Radio frequency module and communication device
A radio frequency module includes a module substrate having a first principal surface and a second principal surface, a resin member covering the first principal surface and side surfaces of first and second components disposed on the first principal surface, a metal shield layer covering an upper surface of the resin member, a metal shield wall disposed on the first principal surface, a metal member disposed on the second principal surface, and a via conductor penetrating the module substrate. The metal shield wall is disposed between the first component and the second component when the first principal surface is viewed in plan. An upper end of the metal shield wall is connected to the metal shield layer. The via conductor electrically connects the metal shield wall and the metal member, and at least partially overlaps each of the metal shield wall and the metal member when viewed in plan.
1 . A radio frequency module comprising:
a module substrate having a first principal surface and a second principal surface opposite to the first principal surface;
a first component and a second component arranged on the first principal surface;
a third component disposed on the second principal surface;
a resin member covering the first principal surface, a side surface of the first component, and a side surface of the second component;
a metal layer set to ground potential and covering an upper surface of the resin member;
a first metal wall disposed on the first principal surface and set to the ground potential;
a first metal member disposed on the second principal surface; and
a first via conductor penetrating the module substrate, wherein
the first metal wall is disposed between the first component and the second component when the first principal surface is viewed in plan,
an upper end of the first metal wall is in contact with the metal layer, and
the first via conductor electrically connects the first metal wall and the first metal member, and at least partially overlaps each of the first metal wall and the first metal member when viewed in plan.
2 . The radio frequency module according to claim 1 further comprising:
a fourth component disposed on the second principal surface, wherein
the first metal member is disposed between the third component and the fourth component when viewed in plan.
3 . The radio frequency module according to claim 2 further comprising:
a second metal wall disposed on the second principal surface and set to the ground potential, wherein
the second metal wall is disposed between the third component and the fourth component when viewed in plan.
4 . The radio frequency module according to claim 2 , wherein
the first component includes a power amplifier,
the second component includes a receive filter,
the third component includes a first transmit filter,
the fourth component includes a low noise amplifier,
the first component is disposed on a same side as the third component with respect to the first metal wall when viewed in plan, and
the second component is disposed on a same side as the fourth component with respect to the first metal wall when viewed in plan.
5 . The radio frequency module according to claim 4 further comprising:
a fifth component disposed on the first principal surface;
a sixth component disposed on the second principal surface;
a third metal wall disposed on the first principal surface and set to the ground potential;
a second metal member disposed on the second principal surface; and
a second via conductor penetrating the module substrate, wherein
the third metal wall is disposed between the first component and the fifth component when viewed in plan,
an upper end of the third metal wall is in contact with the metal layer,
the second metal member is disposed between the sixth component and the third component when viewed in plan, and
the second via conductor electrically connects the third metal wall and the second metal member, and at least partially overlaps each of the third metal wall and the second metal member when viewed in plan.
6 . The radio frequency module according to claim 5 , wherein
the fifth component includes a second transmit filter having a pass band different from a pass band of the first transmit filter,
the sixth component includes a control circuit configured to control the power amplifier,
the fifth component is disposed on a same side as the second component with respect to the third metal wall when viewed in plan, and
the third component is disposed on a same side as the fourth component with respect to the third metal wall when viewed in plan.
7 . The radio frequency module according to claim 6 , wherein
a pass band of one of the first transmit filter and the second transmit filter includes a frequency being an integer multiple of a frequency included in a pass band of another of the first transmit filter and the second transmit filter.
8 . The radio frequency module according to claim 1 , wherein
the first metal member is a metal wall.
9 . The radio frequency module according to claim 1 , wherein
the first metal member is an electrode terminal.
10 . The radio frequency module according to claim 1 , wherein
at least a part of an overlap of the first metal wall and the first via conductor when viewed in plan overlaps the first metal member when viewed in plan.
11 . The radio frequency module according to claim 1 , wherein
any one component of the first component, the second component, and the third component has a ground terminal, and
the radio frequency module further comprises:
a metal conductor configured to connect the ground terminal and the first via conductor.
12 . The radio frequency module according to claim 11 , wherein
the one component having the ground terminal includes a power amplifier or a filter.
13 . The radio frequency module according to claim 1 , wherein
the first component includes a power amplifier or a first transmit filter, and
a part of the first component is in contact with the metal layer.
14 . The radio frequency module according to claim 1 , wherein
a thickness of the first metal member is thicker than a thickness of the first metal wall.
15 . The radio frequency module according to claim 1 further comprising:
a metal conductor connected to the first via conductor and provided inside the module substrate in parallel with the first principal surface.
16 . A communication device comprising:
an RF signal processing circuit configured to process a radio frequency signal transmitted and received by an antenna; and
the radio frequency module according to claim 1 , configured to transmit the radio frequency signal between the antenna and the RF signal processing circuit.
17 . The radio frequency module according to claim 3 , wherein
the first component includes a power amplifier,
the second component includes a receive filter,
the third component includes a first transmit filter,
the fourth component includes a low noise amplifier,
the first component is disposed on a same side as the third component with respect to the first metal wall when viewed in plan, and
the second component is disposed on a same side as the fourth component with respect to the first metal wall when viewed in plan.
18 . The radio frequency module according to claim 2 , wherein
the first metal member is a metal wall.
19 . The radio frequency module according to claim 3 , wherein
the first metal member is a metal wall.
20 . The radio frequency module according to claim 4 , wherein
the first metal member is a metal wall.