Cooling methods for ultrasonic forming and bonding of polymeric webs
Methods and apparatuses for manufacturing portions of absorbent articles may include or facilitate conveying a substrate through a nip formed between a first device and a second device, transmitting vibrational energy from the second device toward the first device via the nip to alter the substrate, and cooling the second device by transferring thermal energy from the second device.
1 . A method of manufacturing portions of absorbent articles comprising:
conveying a substrate through a nip formed between a first device and a second device;
transmitting vibrational energy from the second device toward the first device via the nip to alter the substrate;
providing a projection extending from the second device, wherein the projection is in thermal communication with the second device, and wherein the projection is positioned proximate to a working surface of the second device;
providing insulation on at least part of the second device to reduce condensation, frost, and/or ice accumulation;
cooling the second device by transferring thermal energy from the second device to the projection; and
conveying a chilled fluid over the projection to cool the projection.
2 . The method of claim 1 , wherein the step of cooling the second device comprises cooling the second device at a location that is within about 0.5 mm to about 15 mm from the working surface.
3 . The method of claim 1 , wherein the chilled fluid comprises water, air, oil, or glycol.
4 . The method of claim 1 , wherein the projection comprises a different material than a primary material of the second device.
5 . The method of claim 1 , wherein the projection comprises the same material as a primary material of the second device.
6 . The method of claim 1 , wherein the projection is integral with the second device.
7 . The method of claim 1 , wherein the projection is joined to a portion of the second device.
8 . The method of claim 1 , wherein the second device is a sonotrode, wherein the first device is a rotating anvil, and wherein the vibration energy is ultrasonic energy.
9 . The method of claim 1 , comprising providing a plurality of recesses in an outer surface of the first device, wherein the recesses have a shape configured to produce projections suitable for use in a touch fastener, and wherein the step of transmitting vibrational energy from the second device toward the first device via the nip to alter the substrate comprises locally softening a portion of the substrate to force a portion of the softened material into the recesses to form projections suitable for use in a touch fastener.
10 . The method of claim 1 , comprising conveying a second substrate through the nip, and wherein the step of transmitting vibrational energy from the second device toward the first device via the nip to alter the substrate comprises bonding the substrate to the second substrate.
11 . The method of claim 1 , wherein the step of transmitting vibrational energy from the second device toward the first device via the nip to alter the substrate is intermittent.
12 . The method of claim 1 , comprising:
providing a second projection extending from the second device, wherein the second projection is in thermal communication with the second device and is positioned proximate to the working surface of the second device;
cooling the second device by transferring thermal energy from the second device to the second projection; and
conveying the chilled fluid over the second projection to cool the second projection.
13 . The method of claim 1 , comprising:
providing a cavity in the second device proximate to the working surface of the second device;
conveying a chilled fluid through the cavity; and
cooling the second device by transferring thermal energy from the second device to the chilled fluid.
14 . A method of manufacturing portions of absorbent articles comprising:
conveying a substrate through a nip formed between a first device and a second device;
transmitting vibrational energy from the second device toward the first device via the nip to alter the substrate;
providing a cavity in the second device proximate to a working surface of the second device;
providing insulation on at least part of the second device to reduce condensation, frost, and/or ice accumulation;
conveying a chilled fluid through the cavity; and
cooling the second device by transferring thermal energy from the second device to the chilled fluid.
15 . The method of claim 14 , wherein the step of cooling the second device comprises cooling the second device at a location that is within about 0.5 mm to about 15 mm from the working surface.
16 . The method of claim 14 , wherein the second device is a sonotrode, and wherein the vibration energy is ultrasonic energy.
17 . The method of claim 14 , comprising providing a plurality of recesses in the outer surface of the first device, wherein the recesses have a shape configured to produce projections suitable for use in a touch fastener, and wherein the step of transmitting vibrational energy from the second device toward the first device via the nip to alter the substrate comprises locally softening a portion of the substrate to force a portion of the softened material into the recesses to form projections suitable for use in a touch fastener.
18 . The method of claim 14 , comprising conveying a second substrate through the nip, wherein the step of transmitting vibrational energy from the second device toward the first device via the nip to alter the substrate comprises bonding the substrate to the second substrate.
19 . The method of claim 14 , wherein the step of transmitting vibrational energy from the second device toward the first device via the nip to alter the substrate is intermittent.
20 . The method of claim 14 , comprising:
providing a second cavity in the second device proximate to the working surface of the second device;
conveying the chilled fluid through the second cavity; and
cooling the second device by transferring thermal energy from the second device to the chilled fluid.
21 . The method of claim 14 , comprising providing a projection extending from the second device, wherein the projection is in thermal communication with the second device and is positioned proximate to the working surface of the second device; and
cooling the second device by transferring thermal energy from the second device to the projection.