Electronic device and method for manufacturing the same

1 . An electronic device, comprising:

a substrate having a first surface;

an electronic component disposed on the substrate and having a second surface away from the first surface;

a first optical component disposed on the substrate and the electronic component and having a third surface adjacent to the first surface; and

a first optical adhesive disposed between the substrate and the first optical component to bond the substrate and the first optical component,

wherein a Young's modulus of the first optical adhesive ranges between 10 kPa and 150 kPa,

wherein there is a first distance between the second surface of the electronic component and the first surface of the substrate, there is a second distance between the third surface of the first optical component and the first surface of the substrate, and the first distance and the second distance satisfy the following equation:

T 1×1.5< T 2≤3 mm, and

wherein T 1 is the first distance and T 2 is the second distance.

2 . The electronic device of claim 1 , further comprising: a reflective structure disposed on the substrate and adjacent to the electronic component, wherein there is a gap between the reflective structure and the electronic component, and the gap ranges between 0.05 mm and 0.25 mm.

3 . The electronic device of claim 2 , wherein the reflective structure comprises a white reflective layer, a metal reflective layer, an enhanced specular reflector or a combination thereof.

4 . The electronic device of claim 2 , wherein the reflective structure has an opening, and the electronic component is disposed correspondingly to the opening.

5 . The electronic device of claim 1 , further comprising: a reflective structure disposed on the substrate, wherein the substrate and the reflective structure have a through hole penetrating the substrate and the reflective structure, and the electronic component is disposed correspondingly to the through hole.

6 . The electronic device of claim 5 , wherein the electronic component overlaps the through hole in a normal direction of the substrate.

7 . The electronic device of claim 5 , wherein a conductive material is disposed in the through hole.

8 . The electronic device of claim 1 , further comprising: a second optical component and a second optical adhesive, wherein the second optical component and the second optical adhesive are respectively disposed on the first optical component, and the second optical adhesive is disposed between the first optical component and the second optical component.

9 . A method for manufacturing an electronic device, comprising the following steps:

providing a substrate;

disposing an electronic component on the substrate;

disposing a reflective structure on the substrate and adjacent to the electronic component; and

adhering a first optical adhesive on the substrate and the electronic component and performing a vacuuming step, wherein a temperature of the vacuuming step ranges between 10° C. and 70° C.

10 . The method of claim 9 , further comprising a step of: adhering the first optical adhesive to an optical component before the step of adhering the first optical adhesive on the substrate and the electronic component.

11 . An electronic device, comprising:

a substrate;

an electronic component disposed on the substrate;

a reflective structure disposed on the substrate and adjacent to the electronic component;

a first optical component disposed on the substrate and the electronic component; and

a first optical adhesive disposed between the substrate and the first optical component to bond the substrate and the first optical component,

wherein there is a gap between the reflective structure and the electronic component, and the gap ranges between 0.05 mm and 0.25 mm.

12 . The electronic device of claim 11 , wherein the reflective structure comprises a white reflective layer, a metal reflective layer, an enhanced specular reflector or a combination thereof.

13 . The electronic device of claim 11 , wherein the reflective structure has an opening, and the electronic component is disposed correspondingly to the opening.

14 . The electronic device of claim 11 , wherein the substrate has a first surface, the electronic component has a second surface away from the first surface, and the first optical component has a third surface adjacent to the first surface; wherein there is a first distance between the second surface of the electronic component and the first surface of the substrate, there is a second distance between the third surface of the first optical component and the first surface of the substrate, and the first distance and the second distance satisfy the following equation:

T 1×1.5< T 2≤3 mm

wherein T 1 is the first distance and T 2 is the second distance.

15 . The electronic device of claim 11 , wherein the substrate and the reflective structure have a through hole penetrating the substrate and the reflective structure, and the electronic component is disposed correspondingly to the through hole.

16 . The electronic device of claim 15 , wherein the electronic component overlaps the through hole in a normal direction of the substrate.

17 . The electronic device of claim 15 , wherein a conductive material is disposed in the through hole.

18 . The electronic device of claim 11 , further comprising: a second optical component and a second optical adhesive, wherein the second optical component and the second optical adhesive are respectively disposed on the first optical component, and the second optical adhesive is disposed between the first optical component and the second optical component.