Granted Patent B2

US 12,573,362 · App. 18/339,573 · Granted Mar 10, 2026

Inventor: Carl Hansen (Carlisle, MA)

Assignee: Hansen Electronic Architecture and Design, LLC

G10K11/002H04R1/288H04R29/001H04R2201/003

Abstract

Claims (16)

1 . An acoustic attenuation enclosure comprising:

a plurality of panels connectable to define a first boundary of the acoustic attenuation enclosure housing an electroacoustic transducer converting an electrical audio signal propagated in an external environment, wherein the acoustic attenuation enclosure substantially maintains a first acoustics therein regardless of acoustics of the external environment,

wherein each panel defines one side of the acoustic attenuation enclosure, and

wherein the acoustic attenuation enclosure is modular whereby the plurality of panels is selectively connectable to define a second boundary of the acoustic attenuation enclosure having a second acoustics therein.

2 . The acoustic attenuation enclosure of claim 1 , further comprising a sensor array embedded in at least one panel of the plurality of panels so that the sensor array does not protrude into the acoustic attenuation enclosure.

3 . The acoustic attenuation enclosure of claim 2 , wherein the sensor array comprises a microelectromechanical system transducer.

4 . The acoustic attenuation enclosure of claim 3 , further comprising a heat removal device through at least one panel of the plurality of panels.

5 . The acoustic attenuation enclosure of claim 4 , further comprising an input/output connection through at least one panel of the plurality of panels, wherein the input/output connection electrically couples the electroacoustic transducer with an instrument in the external environment.

6 . The acoustic attenuation enclosure of claim 5 , further comprising an adjunct sound cavity directly connected to an exterior surface of one of the panels of the plurality of panels, wherein the adjunct sound cavity provides a microphone.

7 . The acoustic attenuation enclosure of claim 5 , further comprising a mounting port passing through one of the panels of the plurality of panels, wherein a microphone is mounted within the acoustic attenuation enclosure by way of the mounting port.

8 . A method of processing an acoustic energy, the method comprising:

providing an electroacoustic transducer within the acoustic attenuation enclosure of claim 3 ;

sensing the acoustic energy through the sensor array; and

processing the acoustic energy to neutralize non-ideal acoustic characteristics within said acoustic attenuation enclosure.

9 . The acoustic attenuation enclosure of claim 1 , further comprising, for each panel, a latch mechanism for removably attaching to an adjacent panel of the plurality of panels so that the first boundary is reconfigurable into the second boundary.

10 . The acoustic attenuation enclosure of claim 1 , further comprising an amplifier housed in the acoustic attenuation enclosure.

Assignments (1)

Continuity (2)

References Cited (35)