RFID label and adherend
An RFID inlay, a hot melt-based adhesive layer laminated on a surface of the RFID inlay on which an RFID antenna and an IC chip are formed, a first thermoplastic resin sheet, and an adherend adhesive layer configured to be attached to an adherend are laminated in this order.
1. An RFID label, comprising:
an RFID inlay including an inlay substrate, an RFID antenna formed on the inlay substrate, and an IC chip connected to the RFID antenna;
a hot melt-based adhesive layer laminated on a surface of the RFID inlay on which the RFID antenna and the IC chip are formed;
a first thermoplastic resin sheet; and
an adherend adhesive layer configured to be attached to an adherend, wherein
the RFID inlay, the hot melt-based adhesive layer, the first thermoplastic resin sheet, and the adherend adhesive layer are laminated in this order.
2. The RFID label according to claim 1 , wherein
a second thermoplastic resin sheet is laminated, via a lamination adhesive layer, on a surface of the RFID inlay opposite to the surface on which the hot melt-based adhesive layer is laminated.
3. The RFID label according to claim 2 , wherein
the first thermoplastic resin sheet and the second thermoplastic resin sheet are made of a same material.
4. The RFID label according to claim 2 , wherein
the first thermoplastic resin sheet and the second thermoplastic resin sheet are formed with a same thickness.
5. The RFID label according to claim 2 , wherein
the inlay substrate is made of a polyethylene terephthalate, and
the first thermoplastic resin sheet and the second thermoplastic resin sheet are made of a polypropylene.
6. The RFID label according to claim 2 , wherein
glass transition temperatures of the first thermoplastic resin sheet and the second thermoplastic resin sheet are 50° C. or lower.
7. The RFID label according to claim 1 , wherein
a rigidity of the first thermoplastic resin sheet is lower than a rigidity of the inlay substrate.
8. The RFID label according to claim 2 , wherein
a rigidity of the second thermoplastic resin sheet is lower than a rigidity of the inlay substrate.