IP Library › Granted Patent US 12,408,260
Granted Patent B2
US 12,408,260 · App. 18/333,568 · Granted Sep 2, 2025

Network communication device having electromagnetic shielding function

Inventors: Yujian Hou (Jiangsu, CN); Liang Li (Jiangsu, CN); Tianjiao Huang (Jiangsu, CN)
Assignee: Sercomm Corporation
H05K1/0224H05K1/0203H05K1/023H05K2201/10098H05K2201/10734H05K2201/10984
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Quick Facts
Patent No.
US 12,408,260
App. No.
18/333,568
Granted
Sep 2, 2025
Kind
B2
Abstract

A network communication device has a circuit board, a network communication chip, an antenna, and a metal cover. The circuit board has a first surface and a second surface opposite to each other. An interior of the circuit board has a ground layer. An edge of the first surface has a ground ring. The ground ring surrounds the first surface and is electrically connected to the ground layer. The network communication chip is disposed on the first surface. The antenna is electrically connected to the circuit board. The metal cover has an annular support rib. The circuit board is disposed on the annular support rib with the first surface facing the metal cover. The ground ring is in physical contact with and electrically connected to the annular support rib.

Claims (16)

1. A network communication device, comprising:

a circuit board having a first surface and a second surface opposite to each other, wherein an interior of the circuit board has a ground layer, an edge of the first surface has a ground ring, and the ground ring surrounds the first surface and is electrically connected to the ground layer;

a network communication chip disposed on the first surface;

an antenna electrically connected to the circuit board;

a first metal cover having an annular support rib, wherein the circuit board is disposed on the annular support rib with the first surface facing the first metal cover, and the ground ring is in physical contact with and electrically connected to the annular support rib; and

an electromagnetic wave shielding cover disposed on the first surface and covering the network communication chip, the first metal cover further has a heat dissipation portion in thermal contact with the electromagnetic wave shielding cover.

2. The network communication device according to claim 1 , wherein the first metal cover further has a retaining wall, and the annular support rib and a contact surface of the ground ring are shielded by the retaining wall when viewed along a direction parallel to the first surface.

3. The network communication device according to claim 1 , further comprising a plurality of solder balls arranged in a staggered manner on the ground ring and connected to the ground ring.

4. The network communication device according to claim 3 , wherein diameters of the plurality of solder balls respectively range from 11 mils to 13 mils, and spacings between the plurality of solder balls respectively range from 9 mils to 11 mils.

5. The network communication device according to claim 1 , wherein the first metal cover further has a heat dissipation portion in thermal contact with the network communication chip.

6. The network communication device according to claim 1 , further comprising a second metal cover assembled with the first metal cover, wherein the circuit board is disposed between the first metal cover and the second metal cover, and the antenna is positioned outside the first metal cover and the second metal cover.

7. The network communication device according to claim 6 , wherein the first metal cover and the second metal cover are entirely made of metal.

8. The network communication device according to claim 1 , wherein the ground layer is electrically connected to the ground ring through a plurality of plated through holes.

9. The network communication device according to claim 1 , wherein the circuit board further comprises a connection port, and a metal shell of the connection port is in physical contact with and electrically connected to the annular support rib.

10. The network communication device according to claim 1 , wherein the first surface also has a bare metal layer, the heat dissipation portion is in thermal contact with the bare metal layer, and the bare metal layer is electrically connected to the ground layer.

11. The network communication device according to claim 1 , wherein a width of the ground ring is greater than or equal to 1.5 mm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 14, 2023
From: HOU, YUJIAN; LI, LIANG; HUANG, TIANJIAO
To: SERCOMM CORPORATION
Reel/Frame 063954/0250 →
Priority Claims (1)
CN 202210682091.6 · Jun 16, 2022 · national
Continuity (1)
Related Publication 20230413419A1 · Dec 21, 2023
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