Electrical busway assemblies and methods of assembling same
An electrical busway assembly is provided. The electrical busway assembly includes a plurality of busbars having a length direction. Each busbar includes a conductor and a busbar insulator coating the conductor. The busway assembly further includes a bonding agent positioned between the plurality of busbars and bonding the plurality of busbars in the length direction. The bonding agent is configured to withstand an electromagnetic force caused by a current flowing through the plurality of busbars during a short circuit condition in the plurality of busbars. The plurality of busbars are coupled with one another without mechanical fasteners, and the busway assembly has a voltage rating in a low voltage range of 1000 Volts (V) or lower.
1 . A busway assembly, comprising:
a plurality of busbars having a length direction, each busbar separated from adjacent busbars by a space, each busbar comprising:
a conductor; and
a busbar insulator coating the conductor;
the busway assembly further comprising:
a bonding agent bonded to the respective busbar insulator of at least one of the adjacent bus bars, the bonding agent positioned in the space between the adjacent busbars and configured to bond the adjacent bus bars of the plurality of busbars, the bonding agent comprising:
an adhesive; and
a plurality of particles having a dimension equal to or smaller than a spacing between the plurality of bus bars, wherein:
the plurality of particles are 40%-60% of the bonding agent by volume,
the bonding agent is configured to withstand an electromagnetic force caused by a current flowing through the plurality of busbars during a short circuit condition in the plurality of busbars, and
the plurality of busbars are coupled with one another without mechanical fasteners, and the busway assembly has a voltage rating in a low voltage range of 1000 Volts (V) or lower.
2 . The busway assembly of claim 1 , wherein the adhesive is fabricated with the same material as the busbar insulator.
3 . The busway assembly of claim 1 , wherein the adhesive has a thickness of 0.1-1 millimeter (mm), and the busway assembly is rated at 6000 Ampere (A) or lower.
4 . The busway assembly of claim 1 , wherein the adhesive comprises polyurethane and/or a double-sided adhesive tape.
5 . The busway assembly of claim 1 , wherein the bonding agent encapsulates the plurality of busbars along the length direction.
6 . The busway assembly of claim 5 , wherein the bonding agent is organic.
7 . The busway assembly of claim 5 , wherein the bonding agent comprises a thermoset material.
8 . The busway assembly of claim 5 , wherein the bonding agent comprises a thermoplastic material.
9 . The busway assembly of claim 5 , wherein the bonding agent comprises polyester, epoxy, a bulk molding compound, and/or a phenolic.
10 . The busway assembly of claim 5 , wherein the particles have a thermal conductivity of 0.5 W/m·K or higher.
11 . The busway assembly of claim 5 , wherein the particles are 90% of the bonding agent by weight.
12 . A method of assembling a busway assembly, comprising:
providing a plurality of busbars having a length direction, each busbar including:
a conductor; and
a busbar insulator coating the conductor; and
bonding the plurality of busbars in the length direction via a bonding agent by:
positioning the bonding agent between the plurality of busbars,
wherein the bonding agent comprises:
an adhesive;
a plurality of particles having a dimension equal to or smaller than a spacing between the plurality of bus bars, wherein:
the plurality of particles are collectively 40%-60% of the bonding agent by volume, and
the bonding agent is configured to withstand an electromagnetic force caused by a current flowing through the plurality of busbars during a short circuit condition in the plurality of busbars, and
the plurality of busbars are coupled with one another without mechanical fasteners, and the busway assembly has a voltage rating in a low voltage range of 1000 Volts (V) or lower.
13 . The method of claim 12 , wherein bonding the plurality of busbars further comprises:
partially curing the plurality of busbars;
assembling the plurality of busbars by positioning the bonding agent between the plurality of busbars; and
curing the assembled plurality of busbars.
14 . The method of claim 12 , wherein bonding the plurality of busbars further comprises:
encapsulating the plurality of busbars with the bonding agent.
15 . The method of claim 14 , wherein encapsulating the plurality of busbars further comprises:
providing a mold;
positioning the plurality of busbars in the mold; and
introducing the bonding agent into the mold.
16 . The method of claim 12 , wherein bonding the plurality of busbars further comprises:
curing the plurality of busbars.
17 . The method of claim 12 , further comprising:
analyzing a peak electromagnetic force caused by a current flowing through the plurality of busbars at a short current rating of the busway assembly; and
selecting the bonding agent based on the peak electromagnetic force.
18 . A busway assembly, comprising:
a plurality of busbars having a length direction, each busbar separated from adjacent busbars by a space, each busbar comprising:
a conductor; and
a busbar insulator coating the conductor;
the busway assembly further comprising:
a bonding agent bonded to the respective busbar insulator of at least one of the adjacent bus bars, the bonding agent positioned in the space between the adjacent busbars and configured to bond the adjacent bus bars of the plurality of busbars, the bonding agent comprising:
an adhesive; and
a plurality of particles having a dimension equal to or smaller than a spacing between the plurality of bus bars, wherein the plurality of particles are 40%-60% of the bonding agent by volume.
19 . The busway assembly of claim 18 , wherein the particles are 90% of the bonding agent by weight.