IP Library Granted Patent US 12,348,920
Granted Patent B2
US 12,348,920 · App. 18/297,905 · Granted Jul 1, 2025

Electronic components and glasses

Inventors: Yueqiang Wang (Shenzhen, CN); Yongjian Li (Shenzhen, CN); Yunbin Chen (Shenzhen, CN); Haofeng Zhang (Shenzhen, CN)
Assignee: SHENZHEN SHOKZ CO., LTD.
H04R1/083G02C11/10H04R1/04H04R1/406H04R1/46H04R3/005H04R2460/13
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,348,920
App. No.
18/297,905
Granted
Jul 1, 2025
Kind
B2
Abstract

The present disclosure relates to electronic components and glasses comprising an electronic component. The electronic component may include a component body, a first circuit board, a second circuit board, a first microphone element, and a second microphone element. The component body may include a cavity. The first circuit board and the second circuit board may be inclined to each arranged in the cavity. The first microphone element may be arranged on a sidewall, facing the component body, of the first circuit board. The second microphone element may be arranged on a sidewall, facing the component body, of the second circuit board. A first sound conducting hole may be arranged on a sidewall, opposite to the first microphone element, of the component body. The first sound conducting hole may be configured to conduct a sound to the first microphone element. A second sound conducting hole may be arranged on the sidewall, opposite to the first microphone element, of the component body. The second sound conducting hole may be configured to conduct a sound to the second microphone element. The present disclosure may make full use of a space of the electronic component. When the electronic component is applied to an electronic device, it is beneficial to the thinness and lightness of the electronic device.

Claims (53)

1. An electronic component, comprising:

a component body including a container body and a cover, the container body being hollow to form a cavity, an opening in flow communication with the cavity is arranged in the container body, the cover being arranged on the opening and closes the cavity;

a first microphone element arranged in the cavity;

a second microphone element arranged in the cavity;

a first sound conducting hole arranged on a first sidewall of the component body and configured to conduct a first sound originating from a sound source to the first microphone element; and

a second sound conducting hole arranged on a second sidewall of the component body and configured to conduct a second sound originating from the sound source to the second microphone element.

2. The electronic component of claim 1 , wherein the second microphone element is arranged at a position farther from the sound source than the first microphone element.

3. The electronic component of claim 1 , wherein the first sound conducting hole is arranged on the cover and vertical or inclined to a surface of the cover.

4. The electronic component of claim 1 , wherein the second sound conducting hole is arranged on a sidewall, opposite to the cover or the first sound conducting hole, of the container body.

5. The electronic component of claim 1 , wherein the electronic component further includes:

a first circuit board; and

a second circuit board, the first circuit board and the second circuit board being inclined to each other and arranged in the cavity.

6. The electronic component of claim 5 , wherein

the first microphone element is arranged on a sidewall, facing the component body, of the first circuit board, and

the second microphone element is arranged on a sidewall, facing the component body, of the second circuit board.

7. The electronic component of claim 6 , wherein the first circuit board is arranged facing the cover and parallel or inclined to the cover, the first microphone element being arranged on a side, facing the cover, of the first circuit board.

8. The electronic component of claim 6 , wherein the second circuit board is arranged facing the container body, the second microphone element being arranged on a side, facing the container body, of the second circuit board.

9. The electronic component of claim 5 , wherein

an area of the first circuit board is smaller than an area of the second circuit board, and

the opening and the cover are arranged in a corresponding strip shape, a size of the first circuit board along a width direction of the cover being smaller than a size of the second circuit board along a vertical direction of the first circuit board.

10. The electronic component of claim 5 , wherein the first circuit board and the second circuit board are made of a flexible circuit board or a soft-hard combined double-layer circuit board, wherein:

the flexible circuit board is bent in the cavity to form the first circuit board and the second circuit board; or

the soft-hard combined double-layer circuit board includes a flexible connection board and two hard circuit boards respectively connected to both ends of the flexible connection board, the two hard circuit boards being inclined to each other to form the first circuit board and the second circuit board.

11. The electronic component of claim 5 , wherein

a switch and a light-emitting element are arranged on the first circuit board at intervals, or

a main control chip and an antenna are arranged on the second circuit board.

12. The electronic component of claim 1 , wherein the cover includes a hard bracket and a soft cover integrally molded on a surface of the hard bracket, wherein:

the hard bracket is configured to mechanically connect the container body,

a microphone hole is arranged on the hard bracket,

the soft cover covers the microphone hole,

a first sound barrier is arranged at a position, corresponding to the microphone hole, of the soft cover,

the first sound barrier extends toward inside of the cavity through the microphone hole and defines a sound conducting channel,

one end of the sound conducting channel is communicated with the first sound conducting hole, and

the first microphone element is inserted into the sound conducting channel from the other end of the sound conducting channel.

13. The electronic component of claim 12 , wherein:

a second sound barrier is arranged at a position, corresponding to the second sound conducting hole, of the container body, and

the second sound barrier extends toward the inside of the cavity through the second sound conducting hole to limit a transmission direction of a sound to the second microphone element.

14. The electronic component of claim 1 , wherein the second microphone element includes a bone conductive microphone, the bone conductive microphone extending out of the component body through the second sound conducting hole.

15. The electronic component of claim 1 , wherein a central axis of the first sound conducting hole coincides with a main axis of a sound receiving area of the first microphone element.

16. The electronic component of claim 1 , wherein a central axis of the second sound conducting hole coincides with a main axis of a sound receiving area of the second microphone element.

17. The electronic component of claim 1 , wherein a central axis of the second sound conducting hole coincides with or is parallel to a central axis of the first sound conducting hole.

18. The electronic component of claim 1 , wherein a main axis of a sound receiving area of the second microphone element coincides with or is parallel to a main axis of a sound receiving area of the first microphone element.

19. An electronic device, comprising:

a glasses bracket, wherein the glasses bracket includes a glasses frame and two temples, each of the two temples including a temple body connected to the glasses frame, at least one of temple bodies of the two temples including an electronic component, the electronic component including:

a component body including a container body and a cover, the container body being hollow to form a cavity, an opening in flow communication with the cavity is arranged in the container body, the cover being arranged on the opening and closes the cavity;

a first microphone element arranged in the cavity;

a second microphone element arranged in the cavity;

a first sound conducting hole arranged on a first sidewall of the component body and configured to conduct a first sound originating from the sound source to the first microphone element; and

a second sound conducting hole arranged on a second sidewall of the component body and configured to conduct a second sound originating from the sound source to the second microphone element.

20. The electronic device of claim 19 , wherein

the each of the two temples further includes a connector that is hinged with, through a hinge, an end of the temple body away from the glasses frame;

the glasses further include a bone conductive loudspeaker, the bone conductive loudspeaker being arranged on the connector, wherein:

the connector is configured to switch the bone conductive loudspeaker, relative to the temple body, between a first position and a second position, and attach the bone conductive loudspeaker on a back of an auricle of a user when the bone conductive loudspeaker is in the first position.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 28, 2023
From: WANG, YUEQIANG; LI, YONGJIAN; CHEN, YUNBIN; ZHANG, HAOFENG
To: SHENZHEN VOXTECH CO., LTD.
Reel/Frame 063781/0476 →
CHANGE OF NAME Recorded May 28, 2023
From: SHENZHEN VOXTECH CO., LTD.
To: SHENZHEN SHOKZ CO., LTD.
Reel/Frame 063781/0481 →
Priority Claims (1)
CN 201810975514.7 · Aug 24, 2018 · national
Continuity (4)
Continuation 17646865 · Jan 3, 2022
Continuation 17172068 · Feb 9, 2021
Continuation PCTCN2019102380 · Aug 24, 2019
Related Publication 20230247338A1 · Aug 3, 2023
References Cited (25)
US 6069963A · Martin et al. · 2000 [cited by applicant]
US 9720258B2 · Reyes · 2017 [cited by applicant]
US 10699691B1 · Ye · 2020 [cited by examiner]
US 20090190026A1 · Chen · 2009 [cited by applicant]
US 20100159755A1 · Lin et al. · 2010 [cited by applicant]
US 20100272304A1 · Thiel · 2010 [cited by examiner]
US 20140185003A1 · Waters · 2014 [cited by examiner]
US 20160112817A1 · Fan et al. · 2016 [cited by applicant]
US 20160246076A1 · Wei · 2016 [cited by examiner]
US 20180213072A1 · Shi et al. · 2018 [cited by applicant]
US 20210027554A1 · Leonov · 2021 [cited by applicant]
US 20210185423A1 · Provost et al. · 2021 [cited by applicant]
US 20210211795A1 · Wang et al. · 2021 [cited by applicant]
US 20210272578A1 · Bacon · 2021 [cited by applicant]
CN 2876825Y · 2007 [cited by applicant]
CN 205982890 · 2017 [cited by examiner]
CN 205982890U · 2017 [cited by applicant]
CN 206301081U · 2017 [cited by applicant]
CN 207731040U · 2018 [cited by applicant]
CN 208783025U · 2019 [cited by applicant]
CN 208849971U · 2019 [cited by applicant]
DE 102012213304A1 · 2014 [cited by applicant]
EP 3273753A1 · 2018 [cited by applicant]
International Search Report in PCT/CN2019/102380 mailed on Oct. 30, 2019, 8 pages. [cited by applicant]
Written Opinion in PCT/CN2019/102380 mailed on Oct. 30, 2019, 12 pages. [cited by applicant]