IP Library Granted Patent US 12,456,640
Granted Patent B2
US 12,456,640 · App. 18/274,834 · Granted Oct 28, 2025

Electrostatic chuck

Inventor: Wataru Fujita (Higashiomi, JP)
Assignee: KYOCERA Corporation
H01L21/6833
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Quick Facts
Patent No.
US 12,456,640
App. No.
18/274,834
Granted
Oct 28, 2025
Kind
B2
Abstract

An electrostatic chuck according to the present disclosure includes a plate-shaped body including an adsorption surface for mounting a workpiece, a base, and an electrode film located between the plate-shaped body and the base. The plate-shaped body and the base are made of sapphire. The angle between the adsorption surface and the c-plane of the sapphire is 45° or more.

Claims (10)

1 . An electrostatic chuck comprising:

a plate-shaped body comprising an adsorption surface for mounting a workpiece;

a base; and

an electrode film located between the plate-shaped body and the base, wherein

the plate-shaped body and the base are made of sapphire, the plate-shaped body and the base face each other, a c-axis of the sapphire forming the plate-shaped body and a c-axis of the sapphire forming the base being not parallel to each other, and

an angle between the adsorption surface and a c-plane of the sapphire is 45° or more.

2 . The electrostatic chuck according to claim 1 , wherein

a thickness of the base is greater than a thickness of the plate-shaped body.

3 . The electrostatic chuck according to claim 1 , wherein

the electrode film has translucency.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 28, 2023
From: FUJITA, WATARU
To: KYOCERA CORPORATION
Reel/Frame 064419/0321 →
Priority Claims (1)
JP 2021-012365 · Jan 28, 2021 · national
Continuity (1)
Related Publication 20240105489A1 · Mar 28, 2024
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US 20180190527A1 · Watanabe et al. · 2018 [cited by applicant]
JP 6291175A · 1994 [cited by applicant]
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JP 2004207644A · 2004 [cited by applicant]
WO 2017057273A1 · 2017 [cited by applicant]
Cited By (1)
US 12,727,434