Multichip package with protocol-configurable data paths
Integrated circuit packages with multiple integrated circuit dies are provided. A multichip package may include a substrate, a main die that is mounted on the substrate, and multiple transceiver daughter dies that are mounted on the substrate and that are coupled to the main die via corresponding Embedded Multi-die Interconnect Bridge (EMIB) interconnects formed in the substrate. Each of the main die and the daughter dies may include configurable adapter circuitry for interfacing with the EMIB interconnects. The adapter circuitry may include FIFO buffer circuits operable in a 1× mode or 2× mode and configurable in a phase-compensation mode, a clock-compensation mode, an elastic mode, and a register bypass mode to help support a variety of communications protocols with different data width and clocking requirements. The adapter circuitry may also include boundary alignment circuitry for reconstructing (de)compressed data streams.
1. A system comprising:
a first die of a first single package multi-die device having first input/output circuitry; and
a second die of the first single package multi-die device communicatively coupled to the first die, wherein the second die comprises second input/output circuitry configurable to operate in:
a first mode in which a read clock frequency or a write clock frequency is a first frequency; and
a second mode in which the read clock frequency or the write clock frequency is a second frequency that is different than the first frequency.
2. The system of claim 1 , wherein the second frequency is double the first frequency.
3. The system of claim 1 , wherein the first input/output circuitry is configurable to operate in the first mode and the second mode.
4. The system of claim 1 , comprising a second single package multi-die device having a third die, wherein the third die comprises third input/output circuitry and is communicatively coupled to the second die.
5. The system of claim 1 , wherein:
in the first mode, the write clock frequency is the first frequency; and
in the second mode, the write clock frequency is the second frequency.
6. The system of claim 1 , wherein:
in the first mode, the read clock frequency is the first frequency; and
in the second mode, the read clock frequency is the second frequency.
7. The system of claim 1 , wherein the second die comprises an integrated circuit die.
8. The system of claim 7 , wherein:
the integrated circuit die is a first processor die; and
the first die is a second processor die.
9. The system of claim 7 , wherein:
the integrated circuit die comprises programmable logic; and
the first die is a transceiver die.
10. A single package multi-die electronic device, comprising:
a first die of the single package multi-die electronic device, wherein the first die comprises first input/output circuitry; and
a second die of the single package multi-die electronic device communicatively coupled to the first die, wherein the second die comprises second input/output circuitry configurable to operate in:
a first mode in which a read clock frequency or a write clock frequency is a first frequency; and
a second mode in which the read clock frequency or the write clock frequency is a second frequency that is different than the first frequency.
11. The single package multi-die electronic device of claim 10 , wherein the second die is configurable to switch between operating in the first and second modes.
12. The single package multi-die electronic device of claim 10 , wherein the second die comprises programmable logic.
13. The single package multi-die electronic device of claim 10 , wherein the first die is communicatively coupled to the second die via the first input/output circuitry.
14. The single package multi-die electronic device of claim 10 , comprising:
a third die having third input/output circuitry configurable to operate in the first mode and the second mode; and
a fourth die having fourth input/output circuitry configurable to operate in the first mode and the second mode.
15. The single package multi-die electronic device of claim 10 , wherein:
the second input/output circuitry is configurable to operate in the first mode and the second mode; and
the first input/output circuitry and the second input/output circuitry are configurable to simultaneously operate in the first mode.
16. The single package multi-die electronic device of claim 10 , wherein:
the read clock frequency corresponds to a frequency of a read clock signal;
the write clock frequency corresponds to a frequency of a write clock signal; and
the read clock signal and the write clock signal are generated based on the same clock source.
17. The single package multi-die electronic device of claim 10 , wherein the second frequency is double the first frequency.
18. A single package multi-die electronic device, comprising:
a first die of the single package multi-die electronic device, wherein the first die comprises first input/output circuitry;
a second die of the single package multi-die electronic device communicatively coupled to the first die, wherein the second die comprises second input/output circuitry configurable to operate in:
a first mode in which a read clock frequency or a write clock frequency is a first frequency; and
a second mode in which the read clock frequency or the write clock frequency is a second frequency that is different than the first frequency; and
a third die of the single package multi-die electronic device, wherein the third die comprises third input/output circuitry.
19. The single package multi-die electronic device of claim 18 , wherein:
in the first mode, the write clock frequency is the first frequency; and
in the second mode, the write clock frequency is the second frequency.
20. The single package multi-die electronic device of claim 18 , wherein:
in the first mode, the read clock frequency is the first frequency; and
in the second mode, the read clock frequency is the second frequency.