Electronic device comprising a light emitting layer and a second metal layer that covers a part of a second insulating layer

1. An electronic device, comprising:

a substrate;

a poly-silicon layer disposed on the substrate;

a first metal layer disposed on the substrate;

a first insulating layer disposed on the first metal layer;

a second insulating layer disposed on the first insulating layer, wherein the first insulating layer is disposed between the first metal layer and the second insulating layer; and

a second metal layer covering a part of the second insulating layer and electrically connected to the first metal layer;

wherein the first metal layer has a first top surface and a first bottom surface, and the first bottom surface is closer to the substrate than the first top surface,

wherein the second metal layer has a second top surface and a second bottom surface, and the second bottom surface is closer to the substrate than the second top surface,

wherein a distance between the first top surface of the first metal layer and the substrate is smaller than a distance between the second top surface of the second metal layer and the substrate,

wherein a thickness of the second insulating layer under the second metal layer is larger than a thickness of the second insulating layer uncovered with the second metal layer, and

wherein the first metal layer comprises a gate electrode.

2. The electronic device as claimed in claim 1 , wherein the second metal layer is opaque.

3. The electronic device as claimed in claim 1 , wherein the second metal layer contacts the first metal layer.

4. The electronic device as claimed in claim 1 , wherein a material of the second metal layer comprises aluminum.

5. The electronic device as claimed in claim 1 , further comprising a first electrode electrically connected to the second metal layer.

6. The electronic device as claimed in claim 5 , further comprising a light emitting layer and a second electrode, wherein the light emitting layer and the second electrode overlap the first electrode, and the light emitting layer is disposed between the first electrode and the second electrode.

7. The electronic device as claimed in claim 5 , further comprising a liquid crystal material and another substrate, wherein the liquid crystal material is disposed between the substrate and the another substrate.

8. The electronic device as claimed in claim 1 , further comprising a display region and a non-display region, wherein the second metal layer is electrically connected to the first metal layer in the non-display region.

9. The electronic device as claimed in claim 1 , wherein at least one of the first metal layer and second metal layer is electrically connected to the poly-silicon layer.

10. The electronic device as claimed in claim 9 , wherein the at least one of the first metal layer and second metal layer contacts the poly-silicon layer.

11. The electronic device as claimed in claim 1 , wherein the first metal layer is disposed between at least a portion of the second metal layer and the substrate.