IP Library Assignment 065672/0996
Patent Assignment
Reel/Frame 065672/0996

Assignment of Assignor's Interest

Recorded: 2023-11-27 Pages: 4
Assignors
LIN, CHINGJU
Executed: 2023-11-21
HUANG, SHENG-CHE
Executed: 2023-11-21
Assignee
STROKE PRECISION ADVANCED ENGINEERING CO., LTD.
6F., NO. 609, SEC. 1, WANSHOU RD., GUISHAN DIST.,, TAOYUAN CITY, 33350, TAIWAN
Covered Property (1)
Apparatus for Bonding Electronic Component, Method for Bonding Electronic Component, and Method for Manufacturing Light-Emitting Diode Display
Application: 18/518,457 →
Publication: US 2024/0203934
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jun 20, 2024
From: STROKE PRECISION ADVANCED ENGINEERING CO., LTD.
To: MICRAFT SYSTEM PLUS CO., LTD.
Reel/Frame 067773/0680 →