APPARATUS FOR BONDING ELECTRONIC COMPONENT, METHOD FOR BONDING ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE DISPLAY
An apparatus for bonding an electronic component including a first carrier, a second carrier, a driving mechanism, and a substrate adjustment mechanism is disclosed. The first carrier is configured to carry a first substrate and has a first carrying surface. The second carrier is configured to carry a second substrate and has a second carrying surface. The driving mechanism enables the first carrier and the second carrier to act in close proximity to each other and far away from each other. The substrate adjustment mechanism enables the first substrate and the second substrate disposed to be in a non-parallel configuration.
1 . An apparatus for bonding an electronic component, comprising:
a first carrier configured to carry a first substrate and having a first carrying surface;
a second carrier configured to carry a second substrate having the electronic component to be bonded, and having a second carrying surface;
a driving mechanism enabling the first carrier and the second carrier to move close to and far away from each other;
a substrate adjustment mechanism enabling the carried first substrate and the carried second substrate to be in a non-parallel configuration; and
an energy beam generator generating an energy beam towards the first carrier and the second carrier.
2 . The apparatus for bonding an electronic component according to claim 1 , wherein the substrate adjustment mechanism comprises two suction nozzles disposed opposite to each other and disposed near the second carrier, the two suction nozzles are not located at positions between the first carrying surface and the second carrying surface and suck air in a direction away from the second carrying surface.
3 . The apparatus for bonding an electronic component according to claim 1 , wherein the substrate adjustment mechanism arranges the first carrier and the second carrier in a way that the first carrying surface and the second carrying surface are in a non-parallel configuration.
4 . The apparatus for bonding an electronic component according to claim 1 , wherein the energy beam is a laser beam.
5 . A method for bonding an electronic component, comprising:
providing a first substrate having a bonded surface;
providing a second substrate having a surface on which the electronic component to be bonded is disposed;
placing the first substrate and the second substrate in a way that the bonded surface of the first substrate faces the surface of the second substrate on which the electronic component to be bonded is disposed;
arranging the first substrate and the second substrate to be in a non-parallel configuration;
moving the first substrate and/or the second substrate to approach each other in the non-parallel configuration till the first substrate contacts the second substrate at a contact region;
continuing to move the first substrate and/or the second substrate to achieve a full contact of the first substrate and the second substrate from the mere contact of the contact region; and
applying an energy beam to bond the electronic component from the second substrate onto the bonded surface of the first substrate.
6 . The method for bonding an electronic component according to claim 5 , wherein the contact region is located in a central area of the first substrate and the second substrate.
7 . The method for bonding an electronic component according to claim 5 , wherein the contact region is located in a peripheral area of the first substrate and the second substrate.
8 . The method for bonding an electronic component according to claim 5 , wherein the energy beam is a laser beam.
9 . The method for bonding an electronic component according to claim 5 , wherein the electronic component is a light-emitting diode.
10 . A method for manufacturing a light-emitting diode display, comprising:
bonding the light-emitting diode using the method for bonding an electronic component according to claim 9 .