IP Library › Granted Patent US 12,485,834
Granted Patent B2
US 12,485,834 · App. 18/299,812 · Granted Dec 2, 2025

Resin-molded article

Inventor: Toshihiko Horie (Tokyo, JP)
Assignee: MORIROKU CO., LTD.
B60R13/04
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Quick Facts
Patent No.
US 12,485,834
App. No.
18/299,812
Granted
Dec 2, 2025
Kind
B2
Abstract

A resin-molded article is fixed to and used on a plate-shaped member formed in a plate shape. The resin-molded article is such that an upper surface contact portion that is contactable with an upper surface of the plate-shaped member, an end surface contact portion that is contactable with an end surface of the plate-shaped member, and a lower surface contact portion that is formed separately from the end surface contact portion and that is contactable with a lower surface of the plate-shaped member are formed integrally with a body portion. It is preferable that an end portion contact surface of the end surface contact portion is disposed in substantially the same direction as the end surface of the plate-shaped member, the end portion contact surface being contactable with the end surface of the plate-shaped member.

Claims (23)

1 . An assembly comprising a resin-molded article and a plate-shaped member that is formed in a plate shape, the resin-molded article being fixed to the plate-shaped member, the plate-shaped member having an upper surface, a lower surface, and an end surface, wherein the resin-molded article comprises:

a body portion;

an upper surface contact portion that is contactable with the upper surface of the plate-shaped member;

an end surface contact portion that is contactable with the end surface of the plate-shaped member; and

a lower surface contact portion that is formed separately from the end surface contact portion and that is contactable with the lower surface of the plate-shaped member,

wherein the upper surface contact portion, the end surface contact portion, and the lower surface contact portion are formed integrally with the body portion.

2 . The assembly according to claim 1 ,

wherein an end portion contact surface of the end surface contact portion and the end surface of the plate-shaped member are substantially parallel to one another, the end portion contact surface being contactable with the end surface of the plate-shaped member.

3 . The assembly according to claim 2 ,

wherein a lower portion contact surface of the lower surface contact portion is formed on a plane substantially perpendicular to the end portion contact surface, the lower portion contact surface being contactable with the lower surface of the plate-shaped member.

4 . The assembly according to claim 1 ,

wherein the end surface contact portion is formed at a position covered by the upper surface contact portion, and

the lower surface contact portion is formed outside a region covered by the upper surface contact portion.

5 . The assembly according to claim 1 ,

wherein a contact portion support portion protruding from the body portion along the plate-shaped member is further provided, and

the end surface contact portion and the lower surface contact portion are formed on an outer surface of the contact portion support portion.

6 . The assembly according to claim 1 ,

wherein the upper surface contact portion connects the body portion to the upper surface of the plate-shaped member, and is inclined with respect to the body portion.

7 . The assembly according to claim 1 ,

wherein the body portion defines an opening portion through which light emitted from below is transmittable, and

the opening portion is surrounded by a peripheral wall extending in an up-down direction.

8 . The assembly according to claim 1 ,

wherein the lower surface contact portion and the end surface contact portion are formed at a distance from each other, leaving a gap for the end face of the plate member to come into it when the resin-molded article is mounted on the plate member.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE APPLICATION NUMBER 18636270 TO APPLICATION NUMBER 18363270 PREVIOUSLY RECORDED ON REEL 71770 FRAME 194. ASSIGNOR(S) HEREBY CONFIRMS THE IN ONE TRANSACTION, MORIROKU TECHNOLOGY COMPANY, LTD., SPUN-OUT A PORTION OF THE COMPANY THAT OWNED THE PATENT APPLICATIONS AND THE SPUN-OUT PORTION, WHICH WAS UNNAMED AFTER JAPANESE LAW, WAS ABSORBED BY MORIROKU CO., LTD.. Recorded Sep 26, 2025
From: MORIROKU TECHNOLOGY COMPANY, LTD.
To: MORIROKU CO., LTD.
Reel/Frame 072874/0645 →
IN ONE TRANSACTION, MORIROKU TECHNOLOGY COMPANY, LTD. SPUN-OUT A PORTION OF THE COMPANY THAT OWNED THE PATENT APPLICATIONS AND THE SPUN-OUT PORTION, WHICH WAS UNNAMED UNDER JAPANESE LAW, WAS ABSORBED BY MORIROKU CO., LTD. Recorded Jun 17, 2025
From: MORIROKU TECHNOLOGY COMPANY, LTD.
To: MORIROKU CO., LTD.
Reel/Frame 071770/0194 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 13, 2023
From: HORIE, TOSHIHIKO
To: MORIROKU TECHNOLOGY COMPANY, LTD.
Reel/Frame 063317/0108 →
Priority Claims (1)
JP 2022-081897 · May 18, 2022 · national
Continuity (1)
Related Publication 20230373408A1 · Nov 23, 2023
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