APPARATUS CONFIGURED TO TRANSFER ELECTRONIC COMPONENT, METHOD FOR BONDING ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE DISPLAY
An apparatus configured to transfer an electronic component, including a first carrier, a second carrier, an actuator mechanism, and a flexible push generator, is provided. The first carrier is configured to carry a target substrate. The second carrier is configured to carry a transfer substrate. The actuator mechanism is configured to actuate the first and second carriers to move close to and away from each other. The flexible push generator generates a flexible push to the carried target substrate or transfer substrate when the first and second carriers move close to each other. When the flexible push is starting to be generated, a flexible push generated on a central area of the target substrate or the transfer substrate is greater than that on a surrounding area. A method for bonding an electronic component and a method for manufacturing a light-emitting diode display are also provided.
1 . An apparatus configured to transfer an electronic component, comprising:
a first carrier, configured to carry a target substrate;
a second carrier, configured to carry a transfer substrate;
an actuator mechanism, configured to actuate the first carrier and the second carrier to move close to and away from each other; and
a flexible push generator, disposed near the first carrier or the second carrier and applying a flexible push to the target substrate or the transfer substrate when the first carrier and the second carrier move close to each other, wherein the flexible push is in a greater magnitude onto a central portion of the target substrate or of the transfer substrate than onto a peripheral portion of the target substrate or of the transfer substrate at the start of the flexible push being applied.
2 . The apparatus configured to transfer an electronic component according to claim 1 , wherein the flexible push generator comprises an inflator and an air bag connected to the inflator, and the inflator inflates the air bag.
3 . The apparatus configured to transfer an electronic component according to claim 1 , further comprising a laser generator, disposed near the first carrier or the second carrier and generating a laser beam toward the first carrier or the second carrier.
4 . A method for bonding an electronic component, comprising:
providing a transfer substrate having a carrying surface on which the electronic component to be bonded is disposed and a non-carrying surface which is opposite to the carrying surface;
providing a target substrate having a bonded surface and a non-bonded surface which is opposite to the bonded surface;
arranging the carrying surface of the transfer substrate to face the bonded surface of the target substrate;
making the transfer substrate and the target substrate approach each other until the electronic component is in contact with the bonded surface of the target substrate;
applying a flexible push to the non-carrying surface of the transfer substrate or to the non-bonded surface of the target substrate, wherein the flexible push is in a greater magnitude onto a central portion of the non-carrying surface or of the non-bonded surface than onto a peripheral portion of the non-carrying surface or of the non-bonded surface at the start of the flexible push being applied; and
applying an energy beam to bond the electronic component on the bonded surface of the target substrate from the transfer substrate.
5 . The method for bonding an electronic component according to claim 4 , wherein the flexible push reaches a universal magnitude gradually from the central portion to the peripheral portion of the non-carrying surface or of the non-bonded surface.
6 . The method for bonding an electronic component according to claim 4 , wherein the flexible push is generated by inflating an air bag.
7 . The method for bonding an electronic component according to claim 4 , wherein the energy beam is a laser beam.
8 . The method for bonding an electronic component according to claim 4 , wherein the electronic component is a light-emitting diode.
9 . The method for bonding an electronic component according to claim 4 , wherein the target substrate is a thin film transistor substrate.
10 . A method for manufacturing a light-emitting diode display, comprising bonding a light-emitting diode using the method for bonding an electronic component according to claim 8 .