Electromagnetic band gap element structure and fabrication methods

1. A computerized method of fabricating an electromagnetic band gap (EBG) element comprising:

a. providing an ink jet printing system comprising:

i. a first print head, sized and configured to dispense a dielectric ink composition;

ii. a second print head sized and configured to dispense a conductive ink composition;

iii. a conveyor, operably coupled to the first, and the second print heads configured to convey a substrate to each of the first, and the second print heads; and

iv. a computer aided manufacturing (“CAM”) having a central processing module (CPM), in communication with conveyor, and each of the first, and second print heads, the CPM further comprising: at least one processor in communication with a non-transitory computer readable storage medium storing thereon instructions that, when executed by the at least one processor cause the CPM to control the ink-jet printing system, by carrying out steps that comprise: receiving a 3D visualization file representing the EBG element; and generating a file library having a plurality of files, each file representing a substantially 2D layer for printing the EBG element, and a metafile representing at least the printing order of each of the substantially 2D layers for printing;

b. receiving the 3D visualization file representing the EBG element;

c. generating the library of files representing the substantially 2D layer for printing;

d. providing the dielectric ink composition, and the conductive ink composition;

e. obtaining from the library a first file representing a first printing layer of the EBG element, the first file comprising printing instructions for a pattern representative of at least one of: the dielectric ink, and the conductive ink;

f. using the first print head, forming a pattern representative of the dielectric ink in the first printing layer;

g. curing the pattern corresponding to the dielectric ink in the first layer;

h. using the second print head, forming a pattern representative of the conductive ink in the first printing layer;

i. sintering the pattern corresponding to the conductive ink in the first layer;

j. obtaining from the library a subsequent file representative of a subsequent layer for printing the EBG element; the subsequent file comprising printing instructions for a pattern representative of at least one of: the dielectric ink, and the conductive ink in the subsequent layer;

k. repeating the steps of: using the first print head, forming the pattern representative of the dielectric ink in the subsequent layer, to the step of sintering the pattern representative of the conductive ink in the subsequent layer, wherein upon curing and/or sintering a final layer, the EBG element comprises:

i. an electrically conducting ground plane having an apical surface and a basal surface

ii. a dielectric medium having a basal surface and an apical surface disposed over the electrically conducting ground plane;

iii. a plurality of polygonal conducting elements each having an apical surface and a basal surface disposed adjacently to, and distanced from each other on the apical surface of the dielectric medium, each polygonal conducting element further comprises at least two opposing facet walls extending basally, wherein each conducting element is coupled to the electrically conducting ground plane by a blind via; and

iv. a plurality of gapping polygonal structures each associated with a polygonal conducting element and having an apical surface, the gapping polygonal structure extending apically from the apical surface of the electrically conducting ground plane, wherein each gapping polygonal structures defining a concentric bore wherein the blind via is disposed coaxial with the bore; and

l. removing the substrate.

2. The method of claim 1 , wherein upon curing and/or sintering the final layer each facet wall extends basally to a predetermined depth U within the dielectric medium.

3. The method of claim 2 , wherein upon curing and/or sintering the final layer each polygonal conducting element is distanced from an adjacent conducting element by a predetermined distance t 1 .

4. The method of claim 3 , wherein upon curing and/or sintering the final layer each polygonal gapping structure extends apically from the apical face of the electrically conducting ground plane to a predetermined gap g1 between the apical surface of the polygonal gapping structure and the basal surface of the associated polygonal conducting element.

5. The method of claim 4 , wherein upon curing and/or sintering the final layer g 1 is operable to define a predetermined lower frequency limit to be blocked by the EBG element.

6. The method of claim 4 , wherein upon curing and/or sintering the final layer U and t 1 are together operable to define a predetermined upper frequency limit to be blocked by the EBG element.

7. The method of claim 1 , wherein upon curing and/or sintering the final layer:

a. at least one facet wall of each polygonal conducting element further comprises pair of laterally extending and vertically overlapping identical slabs, disposed at a predetermined vertical distance from each other, wherein the pair of slabs, embedded within the dielectric medium are extending laterally to cover a portion of the distance to the adjacent polygonal conducting element; and

b. a complementary slab extending laterally from a facet wall diametrically opposing the facet wall with the pair of laterally extending identical slabs,

wherein adjacent polygonal conducting elements are arranged such that the complementary slab is interdisposed between, and overlaps with the pair of laterally extending and vertically overlapping identical slabs at a predetermined gap g2, between the upper surface of the complementary slab and the lower surface of the upper slab of the pair of laterally extending and vertically overlapping identical slabs.

8. The method of claim 7 wherein upon curing and/or sintering the final layer, g 2 is operable to define a predetermined upper frequency limit to be blocked by the EBG element.

9. The method of claim 7 , wherein upon curing and/or sintering the final layer, the complementary slab overlaps with the pair of laterally extending and vertically overlapping identical slabs over between about 60% and about 99% of the surface area of the pair of laterally extending and vertically overlapping identical slabs.

10. The method of claim 1 , wherein upon curing and/or sintering the final layer the gapping polygonal structures has the same number of facets as the polygonal conducting elements.

11. The method of claim 1 , wherein the step of: using the CPM, generating a file library having a plurality of files, each file representing a substantially 2D layer for printing the EBG element, further comprises: for each file representing the substantially 2D layer of dielectric ink pattern, generating a sub library of conductive ink pattern files, each conductive ink pattern file in the sub-library representing a substantially 2D layer for printing, and a metafile with at least one of: an order of printing, an identifier of the file of substantially 2D layer of dielectric ink pattern file the sub-library conductive file is associated with, and instructions on the speed of printing.

12. An electromagnetic band gap (EBG) element comprising:

a. an electrically conducting ground plane having an apical surface and a basal surface

b. a dielectric medium having a basal surface and an apical surface disposed over the electrically conducting ground plane;

c. a plurality of polygonal conducting elements each having an apical surface and a basal surface disposed adjacently to, and distanced from each other on the apical surface of the dielectric medium, each polygonal conducting element further comprises at least two opposing facet walls extending basally, wherein each conducting element is coupled to the electrically conducting ground plane by a blind via; and

d. a plurality of gapping polygonal structures each associated with a polygonal conducting element and having an apical surface, the gapping polygonal structure extending apically from the apical surface of the electrically conducting ground plane, wherein each gapping polygonal structures defining a concentric bore wherein the blind via is disposed coaxial with the bore.

13. The EBG element of claim 12 , wherein each facet wall extends basally to a predetermined depth U within the dielectric medium.

14. The EBG element of claim 13 , wherein each polygonal conducting element is distanced from an adjacent conducting element by a predetermined distance t 1 .

15. The EBG element of claim 14 , wherein each polygonal gapping structure extends apically from the apical face of the electrically conducting ground plane to a predetermined gap g1 between the apical surface of the polygonal gapping structure and the basal surface of the associated polygonal conducting element.

16. The EBG element of claim 15 , wherein g 1 is operable to define a predetermined lower frequency limit to be blocked by the EBG element.

17. The EBG element of claim 15 , wherein L and t are together operable to define a predetermined upper frequency limit to be blocked by the EBG element.

18. The EBG element of claim 12 , wherein:

a. at least one facet wall of each polygonal conducting element further comprises pair of laterally extending and vertically overlapping identical slabs, disposed at a predetermined vertical distance from each other, wherein the pair of slabs, embedded within the dielectric medium are extending laterally to cover a portion of the distance to the adjacent polygonal conducting element; and

b. a complementary slab extending laterally from a facet wall diametrically opposing the facet wall with the pair of laterally extending identical slabs,

wherein adjacent polygonal conducting elements are arranged such that the complementary slab is interdisposed between, and overlaps with the pair of laterally extending and vertically overlapping identical slabs at a predetermined gap g2, between the upper surface of the complementary slab and the lower surface of the upper slab of the pair of laterally extending and vertically overlapping identical slabs.

19. The EBG element of claim 18 wherein g2 is operable to define a predetermined upper frequency limit to be blocked by the EBG element.

20. The EBG element of claim 18 , wherein the complementary slab overlaps with the pair of laterally extending and vertically overlapping identical slabs over between about 60% and about 99% of the surface area of the pair of laterally extending and vertically overlapping identical slabs.

21. The EBG element of claim 12 , wherein the gapping polygonal structures has the same number of facets as the polygonal conducting elements.

22. An article of manufacture comprising a non-transitory memory storage device storing thereon a computer readable medium (CRM) for fabricating an electromagnetic band gap (EBG) element, the CRM comprising a set of executable instructions configured to, when executed by at least one processor, cause the at least one processor to perform the steps of:

a. receiving the 3D visualization file representing the EBG element;

b. generating a file library having a plurality of files, each file representing a substantially 2D layer for printing the EBG element, and a metafile representing at least the printing order of each of the substantially 2D layers for printing;

c. obtaining from the library a first file representing a first printing layer of the EBG element, the first file comprising printing instructions for a pattern representative of at least one of: the dielectric ink, and the conductive ink;

d. using a first print head, in communication with the at least one processor, operable to dispense dielectric ink, included with the article of manufacture in communication with the at least one processor, forming a pattern representative of the dielectric ink in the first printing layer of the EBG;

e. using an electromagnetic radiation source in communication with the at least one processor, curing the pattern corresponding to the dielectric ink in the first layer;

f. using a second print head operable to dispense conductive ink, in communication with the at least one processor, forming a pattern representative of the conductive ink in the first printing layer of the EBG;

g. using a focused heat source in communication with the at least one processor, sintering the pattern corresponding to the conductive ink in the first layer;

h. obtaining from the library a subsequent file representative of a subsequent layer for printing the EBG element; the subsequent file comprising printing instructions for a pattern representative of at least one of: the dielectric ink, and the conductive ink in the subsequent layer;

i. repeating the steps of: forming the pattern corresponding to the dielectric ink in the subsequent layer, to the step of sintering the pattern corresponding to the conductive ink in the subsequent layer, wherein upon curing and/or sintering a final layer, the EBG element is configured to comprise:

i. an electrically conducting ground plane having an apical surface and a basal surface

ii. a dielectric medium having a basal surface and an apical surface disposed over the electrically conducting ground plane;

iii. a plurality of polygonal conducting elements each having an apical surface and a basal surface disposed adjacently to, and distanced from each other on the apical surface of the dielectric medium, each polygonal conducting element further comprises at least two opposing facet walls extending basally, wherein each conducting element is coupled to the electrically conducting ground plane by a blind via; and

iv. a plurality of gapping polygonal structures each associated with a polygonal conducting element and having an apical surface, the gapping polygonal structure extending apically from the apical surface of the electrically conducting ground plane, wherein each gapping polygonal structures defining a concentric bore wherein the blind via is disposed coaxial with the bore.

23. The article of manufacture of claim 22 , wherein: in generating the file library having a plurality of files, each file representing a substantially 2D layer for printing the EBG element, the set of executable instructions is further configured to, when executed by the at least one processor, cause the at least one processor to: for each file representing the substantially 2D layer of dielectric ink pattern, generate a sub library of conductive ink pattern files, each file of conductive ink pattern in the sub-library representing a substantially 2D layer for printing, and a metafile with at least one of: an order of printing, an identifier of the file of substantially 2D layer of dielectric ink pattern file the sub-library conductive file is associated with, and instructions on the speed of printing.