IP Library › Granted Patent US 12,740,013
Granted Patent B2
US 12,740,013 · App. 18/244,963 · Granted Sep 15, 2026

Immersion cooling system

Inventor: Cheng-En Liu (New Taipei City, TW)
Assignee: AEWIN TECHNOLOGIES CO., LTD.
H05K7/203H05K7/20318H05K7/20818
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Quick Facts
Patent No.
US 12,740,013
App. No.
18/244,963
Granted
Sep 15, 2026
Kind
B2
Abstract

An immersion cooling system is provided and includes: a box body having a first accommodating space and a second accommodating space, where the first accommodating space accommodates a heat dissipation medium and at least one heating unit; a condensing unit arranged in the second accommodating space; and at least one valve unit disposed in the box body and corresponding to the second accommodating space and the condensing unit. The gasified heat dissipation medium flows and impacts the condensing unit to blow off the liquefied heat dissipation medium attached onto the condensing unit when the valve unit is opened.

Claims (15)

1 . An immersion cooling system, comprising:

a box body having a first accommodating space and a second accommodating space arranged along a first direction, wherein the first accommodating space accommodates a heat dissipation medium and at least one heating chip immersed in the heat dissipation medium, wherein the heat dissipation medium is gasified after absorbing a heat energy of the heating chip, and the gasified heat dissipation medium moves from the first accommodating space to the second accommodating space;

a condenser arranged in the second accommodating space along the first direction and a second direction perpendicular to the first direction, wherein the condenser is used to enable the gasified heat dissipation medium to undergo heat exchange, condensation and liquefaction, wherein the condenser is defined with an upper half portion and a lower half portion in the first direction; and

at least one valve disposed on the box body along the second direction, corresponding to the second accommodating space, and aligned with the upper half portion of the condenser along a third direction perpendicular to the first direction and the second direction,

wherein the gasified heat dissipation medium flows and impacts the condenser along the third direction to blow off the liquefied heat dissipation medium attached onto the condenser when the valve is opened.

2 . The immersion cooling system of claim 1 , wherein the valve is opened when an internal pressure of the box body rises above 1 atmosphere.

3 . The immersion cooling system of claim 1 , wherein a quantity of the valves is plural, the condenser is defined with a plurality of intervals in the second direction, and a quantity of the plurality of intervals corresponds to the quantity of the plurality of valves.

4 . The immersion cooling system of claim 3 , wherein the plurality of valves are respectively located at midpoints of the plurality of intervals of the condenser in the second direction.

5 . The immersion cooling system of claim 1 , wherein a distance between the valve and a bottom side of the condenser is ⅔ of a total length of the condenser in the first direction.

6 . The immersion cooling system of claim 1 , wherein a total opening area of the valve is ⅙ of a total cross-sectional area formed by the condenser—in the first direction and the second direction.

7 . The immersion cooling system of claim 1 , wherein the first direction is a direction of gravity.

8 . The immersion cooling system of claim 1 , wherein the condenser is a U-shaped condenser, a straight condenser, or a serpentine condenser.

9 . The immersion cooling system of claim 1 , further comprising a recovery unit, wherein the recovery unit has a water outlet pipeline, a tank body, a pump and a water inlet pipeline, wherein the water outlet pipeline is in communication with the tank body and the valve, the water inlet pipeline is in communication with the tank body and the first accommodating space, and the pump is arranged in the water inlet pipeline, wherein when the valve is opened, the gasified heat dissipation medium enters the water outlet pipeline via the valve, and then enters the tank body to be condensed, wherein the condensed heat dissipation medium is driven by the pump and enters the first accommodating space via the water inlet pipeline.

10 . The immersion cooling system of claim 1 , further comprising a monitoring host for controlling the valve to open or close according to one or more of a plurality of sensing parameters obtained by the monitoring host.

11 . The immersion cooling system of claim 10 , wherein the plurality of sensing parameters include an inlet water temperature of the condenser, an outlet water temperature of the condenser, an inlet water flow rate of the condenser, an outlet water flow rate of the condenser, a fan speed of the condenser, a temperature of the heat dissipation medium in the box body, a temperature of the gasified heat dissipation medium in the box body, a pressure of the gasified heat dissipation medium in the box body and a temperature of the heating chip.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 17, 2023
From: LIU, CHENG-EN
To: AEWIN TECHNOLOGIES CO., LTD.
Reel/Frame 065256/0057 →
Priority Claims (1)
TW 112128176 · Jul 27, 2023 · national
Continuity (1)
Related Publication 20250040085A1 · Jan 30, 2025
References Cited (6)
US 10966349B1 · Lau · 2021 [cited by examiner]
US 20170325355A1 · Lau · 2017 [cited by examiner]
US 20190166725A1 · Jing · 2019 [cited by examiner]
US 20210307210A1 · Wong · 2021 [cited by examiner]
US 20210410320A1 · Yang · 2021 [cited by examiner]
US 20220264761A1 · Keehn · 2022 [cited by examiner]