Electrolyzed copper foil and current collector of energy storage device
An electrolyzed copper foil and a current collector of an energy storage device are provided. The electrolyzed copper foil includes a transition layer and a nano-twin copper layer formed on the transition layer. The transition layer has an equiaxial grain of a (111) plane having a volume ratio of 20-40%, a (200) plane having a volume ratio of 20-40%, and a (220) plane having a volume ratio of 20-40%. A thickness of the transition layer is 0.2 μm to 1.5 μm. The nano-twin copper layer has a columnar grain of the (111) plane having a volume ratio of more than 85%, and a thickness of the nano-twin copper layer is 3 μm to 30 μm.
1. An electrolyzed copper foil, comprising:
a transition layer, wherein the transition layer has an equiaxial grain of a (111) plane having a volume ratio of 20-40%, a (200) plane having a volume ratio of 20-40%, and a (220) plane having a volume ratio of 20-40%, and a thickness of the transition layer is 0.2 μm to 1.5 μm; and
a nano-twin copper layer formed on the transition layer, wherein the nano-twin copper layer has a columnar grain of the (111) plane having a volume ratio of more than 85%, and a thickness of the nano-twin copper layer is 3 μm to 30 μm.
2. The electrolyzed copper foil of claim 1 , wherein the electrolyzed copper foil has a tensile strength greater than 50 kg/mm 2 at room temperature.
3. The electrolyzed copper foil of claim 1 , wherein the electrolyzed copper foil has a tensile strength greater than 32 kg/mm 2 at 0.5% elongation.
4. The electrolyzed copper foil of claim 1 , wherein the electrolyzed copper foil has a yield strength greater than 40 kg/mm 2 at 0.5% elongation.
5. The electrolyzed copper foil of claim 1 , wherein the electrolytic copper foil has a tensile strength reduction of no more than 20% after a heat treatment at 350° C. for one hour.
6. The electrolyzed copper foil of claim 1 , wherein after the electrolyzed copper foil is subjected to a heat treatment at 350° C. for one hour, a change amount in a volume ratio of the (111) plane in the nano-twin copper layer is less than 5%.
7. The electrolyzed copper foil of claim 1 , wherein the columnar grain is consisted of a plurality of plate-shaped structures stacked perpendicular to grain boundaries of the columnar grain, and a length ratio of a major axis to a minor axis of each of the plate-shaped structures is 2 to 40.
8. The electrolyzed copper foil of claim 1 , wherein the electrolyzed copper foil has a surface roughness Rz (JIS) less than 2 μm.
9. The electrolyzed copper foil of claim 1 , wherein the electrolyzed copper foil has a conductivity higher than 90% IACS.
10. A current collector of an energy storage device comprising the electrolyzed copper foil of claim 1 .