IP Library › Granted Patent US 12,501,126
Granted Patent B2
US 12,501,126 · App. 18/269,741 · Granted Dec 16, 2025

Sensor module

Inventor: Haruki Tanaka (Kanagawa, JP)
Assignee: Sony Semiconductor Solutions Corporation
H04N23/51
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Quick Facts
Patent No.
US 12,501,126
App. No.
18/269,741
Granted
Dec 16, 2025
Kind
B2
Abstract

[Object] To provide a sensor module that makes it possible to suppress generation of resin burrs and improve workability. [Solving Means] A sensor module ( 100 ) according to an embodiment of the present technology includes a sensor element, a first case ( 11 ), a second case ( 12 ), and a groove ( 70 ). The first case ( 11 ) includes an opening end including a first welded region and accommodates therein the sensor element. The second case ( 12 ) includes a joining surface ( 123 ) including a second welded region ( 50 ), the second welded region ( 50 ) being welded to the first welded region to form a welded portion. The groove ( 70 ) is formed in at least one of the first welded region or the second welded region ( 50 ).

Claims (35)

1 . A sensor module, comprising:

a sensor element;

a first case that includes an opening end including a first welded region and accommodates therein the sensor element;

a second case that includes a joining surface including a second welded region, the second welded region being welded to the first welded region to form a welded portion; and

a groove that is formed in at least one of the first welded region or the second welded region

wherein the groove is formed over an entire circumference of the first welded region or the second welded region; and

wherein the groove includes a plurality of first grooves formed in parallel over the entire circumference of the first welded region or the second welded region; and

among the plurality of first grooves, a first groove located on an outermost side of the joining surface has a cross-sectional area larger than a cross-sectional area of a first groove located on an innermost side of the joining surface.

2 . The sensor module according to claim 1 , wherein

the groove is formed continuously over the entire circumference of the first welded region or the second welded region.

3 . The sensor module according to claim 1 , wherein

the number of the plurality of first grooves is three or more, and

the plurality of first grooves is formed more densely toward an outer side of the first welded region or the second welded region.

4 . The sensor module according to claim 1 , wherein

among the plurality of first grooves, a first groove located on an outermost side of the joining surface has a width or depth larger than a width or depth of a first groove located on an innermost side of the joining surface.

5 . The sensor module according to claim 1 , wherein

The groove further includes a plurality of second grooves extending in a direction intersecting with the plurality of first grooves.

6 . The sensor module according to claim 1 , wherein

the opening end further includes a stepped surface that is formed outside of the first welded region in parallel to the first welded region,

the joining surface further includes a parallel surface that is formed outside of the second welded region in parallel to the second welded region, and

the stepped surface and the parallel surface face each other via a gap.

7 . The sensor module according to claim 1 , wherein

the first case is made of a resin material that absorbs laser light of the predetermined wavelength, and

the second case is made of a resin material that transmits the laser light of the predetermined wavelength.

8 . The sensor module according to claim 7 , wherein

the groove is filled with the resin material melted from the first case or the second case.

9 . The sensor module according to claim 1 , wherein

the sensor element is an imaging device.

10 . The sensor module according to claim 1 , wherein

the first case and the second case are joined to each other using laser welding.

11 . The sensor module according to claim 1 , wherein

the first welded region is in a first resin portion and the second welded region is in a second resin portion,

one of the first resin portion welded region and the second welded region is a resin material having transmissive properties with respect to a specified laser light and the other of the first resin portion welded region and the second welded region is a resin material having transmissive properties with respect to the specified laser light.

12 . The sensor module according to claim 1 , wherein

the sensor module is a camera for a vehicle.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2023
From: TANAKA, HARUKI
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 064972/0253 →
Priority Claims (1)
JP 2021-002374 · Jan 8, 2021 · national
Continuity (1)
Related Publication 20240073498A1 · Feb 29, 2024
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