Curved imaging sensor package with petal patterned substrate
An imaging sensor package including: an imaging sensor; and a patterned substrate coupled to a surface of the imaging sensor. The imaging sensor and the patterned substrate being curved. The patterned substrate having a petal-shaped patterned area having a first thickness and a base substrate having a second thickness, the first thickness being greater than the second thickness.
1 . An imaging sensor package comprising:
an imaging sensor; and
a patterned substrate coupled to a surface of the imaging sensor, the patterned substrate comprising:
a base substrate having a second thickness; and
a petal-shaped patterned area on the base substrate and having a first thickness, the first thickness being greater than the second thickness,
wherein the imaging sensor and the patterned substrate are curved,
wherein the base substrate has a plurality of corners, and
wherein the petal-shaped patterned area is radially symmetric about a center point, a distance from the center point of the petal-shaped patterned area to an outer edge of the petal-shaped patterned area is greater toward the corners of the base substrate than toward an edge of the base substrate between two adjacent ones of the corners.
2 . The imaging sensor package of claim 1 , wherein the imaging sensor comprises a detector arranged between a readout integrated circuit and an antireflective coating.
3 . The imaging sensor package of claim 2 , wherein the imaging sensor and the patterned substrate are spherically curved.
4 . The imaging sensor package of claim 3 , wherein the petal-shaped patterned area has a central region and a plurality of petal portions extending therefrom.
5 . The imaging sensor package of claim 4 , wherein the base substrate has a rectangular shape having four corners, and
wherein the petal-shaped patterned area has four petal portions respectively extending towards the four corners of the base substrate.
6 . The imaging sensor package of claim 5 , wherein the petal portions are spaced apart from the four corners of the base substrate.
7 . The imaging sensor package of claim 4 , wherein the petal portions are spaced apart from the central region of the petal-shaped pattern area by a portion of the base substrate.
8 . The imaging sensor package of claim 1 , wherein the patterned substrate comprises aluminum, copper, nickel, iron, invar, steel, titanium, molybdenum, tungsten, and/or bismuth.
9 . The imaging sensor package of claim 1 , wherein a planar size of the base substrate is at least the same as that of the imaging sensor, and
wherein a maximum length or width of the petal-shaped patterned area is smaller than a corresponding dimension of the imaging sensor.
10 . The imaging sensor package of claim 9 , further comprising an infill material between the imaging sensor and the patterned substrate.
11 . The imaging sensor package of claim 10 , wherein a thickness of the infill material is greater at an area overlapping the base substrate than at another area overlapping the petal-shaped patterned area.
12 . The imaging sensor package of claim 11 , wherein the infill material comprises a thermosetting polymer, an epoxy, or solder.
13 . A curved imaging sensor package comprising:
a curved imaging sensor comprising a detector and a readout integrated circuit below the detector, the detector comprising a plurality of light detecting elements; and
a curved patterned substrate coupled to a surface of the readout integrated circuit opposite to the detector, the patterned substrate comprising:
a base substrate having a second thickness; and
a petal-shaped patterned area on the base substrate and having a first thickness, the first thickness being greater than the second thickness,
wherein the base substrate has a plurality of corners, and
wherein the petal-shaped patterned area is radially symmetric about a center point, a distance from the center point of the petal-shaped patterned area to an outer edge of the petal-shaped patterned area is greater toward the corners of the base substrate than toward an edge of the base substrate between two adjacent ones of the corners.
14 . The curved imaging sensor package of claim 13 , wherein the petal-shaped patterned area comprises four petals radially extending from a central region, the four petals respectively extending towards the corners of the patterned substrate.
15 . The curved imaging sensor package of claim 14 , wherein the first thickness in a range of 20 μm to 1,000 μm, and
wherein the second thickness is in a range of 20% to 80% of the first thickness.
16 . The curved imaging sensor package of claim 14 , wherein the patterned substrate has ribs extending from each of the four petals, the ribs having a thickness greater that the second thickness.
17 . A method of manufacturing a curved imaging sensor package, the method comprising:
etching a substrate to form a base substrate having a second thickness and a petal-shaped patterned area on the base substrate and having a first thickness, the first thickness being greater than the second thickness;
applying an infill material onto the etched substrate;
adhering an imaging sensor onto the etched substrate to form an imaging sensor package; and
curving the imaging sensor package,
wherein the base substrate has a plurality of corners, and
wherein the petal-shaped patterned area is radially symmetric about a center point, a distance from the center point of the petal-shaped patterned area to an outer edge of the petal-shaped patterned area is greater toward the corners of the base substrate than toward an edge of the base substrate between two adjacent ones of the corners.
18 . The method of claim 17 , wherein the etching the substrate comprises:
applying a photosensitive polymer to a surface of the substrate in the shape of the petal-shaped pattern area; and
wet etching the surface of the substrate to partially remove uncovered areas of the surface of the substrate to form the base substrate.
19 . The method of claim 18 , wherein the applying the infill material comprises applying the infill material to the etched surface of the substrate.
20 . The method of claim 19 , wherein the adhering of the imaging sensor comprises adhering the imaging sensor to the infill material.
21 . A curved imaging sensor package comprising:
a curved imaging sensor comprising a detector and a readout integrated circuit below the detector, the detector comprising a plurality of light detecting elements; and
a curved patterned substrate coupled to a surface of the readout integrated circuit opposite to the detector, the patterned substrate comprising:
a base substrate having a second thickness; and
a petal-shaped patterned area on the base substrate and having a first thickness,
wherein the first thickness is in a range of 20 μm to 1,000 μm, and the second thickness is in a range of 20% to 80% of the first thickness.