Granted Patent B2

US 12,646,432 · App. 18/638,671 · Granted Jun 2, 2026

Inventors: Minchi Li (Taoyuan City, TW); Ming Feng Du (Taoyuan City, TW)

Assignee: Stroke Precision Advanced Engineering Co., Ltd.

G09G3/006H10W90/00G09G2330/08

Abstract

Claims (11)

1 . A method for repairing an electronic substrate by removing a bad electronic component from a pad on the electronic substrate using steps of:

providing a control pad image;

providing an image of the pad with which the bad electronic component is bonded;

comparing the image of the pad with which the bad electronic component is bonded with the control pad image to determine a difference between the said images;

generating a positioning directive based on the difference, and following the positioning directive to position the bad electronic component; and

applying an energy beam onto the positioned bad electronic component to deconstruct a bonding between the positioned bad electronic component and the pad.

2 . The method for repairing an electronic substrate according to claim 1 , wherein the energy beam is a laser beam.

3 . The method for repairing an electronic substrate according to claim 1 , wherein the electronic component is an LED chip.

4 . A method for making an LED display, comprising:

performing the method for repairing an electronic substrate according to claim 3 to repair the LED chip on the electronic substrate.

5 . The method for making an LED display according to claim 4 , wherein the electronic substrate is a thin film transistor (TFT) substrate.

Assignments (2)

Priority Claims (1)

Continuity (1)

References Cited (12)