Patent Assignment
Reel/Frame 067773/0680
Change of Name
Recorded: 2024-06-20
Pages: 12
Assignor
STROKE PRECISION ADVANCED ENGINEERING CO., LTD.
Executed: 2024-05-24
Assignee
MICRAFT SYSTEM PLUS CO., LTD.
6 F., NO. 609, SEC. 1, WANSHOU RD., GUISHAN DIST., TAOYUAN CITY, TAIWAN
Covered Properties
(18)
Method of Chip Transferring and Device/Module Having Gas Guiding Structures with Suction Openings and Intake Opening to Apply Predetermined Pressure Uniformly on Back Side of Transferring Substrate
Transferring Apparatus and Method for Transferring Electronic Component
Application:
17/505,633 →
Publication:
US 2022/0223460
Method for Transferring Electronic Device
Apparatus for Transferring Electronic Component, Method for Transferring Electronic Component and Manufacturing Method of Light-Emitting Diode Panel
Apparatus for Transferring Electronic Component from Flexible Carrier Substrate to Flexible Target Substrate and Method of Transferring Electronic Component
Transferring Apparatus Configured to Transfer Electronic Component, Method of Bonding Electronic Component, and Method for Manufacturing Light-Emitting Diode Display
Application:
18/304,319 →
Publication:
US 2023/0402562
Device Configured to Bond an Electronic Component, Method for Bonding an Electronic Component, and Method for Manufacturing a Light-Emitting Diode Display
Apparatus for Transferring Electronic Component and Method for Bonding Electronic Component by Applying Flexible Pushes, and Method for Manufacturing Led Display
Application:
18/447,320 →
Publication:
US 2024/0105671
Apparatus Configured to Transfer Electronic Component, Method for Bonding Electronic Component, and Method for Manufacturing Light-Emitting Diode Display, Which Apply a Flexible Push
Application:
18/450,429 →
Publication:
US 2024/0145427
Apparatus for Bonding Electronic Component, Method for Bonding Electronic Component, and Method for Manufacturing Light-Emitting Diode Display
Application:
18/518,457 →
Publication:
US 2024/0203934
Method for Repairing an Electronic Substrate and Method for Making an Led Display
Application:
18/638,671 →
Publication:
US 2024/0404437
Apparatus and Method for Partially Flattening a Substrate, Bonding an Electronic Component, and Manufacturing a Display
Application:
18/639,981 →
Publication:
US 2025/0022836
Method and Device for Repairing Semiconductor Chips
Chip Mounting System and Method for Mounting Chips
Method for Manufacturing Light-Emitting Module
Micro Led Display and Method of Manufacturing the Same
Led Chip Mounting Method and Device
Method for Transferring Electronic Device
Related Assignments
(20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 10, 2018
From: LIAO, CHIEN-SHOU
To: ASTI GLOBAL INC., TAIWAN
Reel/Frame 044582/0568 →
Assignment of Assignor's Interest
Jan 10, 2018
From: LIAO, CHIEN-SHOU
To: ASTI GLOBAL INC., TAIWAN
Reel/Frame 044585/0834 →
Assignment of Assignor's Interest
Sep 5, 2018
From: LIAO, CHIEN-SHOU
To: ASTI GLOBAL INC., TAIWAN
Reel/Frame 046789/0243 →
Assignment of Assignor's Interest
Jan 2, 2019
From: LIAO, CHIEN-SHOU
To: ASTI GLOBAL INC., TAIWAN
Reel/Frame 048000/0845 →
Assignment of Assignor's Interest
Apr 15, 2019
From: LIAO, CHIEN-SHOU
To: ASTI GLOBAL INC., TAIWAN
Reel/Frame 048886/0134 →
Assignment of Assignor's Interest
Nov 1, 2021
From: HUANG, SHENG CHE
To: ASTI GLOBAL INC., TAIWAN
Reel/Frame 057972/0575 →
Assignment of Assignor's Interest
Nov 30, 2021
From: LIAO, CHIEN-SHOU; HUANG, SHAO-WEI; LIN, CHING-JU
To: ASTI GLOBAL INC., TAIWAN
Reel/Frame 058233/0798 →
Assignment of Assignor's Interest
Jan 20, 2022
From: HUANG, YU-MIN; HUANG, SHENG CHE; LIN, CHINGJU; WANG, WEI-HAO
To: ASTI GLOBAL INC., TAIWAN
Reel/Frame 058701/0822 →
Assignment of Assignor's Interest
May 19, 2022
From: ASTI GLOBAL INC., TAIWAN
To: STROKE PRECISION ADVANCED ENGINEERING CO., LTD.
Reel/Frame 059952/0616 →
Assignment of Assignor's Interest
May 23, 2022
From: CHUAN, KUO-PIN; HUANG, SHENG-CHE; HUANG, SHU-HSIEN
To: ASTI GLOBAL INC., TAIWAN
Reel/Frame 059978/0355 →
Assignment of Assignor's Interest
May 26, 2022
From: ASTI GLOBAL INC., TAIWAN
To: STROKE PRECISION ADVANCED ENGINEERING CO., LTD.
Reel/Frame 060033/0425 →
Assignment of Assignor's Interest
Jun 1, 2022
From: ASTI GLOBAL INC., TAIWAN
To: STROKE PRECISION ADVANCED ENGINEERING CO., LTD.
Reel/Frame 060077/0599 →
Assignment of Assignor's Interest
Aug 16, 2022
From: LIN, CHINGJU; WU, YI XIAN
To: STROKE PRECISION ADVANCED ENGINEERING CO., LTD.
Reel/Frame 060813/0631 →
Assignment of Assignor's Interest
Apr 26, 2023
From: LIN, CHINGJU; HUANG, JIA WEI
To: STROKE PRECISION ADVANCED ENGINEERING CO., LTD.
Reel/Frame 063454/0872 →
Assignment of Assignor's Interest
Jun 28, 2023
From: LIN, CHINGJU; HUANG, SHENG-CHE; HUANG, SHAO-WEI
To: STROKE PRECISION ADVANCED ENGINEERING CO., LTD.
Reel/Frame 064105/0730 →
Assignment of Assignor's Interest
Aug 11, 2023
From: LIAO, CHIEN-SHOU; LIN, CHINGJU
To: STROKE PRECISION ADVANCED ENGINEERING CO., LTD.
Reel/Frame 064558/0176 →
Assignment of Assignor's Interest
Aug 22, 2023
From: LIN, CHINGJU
To: STROKE PRECISION ADVANCED ENGINEERING CO., LTD.
Reel/Frame 064670/0747 →
Assignment of Assignor's Interest
Nov 27, 2023
From: LIN, CHINGJU; HUANG, SHENG-CHE
To: STROKE PRECISION ADVANCED ENGINEERING CO., LTD.
Reel/Frame 065672/0996 →
Assignment of Assignor's Interest
Apr 24, 2024
From: LI, MINCHI; DU, MING FENG
To: STROKE PRECISION ADVANCED ENGINEERING CO., LTD.
Reel/Frame 067200/0342 →
Assignment of Assignor's Interest
Apr 25, 2024
From: LIN, CHINGJU
To: STROKE PRECISION ADVANCED ENGINEERING CO., LTD.
Reel/Frame 067216/0230 →