Thin film transistor
A liquid crystal display device includes a transistor, a pixel electrode, and a common electrode. The transistor includes a first gate electrode on a first substrate, a second gate electrode having a region overlapping the first gate electrode, an oxide semiconductor layer between the first gate electrode and the second gate electrode, a first insulating layer between the first gate electrode and the oxide semiconductor layer, a second insulating layer between the oxide semiconductor layer and the second gate electrode, and a first oxide conductive layer and a second oxide conductive layer disposed between the first insulating layer and the oxide semiconductor layer and disposed with the first gate electrode and the second gate electrode sandwiched from both sides. The pixel electrode is disposed between the first and the second insulating layer; the common electrode is disposed a region overlapping with the pixel electrode and on the second insulating layer.
1. A thin film transistor, comprising:
a first gate electrode;
a second gate electrode overlapping the first gate electrode;
an oxide semiconductor layer between the first gate electrode and the second gate electrode;
a first insulating layer between the first gate electrode and the oxide semiconductor layer;
a second insulating layer between the oxide semiconductor layer and the second gate electrode; and
a conductive layer separated from the first gate electrode and the second gate electrode and sandwiched between the first insulating layer and the oxide semiconductor layer,
wherein the oxide semiconductor layer comprises:
a channel region overlapping the second gate electrode, and
at least one low resistance region adjacent to the channel region and in contact with the conductive layer,
wherein the at least one low resistance region includes an offset region between the channel region and region in contact with the conductive layer,
wherein the at least one low resistance region is formed self-aligned by irradiating a laser beam or an ion beam from second gate electrode side.
2. The thin film transistor according to claim 1 , wherein a width of the offset region is 0.5 μm to 2.0 μm.
3. The thin film transistor according to claim 1 , wherein a width of the second gate electrode is wider than a width of the first gate electrode.
4. The thin film transistor according to claim 3 , wherein the first gate electrode and the second gate electrode are electrically connected.
5. The thin film transistor according to claim 1 , wherein the oxide semiconductor layer covers the top and sides of the conductive layer.
6. The thin film transistor according to claim 1 , wherein the conductive layer comprises an oxide conductive layer on the first insulating layer side and a metal layer on the oxide semiconductor layer side.
7. The thin film transistor according to claim 1 , wherein the oxide semiconductor layer comprises a first region on the first insulating layer side and a second region on the second insulating layer side,
wherein a crystallinity of the first region and a crystallinity of the second region are different.
8. The thin film transistor according to claim 7 , wherein the first region is amorphous, and the second region is crystalline.
9. The thin film transistor according to claim 7 , wherein a thickness of the second region is thinner than a thickness of the first region.
10. The thin film transistor according to claim 7 , wherein a carrier concentration of the second region is lower than a carrier concentration of the first region, in the channel region.
11. The thin film transistor according to claim 7 , wherein a band gap of the second region is wider than a band gap of the first region.
12. The thin film transistor according to claim 11 , wherein the band gap of the first region is in a range of 2.8 eV to 3.9 eV, the band gap of the second region is 4.0 eV or higher.
13. The thin film transistor according to claim 12 , wherein an energy level of bottom of the conduction band in the second region is higher than an energy level of bottom of the conduction band in the first region.
14. The thin film transistor according to claim 13 , wherein the energy level of bottom of the conduction band in the second region is more than 0.3 eV higher than the energy level of bottom of the conduction band in the first region.
15. The thin film transistor according to claim 7 , wherein:
the first region is formed of In 2 O 3 -Ga 2 O 3 -SnO 2 -ZnO based oxide material, In 2 O 3 -Ga 2 O 3 -SnO 2 based oxide material, or In 2 O 3 -Ga 2 O 3 -ZnO based oxide material, and
the second region is formed of Ga 2 O 3 based oxide material, GaSnO x based oxide material, or GaSiO x based oxide material.
16. The thin film transistor according to claim 7 , wherein the first region is formed of InGaZnO x or InGaSnOx, and the second region is formed of Ga 2 O 3 .