IP Library Granted Patent US 11,841,256
Granted Patent B2
US 11,841,256 · App. 18/300,615 · Granted Dec 12, 2023

Thermal flow velocity and flow rate sensor, and air conditioner

Inventors: Yuuki Takami (Osaka, JP); Kazunari Fukagawa (Osaka, JP); Ryuuichi Toyota (Osaka, JP); Natsuko Kitagawa (Osaka, JP); Yumi Aomatsu (Osaka, JP)
Assignee: DAIKIN INDUSTRIES, LTD.
G01F1/684F24F11/89F24F2110/10F24F2110/30
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Quick Facts
Patent No.
US 11,841,256
App. No.
18/300,615
Granted
Dec 12, 2023
Kind
B2
Abstract

A thermal flow velocity and flow rate sensor includes: a substrate; a heater mounted on the substrate; a temperature measuring element mounted on the substrate; a joint portion made of a resin filled between the heater and the temperature measuring element and thermally connecting the heater and the temperature measuring element; a lead wire connected to the substrate; and a fastener fixing the lead wire to the substrate. The lead wire is soldered to the substrate. The lead wire and the fastener are coated with the resin.

Claims (30)

1. A thermal flow velocity and flow rate sensor, comprising:

a substrate;

a heater mounted on the substrate;

a temperature sensor mounted on the substrate;

a joint portion made of a resin filled between the heater and the temperature sensor and thermally connecting the heater and the temperature sensor;

a lead wire connected to the substrate; and

a fastener fixing the lead wire to the substrate, wherein

the lead wire is soldered to the substrate, and

the lead wire and the fastener are coated with the resin.

2. The thermal flow velocity and flow rate sensor according to claim 1 , further comprising:

a heat generating portion comprising the heater coated with the resin; and

a temperature measuring portion comprising the temperature sensor coated with the resin.

3. The thermal flow velocity and flow rate sensor according to claim 1 , wherein the substrate is entirely coated with the resin.

4. The thermal flow velocity and flow rate sensor according to claim 2 , wherein an amount of resin on the substrate neither coating the heat generating portion or the temperature measuring portion nor being at the joint portion is larger than an amount of the resin at the joint portion.

5. An air conditioner comprising:

a heat exchanger; and

a thermal flow velocity and flow rate sensor comprising:

a substrate;

a heat generating portion comprising:

a heater mounted on the substrate; and

a resin coating the heater;

a temperature measuring portion comprising:

a temperature sensor mounted on the substrate; and

the resin coating the temperature sensor;

a joint portion thermally connecting the heat generating portion and the temperature measuring portion by means of the resin filled between the heat generating portion and the temperature measuring portion;

a lead wire connected to the substrate; and

a fastener fixing the lead wire to the substrate, wherein

the lead wire is soldered to the substrate,

the lead wire and the fastener are coated with the resin, and

the thermal flow velocity and flow rate sensor is disposed in an air flow in a secondary region of the heat exchanger.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 22, 2023
From: TAKAMI, YUUKI; FUKAGAWA, KAZUNARI; TOYOTA, RYUUICHI; KITAGAWA, NATSUKO; AOMATSU, YUMI
To: DAIKIN INDUSTRIES, LTD.
Reel/Frame 063719/0316 →
Priority Claims (1)
JP 2020-174166 · Oct 15, 2020 · national
Continuity (2)
Continuation PCTJP2021037149 · Oct 7, 2021
Related Publication 20230314195A1 · Oct 5, 2023