielectric gap layer.

24. The magnetic recording head of claim 17 , wherein a third adhesion layer is disposed on sidewalls of the first metal layer and on sidewalls of the second metal layer.

25. The magnetic recording head of claim 17 , further comprising a third metal layer disposed between the second metal layer and the main pole, the third metal layer being disposed in contact with the thermal shunt.

26. The magnetic recording head of claim 25 , wherein the third metal layer has a width at the MFS greater than a width of the first and second metal layers.

27. The magnetic recording head of claim 25 , wherein the third metal layer comprises one or more materials selected from the group consisting of: Au, Ag, Cu, Al, Rh, Ir, Ru, Cr, Pt, Ti, Fe, Co, Ni, Pd, Be, Mo, W, ZrN, TiN, HfN, and NbN.

28. The magnetic recording head of claim 25 , wherein the third metal layer has a thickness less than a thickness of the first and second metal layers.

29. The magnetic recording head of claim 17 , wherein the first metal layer comprises a first portion having a first width and a second portion having a second width less than the first width.

30. The magnetic recording head of claim 29 , wherein the first width is about 50 nm to about 150 nm, and wherein the second width is about 1 nm to about 40 nm.

31. The magnetic recording head of claim 17 , wherein the thermal shunt comprises a material selected from the group consisting of: Au, Rh, Ir, Cu, Ag, Al, Ru, Cr, Pt, Ti, Fe, Co, Ni, Pd, Be, Mo, W, AlN alloys, and TiN alloys.

32. A magnetic recording device comprising the magnetic recording head of claim 17 .