Granted Patent B2

US 12,327,862 · App. 18/334,552 · Granted Jun 10, 2025

Inventors: Yukun Wu (Ningde, CN); Xiaoming Ge (Ningde, CN)

Assignee: CONTEMPORARY AMPEREX TECHNOLOGY (HONG KONG) LIMITED

H01M4/139C25D3/38C25D5/20C30B7/12C30B30/06H01M4/0404H01M4/0452H01M4/661

Abstract

Claims (25)

1. A method for preparing an electrolytic copper foil, comprising:

placing an anode and a cathode to be plated in a twin crystal growth agent containing electroplating solution in an electroplating tank, wherein the twin crystal growth agent comprises one or two of a gelatin and polyethyleneimine; and

under conditions that the electroplating solution is provided with randomly alternating transitions of one or two of an ultrasonic wave at a frequency f11 and an ultrasonic wave at a frequency f12 and one or two of an ultrasonic wave at a frequency f21 and an ultrasonic wave at a frequency f22, performing direct current electroplating to obtain the electrolytic copper foil, wherein 40 kHz<f11≤100 kHz, 15 kHz<f12≤40 kHz, 0 kHz<f21≤15 kHz, and f22=0 kHz;

wherein during the electroplating to obtain the electrolytic copper foil:

a percentage of a total time for electroplating under conditions of the ultrasonic wave at the frequency f11 and the ultrasonic wave at the frequency f12 is 70%-90%, and a percentage of a total time for electroplating under conditions of the ultrasonic wave at the frequency f21 and the ultrasonic wave at the frequency f22 is 10%-30%; and

a number of ultrasonic transitions is 2 or more, and a number of ultrasonic transitions per minute is less than or equal to 25.

2. The method according to claim 1 , wherein during the electroplating to obtain the electrolytic copper foil:

the percentage of the total time for electroplating under conditions of the ultrasonic wave at the frequency f11 and the ultrasonic wave at the frequency f12 75%-85%, and the percentage of the total time for electroplating under conditions of the ultrasonic wave at the frequency f21 and the ultrasonic wave at the frequency f22 15%-25%.

3. The method according to claim 1 , wherein during the electroplating to obtain the electrolytic copper foil:

a percentage of a time for electroplating under conditions of the ultrasonic wave at the frequency f11 is 40%-90%; and/or

a percentage of a time for electroplating under conditions of the ultrasonic wave at the frequency f12 is 0-50%; and/or

a percentage of a time for electroplating under conditions of the ultrasonic wave at the frequency f21 is 0-30%; and/or

a percentage of a time for electroplating under conditions of the ultrasonic wave at the frequency f22 is 0-10%.

4. The method according to claim 1 , wherein the direct current electroplating is carried out at a current density of 2 A/dm 2 -80 A/dm 2 .

5. The method according to claim 1 , wherein;

the electroplating solution is a sulfuric acid-copper sulfate electroplating solution, and the electroplating solution further comprises copper ions, sulfuric acid, and chloride ions;

a concentration of the copper ions in the electroplating solution is 50 g/L-100 g/L;

a concentration of the sulfuric acid in the electroplating solution is 40 g/L-70 g/L;

a mass concentration of the chloride ions in the electroplating solution is 20 ppm-50 ppm;

a mass concentration of the twin crystal growth agent in the electroplating solution is 50 ppm-110 ppm.

6. The method according to claim 1 , wherein:

the electroplating solution further comprises a leveling agent and a brightening agent;

the leveling agent comprises polypeptide protein, and the brightening agent comprises one or more of sodium polydithiodipropane sulfonate, and sodium 3-mercaptopropane sulfonate;

a concentration of the leveling agent in the electroplating solution is 20 ml/L-40 ml/L;

a concentration of the brightening agent in the electroplating solution is 10 ml/L-30 ml/L.

Assignments (2)

Priority Claims (1)

Continuity (2)

References Cited (39)