Wafer placement table
A wafer placement table includes a ceramic plate that has at least a wafer placement part at an upper surface thereof, a cooling plate that is joined to a lower surface of the ceramic plate and that has a refrigerant flow path, gas common paths that are provided above the refrigerant flow path, gas introduction paths that extend from a lower surface of the cooling plate to a corresponding one of the gas common paths, and a plurality of gas distribution paths, that are provided for the gas common paths. The gas distribution path that is disposed at an outermost periphery of the ceramic plate is provided at a position that does not overlap the refrigerant flow path in plan view.
1 . A wafer placement table comprising:
a ceramic plate that has at least a wafer placement part at an upper surface thereof;
an electrostatic electrode that is built in the ceramic plate;
a cooling plate that is joined to a lower surface of the ceramic plate and that has a refrigerant flow path;
a gas common path that is provided, of an inside of the wafer placement table, at a location above the refrigerant flow path and below the electrostatic electrode;
a gas introduction path that extends from a lower surface of the cooling plate to the gas common path; and
a gas distribution path that extends from the gas common path to the upper surface of the ceramic plate, a plurality of the gas distribution paths being provided for the gas common path,
wherein the gas distribution paths have an outermost peripheral gas distribution path that is disposed at an outermost periphery of the ceramic plate, the outermost peripheral gas distribution path is provided at a position that does not overlap the refrigerant flow path in plan view,
wherein a plurality of the gas common paths are concentrically provided, and
wherein the outermost peripheral gas distribution path is connected to, of the plurality of the gas common paths, the gas common path that is positioned at an outermost periphery.
2 . The wafer placement table according to claim 1 , wherein the gas distribution paths are connected to the gas common path through a gas branch part extending in a radial direction of the gas common paths.
3 . The wafer placement table according to claim 1 , wherein at least a portion of the gas distribution path that is connected to the gas common path has a width that is larger than a width of the gas common path.
4 . The wafer placement table according to claim 1 , wherein the cooling plate is made of a composite material of a metal and a ceramic.
5 . The wafer placement table according to claim 1 , wherein the wafer placement part that is formed circularly and a ring-shaped focus ring placement part that surrounds the wafer placement part are provided at the upper surface of the ceramic plate, and
wherein the outermost peripheral gas distribution path is a path that extends from the gas common path to the focus ring placement part.
6 . The wafer placement table according to claim 1 , wherein the wafer placement part that is formed circularly is provided at the upper surface of the ceramic plate, and
wherein the outermost peripheral gas distribution path is a path that extends from the gas common path to the wafer placement part.