Component array including one or more heat sink layers
A component array can include a first multilayer ceramic component having a first terminal at a first end and a second terminal at a second end opposite the first end in a first direction. A second component can have a first terminal at a first end and a second terminal at a second end opposite the first end in the first direction. A heat sink layer can be arranged between the first component and the second component in a second direction that is perpendicular to the first direction. The heat sink layer can include a first metallization layer electrically connecting the first terminal of the first multilayer ceramic component with the first terminal of the second multilayer ceramic component and a second metallization layer electrically connecting the second terminal of the first multilayer ceramic component with the second terminal of the second multilayer ceramic component.
1. A component array comprising:
a first multilayer ceramic component having a first terminal at a first end and a second terminal at a second end opposite the first end in a first direction;
a second multilayer ceramic component spaced apart from the first multilayer ceramic component in a second direction that is perpendicular to the first direction, the second multilayer ceramic component having a first terminal at a first end and a second terminal at a second end opposite the first end in the first direction;
a heat sink layer arranged between the first multilayer ceramic component and the second multilayer ceramic component in the second direction;
a first metallization layer formed on the heat sink layer and electrically connecting the first terminal of the first multilayer ceramic component with the first terminal of the second multilayer ceramic component; and
a second metallization layer formed on the heat sink layer and electrically connecting the second terminal of the first multilayer ceramic component with the second terminal of the second multilayer ceramic component,
wherein the component array has a power capacity greater than about 0.1 W.
2. The component array of claim 1 , wherein the heat sink layer comprises a material having a thermal conductivity from about 150 W/m·° C. to about 300 W/m ·° C. at about 22° C.
3. The component array of claim 1 , wherein the heat sink layer comprises aluminum nitride.
4. The component array of claim 1 , wherein the heat sink layer comprises beryllium oxide.
5. The component array of claim 1 , wherein the second multilayer ceramic component comprises a top planar surface, and the first multilayer ceramic component comprises a bottom planar surface, wherein the heat sink layer is arranged between the top planar surface of the second multilayer ceramic component and the bottom planar surface of the first multilayer ceramic component.
6. The component array of claim 5 , wherein the heat sink layer comprises a top planar surface and a bottom planar surface, and wherein the top planar surface of the heat sink layer is opposite the bottom planar surface of the first multilayer ceramic component, and the bottom planar surface of the heat sink layer is opposite the top planar surface of the second multilayer ceramic component.
7. The component array of claim 6 , wherein the first metallization layer is formed on each of the top planar surface of the heat sink layer and the bottom planar surface of the heat sink layer.
8. The component array of claim 6 , wherein the heat sink layer comprises a third metallization formed on at least one of the top planar surface of the heat sink layer or the bottom planar surface of the heat sink layer, the third metallization electrically isolated from each of the first metallization layer and the second metallization layer.
9. The component array of claim 6 , wherein the heat sink layer comprises a third metallization layer formed on the top planar surface of the heat sink layer and a fourth metallization layer formed on the bottom planar surface of the heat sink, the third metallization layer electrically isolated from each of the first metallization layer and the second metallization layer.
10. The component array of claim 6 , wherein the heat sink layer comprises a third metallization layer electrically isolated from each of the first metallization layer and the second metallization layer, the third metallization layer comprising a first portion formed on the top planar surface of the heat sink layer, a second portion formed on the bottom planar surface of the heat sink, and a third portion connecting the first portion and the third portion.
11. The component array of claim 1 , wherein one or more of the first multilayer ceramic component and the second multilayer ceramic component comprises one or more of a capacitor, a varistor, and a resistor.
12. The component array of claim 1 , wherein the first multilayer ceramic component comprises a first capacitor and the second multilayer ceramic component comprises a second capacitor.
13. The component array of claim 1 , further comprising a lead frame electrically coupled with the first terminal of the first multilayer ceramic component, the first terminal of the second multilayer ceramic component, and the first metallization layer formed on the heat sink layer.
14. The component array of claim 13 , wherein the lead frame comprises at least one lead that extends in the second direction for mounting the array to a mounting surface such that the second direction is perpendicular to the mounting surface.
15. The component array of claim 13 , wherein the lead frame comprises at least one lead that extends in a third direction that is perpendicular to each of the first direction and the second direction.
16. The component array of claim 1 , wherein the heat sink layer has a thickness in the second direction that ranges from about 0.1 mm to about 5 mm.
17. The component array of claim 1 , the array has a length in the first direction and a width in a third direction that is perpendicular to each of the first direction and the second direction, and wherein the length of the array is greater than the width of the array.
18. The component array of claim 1 , the array has a length in the first direction and a width in a third direction that is perpendicular to each of the first direction and the second direction, and wherein the width of the array is greater than the length of the array.
19. A method of manufacturing a component array, the method comprising:
obtaining a first multilayer ceramic component having a first terminal at a first end and a second terminal at a second end opposite the first end in a first direction;
obtaining a second multilayer ceramic component spaced apart from the first multilayer ceramic component in a second direction that is perpendicular to the first direction, the second multilayer ceramic component having a first terminal at a first end and a second terminal at a second end opposite the first end in the first direction; and
arranging a heat sink layer between the first multilayer ceramic component and the second component in the second direction such that a first metallization layer of the heat sink layer electrically connects the first terminal of the first multilayer ceramic component with the first terminal of the second multilayer ceramic component, and such that a second metallization layer of the heat sink layer electrically connects the second terminal of the first multilayer ceramic component with the second terminal of the second multilayer ceramic component,
wherein the component array has a power capacity greater than about 0.1 W.
20. The method of claim 19 , further comprising coupling a lead frame with the first metallization layer formed on the heat sink layer.
21. The method of claim 20 , further comprising coupling an additional lead frame with the second metallization layer formed on the heat sink layer.
22. The component array of claim 1 , wherein the component array has a power capacity greater than about 5 W.