RFID device for injection molding
The invention relates to a Radio-Frequency Identification (RFID) device for an injection molded product comprising layers of different components to reduce thermal shrinkage or expansion and failure of the RFID inlay due to the high temperatures during injection molding. The introduced device allows for a thin build and a flat, smooth injection molded product.
1 . A radio frequency identification (RFID) device for injection molded articles, the device comprising:
(a) an inlay comprising an RFID antenna structure comprising a conductive material;
(b) an RFID integrated circuit (IC) chip, wherein the RFID IC chip is either attached directly to the RFID antenna structure on one side of the inlay or an RFID strap comprising the RFID IC chip is attached directly to the RFID antenna structure on one side of the inlay, enabling an electrical contact between the RFID IC chip and the RFID antenna structure;
(c) a stabilizing and heat resistant layer comprising a high density polyethylene film stretched in two dimensions; and
(d) at least one pressure sensitive adhesive layer;
(e) wherein the at least one pressure sensitive adhesive layer is applied at least between the inlay and the stabilizing and heat resistant layer.
2 . The RFID device of claim 1 , wherein the side of the inlay comprising the RFID IC chip is covered with one of the at least one pressure sensitive adhesive layer and facing away from the stabilizing and heat resistant layer.
3 . A radio frequency identification (RFID) device for injection molded articles, the device comprising:
(a) a stabilizing and heat resistant layer comprising a high density polyethylene film stretched in two dimensions;
(b) an antenna structure printed with conductive resin on a polyurethane substrate;
(c) an integrated circuit (IC) attached directly to the antenna structure or an IC attached to a substrate strap, the substrate strap attached to the antenna structure or the RFID strap attached directly to the antenna structure on one side of an inlay, enabling an electrical contact between the IC and the antenna structure;
(d) at least one layer of a heat seal adhesive,
wherein the at least one adhesive layer is applied at least between the inlay and the stabilizing and heat resistant layer.
4 . A radio frequency identification (RFID) device for injection molded articles, the device comprising:
(a) an inlay comprising an RFID antenna structure comprising a conductive material;
(b) an integrated circuit (IC) attached directly to the RFID antenna structure on one side of the inlay;
(c) a stabilizing and heat resistant layer comprising a high density polyethylene film stretched in two dimensions;
(d) at least one layer of a heat seal adhesive;
wherein the at least one heat seal adhesive layer is applied at least between the inlay and the stabilizing and heat resistant layer and
wherein the stabilizing and heat resistant layer is at least 5 times the thickness of the inlay and the at least one heat seal adhesive layer is at least 3 times the thickness of the inlay.
5 . The RFID device of claim 4 , wherein the side of the inlay comprising the IC is covered with one of the at least one layer of the heat seal adhesive and facing the stabilizing and heat resistant layer.
6 . The RFID device of claim 4 , wherein the heat seal adhesive is a polyester based adhesive heat-seal film.
7 . The RFID device of claim 4 , wherein the stabilizing and heat resistant layer comprises a synthetic paper.
8 . A radio frequency identification (RFID) device for injection molded articles, the device comprising:
(a) a stabilizing and heat resistant layer comprising a high density polyethylene film stretched in two dimensions;
(b) an antenna structure printed with conductive resin on a polyurethane substrate;
(c) an integrated circuit (IC) attached to a polyethylene terephthalate (PET) strap, the strap attached to the antenna structure, enabling an electrical contact between the IC and the antenna structure; and
(d) at least one heat seal adhesive layer,
wherein the at least one heat seal adhesive layer is applied at least between an inlay and the stabilizing and heat resistant layer.
9 . The RFID device of claim 8 , wherein the at least one heat seal adhesive layer comprises a polyester based adhesive.
10 . The RFID device of claim 8 , wherein the stabilizing and heat resistant layer comprises a synthetic paper.
11 . A radio frequency identification (RFID) device for injection molded articles, the device comprising:
(a) a stabilizing and heat resistant layer comprising a high density polyethylene film stretched in two dimensions;
(b) an antenna structure printed with a conductive resin directly onto the stabilizing and heat resistant layer;
(c) an integrated circuit (IC) attached to a strap, the strap attached to the antenna structure enabling an electrical contact between the IC and the antenna structure.
12 . The RFID device of claim 11 , wherein the IC is attached directly to the antenna structure.