Antenna module having a sub-antenna on a printed circuit board
An antenna module comprises: a first printed circuit board including a circuit pattern; an IC chip disposed on the first printed circuit board; a solder part disposed on the first printed circuit board; a dielectric layer disposed on the first printed circuit board and surrounding the IC chip and the solder part; and an antenna patterned on the upper surface of the dielectric layer and connected to the solder part, wherein at least a portion of the solder part protrudes up higher than the upper surface of the dielectric layer.
1 . An antenna module comprising:
a first printed circuit board including a circuit pattern;
a second printed circuit board disposed below the first printed circuit board;
an IC chip disposed on the first printed circuit board;
a solder part disposed on the first printed circuit board;
a dielectric layer disposed on the first printed circuit board and surrounding the IC chip and the solder part; and
an antenna patterned on an upper surface of the dielectric layer and connected to the solder part,
wherein at least a portion of the solder part is protruded more upward than an upper surface of the dielectric layer,
wherein a height of the solder part is greater than a thickness of the dielectric layer, and
wherein a sub-antenna is disposed on the second printed circuit board adjacent to the first printed circuit board.
2 . The antenna module according to claim 1 ,
wherein the IC chip is a Bluetooth communication chip.
3 . The antenna module according to claim 1 ,
wherein the material of the dielectric layer includes a resin.
4 . The antenna module according to claim 1 , including:
An RF element being disposed inside the dielectric layer and soldered on the first printed circuit board and configured to generate a frequency.
5 . The antenna module according to claim 1 ,
wherein at least one electronic component is disposed on the first printed circuit board, and
wherein the antenna is disposed not to be overlapped with the electronic component in a vertical direction.
6 . The antenna module according to claim 5 ,
wherein the antenna has a region bent at least once.
7 . The antenna module according to claim 5 ,
wherein the antenna has regions disposed perpendicular to each other between adjacent regions.
8 . The antenna module according to claim 1 ,
wherein the sub-antenna is electrically connected to the solder part.
9 . The antenna module according to claim 1 ,
wherein a thickness of the sub-antenna corresponds to a sum of thicknesses of the dielectric layer and the first printed circuit board.
10 . The antenna module according to claim 1 , wherein a cross-sectional area of the second printed circuit board is larger than a cross-sectional area of the first printed circuit board.
11 . The antenna module according to claim 1 , wherein the sub-antenna is disposed not to overlap with the first printed circuit board in a vertical direction.
12 . The antenna module according to claim 1 , wherein the sub-antenna has a region bent more than once.
13 . The antenna module according to claim 1 , wherein a thickness of the sub-antenna corresponds to the thickness of the dielectric layer.
14 . The antenna module according to claim 1 , wherein the antenna is connected to a region of the solder part protruding upward from the dielectric layer.
15 . An antenna module comprising:
a first printed circuit board;
a second printed circuit board disposed below the first printed circuit board;
an IC chip disposed on the first printed circuit board;
a solder part disposed on the first printed circuit board;
a dielectric layer disposed on the first printed circuit board and surrounding the IC chip and the solder part; and
an antenna disposed on an upper surface of the dielectric layer and connected to the solder part,
wherein a height of the solder part is greater than a thickness of the dielectric layer,
wherein a sub-antenna is disposed on the second printed circuit board adjacent to the first printed circuit board, and
wherein the sub-antenna is electrically connected to the solder part.
16 . The antenna module according to claim 15 , including:
an RF element disposed inside the dielectric layer and soldered on the first printed circuit board and configured to generate a frequency.
17 . The antenna module according to claim 15 ,
wherein at least one electronic component is disposed on the first printed circuit board, and
wherein the antenna is disposed not to be overlapped with the electronic component in a vertical direction.
18 . The antenna module according to claim 15 ,
wherein the antenna has a region bent at least once.