Hand temperature monitoring device for chinese medicine diagnosis and treatment
A hand temperature monitoring device includes at least one sensing array composed of a flexible printed circuit board ( 110 ), temperature sensors ( 120 ), p-type metal oxide semiconductor field-effect transistors (MOSFETs) ( 130 ), polymer films ( 140 ) and carbon fiber boards ( 150 ). The temperature sensors ( 120 ) are disposed on a first side ( 112 ) of the flexible printed circuit board ( 110 ). The p-type MOSFETs ( 130 ) are disposed on a second side ( 114 ) of the flexible printed circuit board ( 110 ) opposing to the temperature sensors ( 120 ), wherein each of the p-type MOSFETs ( 130 ) is electrically connected to one of the temperature sensors ( 120 ). The polymer film ( 140 ) encapsulates each of the temperature sensors ( 120 ) and the p-type MOSFETs ( 130 ) respectively. The carbon fiber board ( 150 ) is positioned over the polymer film and spaced apart from the polymer film ( 140 ).
1 . A hand temperature monitoring device comprising at least one sensing array, wherein the at least one sensing array comprises:
a flexible printed circuit board ( 110 );
a plurality of temperature sensors ( 120 ) disposed on a first side ( 112 ) of the flexible printed circuit board ( 110 );
a plurality of p-type metal-oxide semiconductor field-effect transistors (MOSFETs) ( 130 ) disposed on a second side ( 114 ) of the flexible printed circuit board ( 110 ) opposing to the temperature sensors ( 120 ), wherein each of the p-type MOSFETs ( 130 ) is electrically connected to one of the temperature sensors ( 120 );
a polymer film ( 140 ) caping each of the temperature sensors ( 120 ) and the p-type MOSFETs ( 130 ) respectively; and
a carbon fiber board ( 150 ) positioned over the polymer film ( 140 );
wherein the carbon fiber board ( 150 ) comprises a solid resin film layer on one side and a dry fabric layer on the opposite side;
wherein the solid resin film layer is disposed for making a full and intimate contact with a mould surface and the dry fabric layer is disposed for contacting with the polymer film ( 140 ) for further curing;
wherein the dry fabric layer facilitates an air removal during a vacuum bag lamination process;
wherein the mould is made based on a subject's palm and since the solid resin film layer is disposed for making a full and intimate contact with a mould surface during manufacturing, a personalized hand temperature monitoring device for the subject is provided;
wherein the carbon fiber board ( 150 ) has a flexibility that matches with the flexible printed circuit board ( 110 )'s flexibility so to function as a protector to the flexible printed circuit board ( 110 ) against external force, excessive bending, blocking sweat and grease permeation to electronic components disposed on the flexible printed circuit board ( 110 ); and
where the carbon fiber board ( 150 ) has a thermal conductivity higher than copper so to function as a passive heat dissipation means to the flexible printed circuit board ( 110 ).
2 . The hand temperature monitoring device of claim 1 , wherein each of the temperature sensors ( 120 ) is electrically independent from each other and has a physically mirroring p-type MOSFETs ( 130 ) acting as an individual switch.
3 . The hand temperature monitoring device of claim 1 , wherein the at least one sensing array is flexible and bendable.
4 . The hand temperature monitoring device of claim 1 , further comprising:
a processor ( 260 ) having a control unit ( 262 ) and a data transmit unit ( 264 );
a plurality of decoders ( 230 ) connected between the control unit ( 262 ) and rows of the temperature sensors ( 120 );
a plurality of multiplexer ( 210 ) connected between the control unit ( 262 ) and columns of the temperature sensors ( 120 ); and
a computing device connected to the data transmit unit ( 264 ).
5 . The hand temperature monitoring device of claim 4 , wherein a state of an individual temperature sensor ( 120 ) is configured to change based on a switching signal generated by the control unit ( 262 ).
6 . The hand temperature monitoring device of claim 1 , wherein each of the p-type MOSFET ( 130 ) comprises a gate electrode, a source electrode, and a drain electrode, the gate electrode is electrically connected to the flexible printed circuit board ( 110 ), the source electrode is electrically connected to a power source ( 220 ), and the drain electrode is electrically connected to the temperature sensor ( 120 ).
7 . The hand temperature monitoring device of claim 1 , wherein the temperature sensors ( 120 ) are negative temperature coefficient thermistors having two solder plated electrodes; and wherein the temperature sensors ( 120 ) are doped with P-doping or Boron in a dopant range between 5.00000e14 cm −3 and 6.00000e14 cm −3 for increased temperature sensitivity of the temperature sensors ( 120 ).
8 . The hand temperature monitoring device of claim 1 , wherein the temperature sensors ( 120 ) are carbon fiber reinforced cement-based composite resistors; and wherein the temperature sensors ( 120 ) are doped with P-doping or Boron in a dopant range between 5.00000e14 cm −3 and 6.00000e14 cm −3 for increased temperature sensitivity of the temperature sensors ( 120 ).
9 . The hand temperature monitoring device of claim 1 , further comprising a thermal cured epoxy ( 160 ) disposed between the flexible printed circuit board ( 110 ) and the temperature sensors ( 120 ) and between the flexible printed circuit board ( 110 ) and the p-type MOSFETs ( 130 ).
10 . The temperature monitoring device of claim 1 , wherein the temperature monitoring device causes no harm to a human subject.
11 . The temperature monitoring device of claim 1 , wherein the temperature monitoring device has a temperature measurement accuracy of approximately ±0.1° C.
12 . The temperature monitoring device of claim 1 , wherein the temperature monitoring device detects a temperature distribution across a plurality of regions of the subject's palm.
13 . The temperature monitoring device of claim 1 , wherein the temperature sensors ( 120 ) are arranged to have a center distance of 2 mm with an adjacent one so that a temperature change or difference between different parts of the subject's palm having at least a distance of 2 mm between them is detectable.
14 . A temperature monitoring device for medical diagnosis and treatment comprising at least one sensing array, wherein the at least one sensing array comprises:
a flexible printed circuit board;
a plurality of temperature sensors disposed on a first side of the flexible printed circuit board;
a plurality of p-type metal-oxide semiconductor field-effect transistors (MOSFETs) disposed on a second side of the flexible printed circuit board opposing to the temperature sensors, wherein each of the p-type MOSFETs is electrically connected to one of the temperature sensors;
a polymer film caping each of the temperature sensors and the p-type MOSFETs respectively; and
a carbon fiber board positioned over the polymer film;
wherein the carbon fiber board comprises a solid resin film layer on one side and a dry fabric layer on the opposite side;
wherein the solid resin film layer is disposed for making a full and intimate contact with a mould surface and the dry fabric layer is disposed for contacting with the polymer film for further curing;
wherein the dry fabric layer facilitates an air removal during a vacuum bag lamination process;
wherein the mould is made based on a subject's palm and since the solid resin film layer is disposed for making a full and intimate contact with a mould surface during manufacturing, a personalized hand temperature monitoring device for the subject is provided;
wherein the carbon fiber board has a flexibility that matches with the flexible printed circuit board's flexibility so to function as a protector to the flexible printed circuit board against external force, excessive bending, blocking sweat and grease permeation to electronic components disposed on the flexible printed circuit board; and
where the carbon fiber board has a thermal conductivity higher than copper so to function as a passive heat dissipation means to the flexible printed circuit board.
15 . The temperature monitoring device of claim 14 , wherein each of the temperature sensors is electrically independent from each other and has a physically mirroring p-type MOSFETs acting as an individual switch.
16 . The temperature monitoring device of claim 14 , wherein the at least one sensing array is flexible and bendable.
17 . The temperature monitoring device of claim 14 , further comprising:
a processor having a control unit and a data transmit unit;
a plurality of decoder connected between the control unit and rows of the temperature sensors;
a plurality of multiplexer connected between the control unit and columns of the temperature sensors; and
a computing device connected to the data transmit unit.
18 . The temperature monitoring device of claim 17 , wherein a state of an individual temperature sensor is configured to change based on a switching signal generated by the control unit.
19 . The temperature monitoring device of claim 14 , wherein each of the p-type MOSFET comprises a gate electrode, a source electrode, and a drain electrode, the gate electrode is electrically connected to the flexible printed circuit board, the source electrode is electrically connected to a power source, and the drain electrode is electrically connected to the temperature sensor.
20 . The temperature monitoring device of claim 14 , wherein the temperature sensors are negative temperature coefficient thermistors having two solder plated electrodes; and wherein the temperature sensors are doped with P-doping or Boron in a dopant range between 5.00000e14 cm −3 and 6.00000e14 cm −3 for increased temperature sensitivity of the temperature sensors.
21 . The temperature monitoring device of claim 14 , wherein the temperature sensors are carbon fiber reinforced cement-based composite resistors; and wherein the temperature sensors are doped with P-doping or Boron in a dopant range between 5.00000e14 cm −3 and 6.00000e14 cm −3 for increased temperature sensitivity of the temperature sensors.
22 . The temperature monitoring device of claim 14 , further comprising a thermal cured epoxy disposed between the flexible printed circuit board and the temperature sensors and between the flexible printed circuit board and the p-type MOSFETs.
23 . The temperature monitoring device of claim 14 , wherein the temperature monitoring device causes no harm to human subject.
24 . The temperature monitoring device of claim 14 , wherein the temperature monitoring device has a temperature measurement accuracy of approximately +0.1° C.
25 . The temperature monitoring device of claim 14 , wherein the temperature monitoring device is configured to detect a temperature distribution across a plurality of regions of the subject's palm.
26 . The temperature monitoring device of claim 14 , wherein the temperature sensors are arranged to have a center distance of 2 mm with an adjacent one so that a temperature change or difference between different parts of the subject's palm having at least a distance of 2 mm between them is detectable.
27 . The temperature monitoring device of claim 14 , further comprising a temperature record database for recording temperature distributions across a plurality of regions of a palm of each of one or more subjects so to serve for disease diagnosis and health management functions.
28 . The temperature monitoring device of claim 14 , wherein the temperature monitoring device monitors a stroke recovery progress, a fertility diagnosis, a coma recovery progress, a health condition of a patient admitted to intensive care unit (ICU) and an elder's health.