Contact resistance reduction for direct backside contact
Disclosed herein are methods for direct backside contact formation. In some embodiments, a method may include providing a stack of layers defining a front side and a backside, wherein the front side comprises one or more devices, and forming a plurality of vias in the backside, wherein each via of the plurality of vias extends to a source/drain. The method may further include performing a dopant implant to the backside including into the plurality of vias, wherein the dopant implant is performed at a temperature greater than 300° C., forming a silicide region within each of the source/drains, and forming a backside contact within each of the plurality of vias, wherein the backside contact is formed over the silicide region.
1 . A method for backside contact formation, comprising:
providing a stack of layers defining a front side and a backside, wherein the front side comprises one or more devices;
forming a plurality of vias in the backside, wherein each via of the plurality of vias extends to a source/drain;
performing a dopant implant to the backside including into the plurality of vias, wherein the dopant implant is performed at a temperature greater than 300° C.;
forming a silicide region within each of the source/drains; and
forming a backside contact within each of the plurality of vias, wherein the backside contact is formed over the silicide region.
2 . The method of claim 1 , further comprising performing a pre-amorphization implant prior to performing the dopant implant.
3 . The method of claim 2 , wherein the pre-amorphization implant comprises germanium delivered at an energy between 1 keV and 4 keV.
4 . The method of claim 1 , further comprising performing a laser anneal after performing the dopant implant, wherein the laser anneal is performed at a temperature less than 650° C.
5 . The method of claim 1 , wherein the dopant implant is performed at a temperature less than 400° C., and wherein the dopant comprises at least one of the following: boron, gallium, phosphorus, arsenic, and antimony.
6 . The method of claim 1 , wherein forming the silicide region comprises forming a titanium silicide using a plasma-enhanced chemical vapor deposition (PECVD) titanium process.
7 . The method of claim 1 , further comprising forming a plurality of front side contacts in the stack of layers, wherein the plurality of front side contacts extends to the source/drains.
8 . The method of claim 1 , wherein forming the plurality of vias comprises performing a reactive ion etch into a substrate.
9 . A method of dopant activation for backside contacts, comprising:
providing a stack of layers comprising a source/drain, wherein the stack of layers defines a front side and a backside, and wherein a plurality of front side contacts are formed in the front side;
forming a via in the backside, wherein the via extends to the source/drain;
delivering a dopant into the via, wherein the dopant impacts an exposed surface of the source/drain, and wherein the dopant is delivered at a temperature greater than 300° C.;
forming a silicide region along the exposed surface of the source/drain; and
forming a backside contact within the via, wherein the backside contact is formed over the silicide region.
10 . The method of claim 9 , further comprising performing a pre-amorphization implant prior to delivering the dopant.
11 . The method of claim 10 , wherein the pre-amorphization implant comprises germanium delivered at an energy between 1 keV and 4 keV.
12 . The method of claim 9 , further comprising performing a laser anneal after delivering the dopant into the via, wherein the laser anneal is performed at a temperature less than 650° C.
13 . The method of claim 9 , wherein the dopant is delivered at a temperature less than 400° C., and wherein the dopant comprises at least one of the following: boron, gallium, phosphorus, arsenic, and antimony.
14 . The method of claim 9 , wherein forming the silicide region comprises forming a titanium silicide using a plasma-enhanced chemical vapor deposition (PECVD) titanium process.
15 . The method of claim 9 , wherein the plurality of front side contacts extend to the source/drains.
16 . A method of forming backside via landings on a source/drain, comprising:
providing a stack of layers comprising the source/drain, wherein the stack of layers defines a front side and a backside, and wherein a plurality of front side contacts are formed in the front side;
forming a via in the backside, wherein the via extends to the source/drain;
delivering a dopant into the via, wherein the dopant impacts an exposed surface of the source/drain, and wherein the dopant is delivered at a temperature between 300° C.-400° C.;
forming a silicide region along the exposed surface of the source/drain; and
forming a backside contact within the via, wherein the backside contact is formed over the silicide region.
17 . The method of claim 16 , further comprising performing a pre-amorphization implant prior to delivering the dopant, wherein the pre-amorphization implant comprises germanium delivered at an energy between 1 keV and 4 keV.
18 . The method of claim 16 , further comprising performing a laser anneal after delivering the dopant into the via, wherein the laser anneal is performed at a temperature less than 650° C.
19 . The method of claim 16 , wherein the dopant comprises at least one of the following: boron, gallium, phosphorus, arsenic, and antimony.
20 . The method of claim 16 , wherein forming the silicide region comprises forming a titanium silicide using a plasma-enhanced chemical vapor deposition (PECVD) titanium process.