SILYLATED ADHESIVE COMPOSITION WITH IMPROVED ADHESION ON METALLIC SUBSTRATES
1) Moisture curable silylated adhesive composition comprising: from 20% to 50% weight of a silane modified APAO; from 2% to 15% weight of a filler consisting of expanded hollow thermoplastic polymer microspheres; and from 10% to 60% weight of a tackifying agent. 2) Method for manufacturing an assembly product comprising: heating at from 130° C. to 180° C. said composition to make it liquid enough to be applied on a substrate, then coating said composition on the surface of a primary substrate, then putting into contact the coated surface of the primary substrate with the surface of a secondary substrate, then chemically curing the coated composition with water, preferably with atmospheric moisture.
1 . Moisture curable silylated adhesive composition comprising, based on the total weight of said composition:
from 20% to 50% weight of at least one silane modified amorphous poly-α-olefin (or APAO) (A);
from 2% to 15% weight of at least one filler (B) consisting of expanded hollow thermoplastic polymer microspheres; and
from 10% to 60% weight of at least one tackifying agent (C).
2 . Moisture curable silylated adhesive composition according to claim 1 , characterized in that the silane modified amorphous poly-α-olefin (A) comprises at least one alkoxysilyl groups of formula (I):
—Si(R 1 ) p (OR 2 ) 3-p (I)
in which:
R 1 represents a linear or branched alkyl radical comprising from 1 to 4 carbon atoms, with the possibility that when there are several radicals R 1 , these radicals are identical or different;
R 2 represents a linear or branched alkyl radical comprising from 1 to 4 carbon atoms, with the possibility that when there are several radicals R 2 , these radicals are identical or different, with the possibility that two groups OR 2 may be engaged in the same ring;
p is an integer equal to 0, 1 or 2.
3 . Moisture curable silylated adhesive composition according to claim 1 , characterized in that filler (B) consists of expanded hollow thermoplastic polymer microspheres coated with a colloidal calcium carbonate.
4 . Moisture curable silylated adhesive composition according to claim 1 , characterized in that tackifying agent (C) is selected from the group consisting of silanized derivatives of C5 resins, C9 resins and mixture of C5/C9 resins, by thermal polymerization of a composition including silanes and monomers, including cyclic olefins having at least one ethylenically unsaturated group selected from the group consisting of C5 fractions, C9 fractions, and dicyclopentadiene of naphtha cracking.
5 . Moisture curable silylated adhesive composition according to claim 1 , characterized in that the softening point of the tackifying resin(s) (C) lies in the range from 90° C. to 115° C.
6 . Moisture curable silylated adhesive composition according to claim 1 , characterized in that it comprises, based on the total weight of said composition:
from 30% to 40% weight of the at least one silane modified APAO (A);
from 3% to 10% weight of the at least one filler (B); and
from 20% to 40% weight of the at least one tackifying agent (C).
7 . Moisture curable silylated adhesive composition according to claim 1 , characterized in that the moisture curable silylated adhesive composition comprises at least one additional thermoplastic polymer (D) which does not contain any alkoxysilyl group.
8 . Moisture curable silylated adhesive composition according to claim 7 , characterized in that the at least one additional thermoplastic polymer (D) is selected from the group consisting of styrene block copolymers (SBC).
9 . Moisture curable silylated adhesive composition according to claim 7 , characterized in that the at least one additional thermoplastic polymer (D) is a linear SEBS triblock copolymer.
10 . Moisture curable silylated adhesive composition according to claim 1 , characterized in that the moisture curable silylated adhesive composition comprises at least one silane functionalized polyolefin wax (E).
11 . Moisture curable silylated adhesive composition according to claim 1 , characterized in that the moisture curable silylated adhesive composition comprises at least one plasticizer (F) which may be selected from the group consisting of a naphthenic oil, a paraffinic oil, a vegetable oil, polyisobutylene, a benzoate ester, a non silane functionalized wax and an acrylic or carboxylic acid modified wax.
12 . An assembly adhesive or a laminating adhesive comprising the moisture curable silylated adhesive composition of claim 1 .
13 . Method for manufacturing an assembly product comprising:
a step (i) of heating at a temperature ranging from 130° C. to 180° C. the moisture curable silylated adhesive composition such as defined in claim 1 , for a period of time long enough to render said composition liquid enough to be applied on a substrate, then
a step (ii) of coating said composition on a surface of a primary substrate, then
a step (iii) of putting into contact the coated surface of the primary substrate with a surface of a secondary substrate, then
a step (iv) of chemically curing the composition with water.
14 . Method for manufacturing an assembly product according to claim 13 , characterized in that at least one of the primary and secondary substrates is aluminium.
15 . Assembly product comprising at least two substrates bonded by at least one cured silylated adhesive composition such as defined in claim 1 .