Heat radiation structure and electronic apparatus
A heat radiation structure includes a vapor chamber provided along a surface of a die, a mesh interposed between the die and the vapor chamber, and a liquid metal impregnated in the mesh. In the mesh, a peripheral portion has a higher material density per unit volume than a central portion. In the mesh, the central portion may be formed of a single layer, and the peripheral portion is formed of two layers. The mesh may be a resin material.
1 . A heat radiation structure of an electric component that generates heat, the heat radiation structure comprising:
a heat radiation element along a surface of the electric component;
a porous material between the electric component and the heat radiation element; and
a liquid metal impregnated in the porous material,
wherein, in the porous material, a peripheral portion has a higher material density per unit volume than a central portion.
2 . The heat radiation structure according to claim 1 ,
wherein the porous material is a mesh.
3 . The heat radiation structure according to claim 2 ,
wherein, in the mesh, the central portion is formed of a single layer, and the peripheral portion is formed of a plurality of layers.
4 . The heat radiation structure according to claim 3 ,
wherein a material of the mesh that is folded back at an edge portion of the mesh is the peripheral portion.
5 . The heat radiation structure according to claim 2 ,
wherein the mesh is a resin material.
6 . The heat radiation structure according to claim 1 , further comprising:
a board; and
a semiconductor chip mounted on the board,
wherein the semiconductor chip includes a substrate and a die, and
the electric component is the die.
7 . The heat radiation structure according to claim 6 ,
wherein a surface of the die has a shape in which a central portion thereof is raised from a periphery thereof.
8 . An electronic apparatus comprising:
an electric component that generates heat;
a heat radiation element along a surface of the electric component;
a porous material between the electric component and the heat radiation element; and
a liquid metal impregnated in the porous material,
wherein, in the porous material, a peripheral portion has a higher material density per unit volume than a central portion.