Multilayer ceramic electronic component array

1. A multilayer ceramic electronic component array comprising:

a plurality of multilayer ceramic electronic components including a ceramic body including a dielectric layer and first and second internal electrodes stacked to be alternately exposed to first and second external surfaces of the ceramic body while having the dielectric layer interposed therebetween, and first and second external electrodes disposed on the first and second external surfaces of the ceramic body so as to be electrically connected to the first and second internal electrodes, respectively; and

an interposer including an insulating body disposed below the plurality of multilayer ceramic electronic components, a first terminal electrode disposed on the insulating body and electrically connected to at least a portion of the first external electrodes of the plurality of multilayer ceramic electronic components, and a second terminal electrode disposed on the insulating body and electrically connected to at least a portion of the second external electrodes of the plurality of multilayer ceramic electronic components,

wherein the at least a portion of the first external electrodes of the plurality of multilayer ceramic electronic components are in electrical contact with each other,

the at least a portion of the second external electrodes of the plurality of multilayer ceramic electronic components are in electrical contact with each other, and

the first and second terminal electrodes, each being one-piece, include first and second grooves, respectively, positioned between the plurality of multilayer ceramic electronic components on an upper surface of the insulating body.

2. The multilayer ceramic electronic component array of claim 1 , further comprising an insulating member disposed between adjacent ones of the plurality of multilayer ceramic electronic components and in contact with the ceramic body of each of the adjacent multilayer ceramic electronic components and being more flexible than the dielectric layer.

3. The multilayer ceramic electronic component array of claim 2 , wherein the insulating member includes an epoxy.

4. The multilayer ceramic electronic component array of claim 3 , wherein the first internal electrodes of the plurality of multilayer ceramic electronic components are disposed to be in parallel to each other, and

the second internal electrodes of the plurality of multilayer ceramic electronic components are disposed to be in parallel to each other.

5. The multilayer ceramic electronic component array of claim 4 , wherein the first and second internal electrodes are disposed to be parallel to a mounting surface of the interposer.

6. The multilayer ceramic electronic component array of claim 4 , wherein the first and second internal electrodes are disposed to be perpendicular to a mounting surface of the interposer.

7. The multilayer ceramic electronic component array of claim 4 , wherein the first and second terminal electrodes include first and second recessed regions positioned on end surfaces of the insulating body in a length direction thereof.

8. A multilayer ceramic electronic component array comprising:

a plurality of multilayer ceramic electronic components including a ceramic body including a dielectric layer and first and second internal electrodes stacked to be alternately exposed to first and second external surfaces of the ceramic body while having the dielectric layer interposed therebetween, and first and second external electrodes disposed on the first and second external surfaces of the ceramic body so as to be electrically connected to the first and second internal electrodes, respectively;

an interposer including an insulating body disposed below the plurality of multilayer ceramic electronic components, a first terminal electrode disposed on the insulating body and electrically connected to at least a portion of the respective first external electrodes of the plurality of multilayer ceramic electronic components, and a second terminal electrode disposed on the insulating body and electrically connected to at least a portion of the respective second external electrodes of the plurality of multilayer ceramic electronic components; and

an insulating member disposed between adjacent ones of the plurality of multilayer ceramic electronic components and in contact with the ceramic body of each of the adjacent multilayer ceramic electronic components and being more flexible than the dielectric layer,

the first and second terminal electrodes, each being one-piece, include first and second grooves, respectively, positioned between the plurality of multilayer ceramic electronic components on an upper surface of the insulating body.

9. The multilayer ceramic electronic component array of claim 8 , further comprising:

a first solder which is in contact with the first terminal electrode and having at least a portion positioned between the respective first external electrodes of the plurality of multilayer ceramic electronic components; and

a second solder which is in contact with the second terminal electrode and having at least a portion positioned between the respective second external electrodes of the plurality of multilayer ceramic electronic components.

10. The multilayer ceramic electronic component array of claim 9 , wherein the first insulating member and the first and second solders are in contact with each other between the plurality of multilayer ceramic electronic components.

11. The multilayer ceramic electronic component array of claim 8 , wherein the insulating member includes an epoxy.

12. The multilayer ceramic electronic component array of claim 8 , wherein the first and second internal electrodes are disposed to be parallel to a mounting surface of the interposer.

13. The multilayer ceramic electronic component array of claim 8 , wherein the first and second internal electrodes are disposed to be perpendicular to a mounting surface of the interposer.