TRANSFERRING APPARATUS CONFIGURED TO TRANSFER ELECTRONIC COMPONENT, METHOD OF BONDING ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE DISPLAY

1 . A transferring apparatus configured to transfer an electronic component comprising:

a first carrier, configured to carry an objective substrate;

a second carrier, configured to carry a transfer substrate;

an actuator mechanism, configured to actuate the first carrier and the second carrier to move close to and away from each other; and

a flexible push generator, disposed near the first carrier or the second carrier and generating a flexible push to the objective substrate or the transfer substrate that are carried when the first carrier and the second carrier are actuated in a way close to each other.

2 . The transferring apparatus configured to transfer the electronic component according to claim 1 , wherein the flexible push generator comprises a gas-filled airbag.

3 . The transferring apparatus configured to transfer the electronic component according to claim 1 , wherein the flexible push generator comprises a pouch, the pouch is configured to be connected to a gas pump mechanism, when the first carrier and the second carrier are actuated in a way close to each other, the gas pump mechanism inflates the pouch, and when the first carrier and the second carrier are actuated in a way away from each other, the gas pump mechanism extracts at least a portion of gas out of the pouch.

4 . The transferring apparatus configured to transfer the electronic component according to claim 1 , further comprising a laser generator, disposed near the first carrier or the second carrier, and configured to generate a laser beam on the objective substrate and/or the transfer substrate.

5 . A method of bonding an electronic component, comprising:

providing a transfer substrate comprising a side on which the electronic component is disposed;

providing an objective substrate having a bonded side and a non-bonded side;

making the side of the transfer substrate in which the electronic component is disposed face the bonded side of the objective substrate;

making the transfer substrate and the objective substrate approach each other until the electronic component contacts the bonded side of the objective substrate;

applying a flexible push to a side of the transfer substrate on which the electronic component is not disposed or the non-bonded side of the objective substrate; and

applying an energy beam to the electronic component, so that the electronic component is released from the transfer substrate and bonded on the bonded side of the objective substrate.

6 . The method of bonding the electronic component according to claim 5 , wherein the flexible push is generated by an airbag pushing the side of the transfer substrate that is not provided with the electronic component or the non-bonded side of the objective substrate.

7 . The method of bonding the electronic component according to claim 6 , wherein the airbag is produced by inflating a pouch.

8 . The method of bonding the electronic component according to claim 5 , wherein the energy beam is a laser beam.

9 . The method of bonding the electronic component according to claim 5 , wherein the electronic component is a light-emitting diode.

10 . The method of bonding the electronic component according to claim 5 , wherein the objective substrate is a thin film transistor substrate.

11 . A method for manufacturing a light-emitting diode display, comprising bonding a light-emitting diode using the method for bonding the electronic component according to claim 9 .